Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

Modification of the validity date: now put at 2007.

Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 31: Inflammabilité des dispositifs à encapsulation plastique (cas d'une cause interne d'inflammation)

Modification de la date de validité : fixée maintenant à 2007.

General Information

Status
Published
Publication Date
12-Aug-2003
ICS
31.080.01 - Semiconductor devices in general
Technical Committee
TC 47 - Semiconductor devices
Current Stage
PPUB - Publication issued
Start Date
13-Aug-2003
Completion Date
31-Aug-2003

Relations

Corrects
IEC 60749-31:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
Effective Date
05-Sep-2023

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IEC 60749-31:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) Released:8/13/2003 - Page 1 previewIEC 60749-31:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) Released:8/13/2003 - Page 2 previewIEC 60749-31:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) Released:8/13/2003 - Page 3 previewIEC 60749-31:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) Released:8/13/2003 - Page 4 preview
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IEC 60749-31:2002/COR1:2003 - Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) Released:8/13/2003

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Frequently Asked Questions

IEC 60749-31:2002/COR1:2003 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)". This standard covers: Modification of the validity date: now put at 2007.

Modification of the validity date: now put at 2007.

IEC 60749-31:2002/COR1:2003 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.

IEC 60749-31:2002/COR1:2003 has the following relationships with other standards: It is inter standard links to IEC 60749-31:2002. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

IEC 60749-31:2002/COR1:2003 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


CEI 60749-31 IEC 60749-31
(Première édition – 2002) (First edition – 2002)
DISPOSITIFS À SEMICONDUCTEURS – SEMICONDUCTOR DEVICES –
MÉTHODES D'ESSAIS MÉCANIQUES MECHANICAL AND CLIMATIC TEST METHODS –
ET CLIMATIQUES –
Partie 31: Inflammabilité des dispositifs à Part 31: Flammability of plastic-encapsulated
encapsulation plastique (cas d'une cause interne devices (internally induced)
d'inflammation)
CORRIGENDUM 1
Page 4 Page 5
Au lieu de: Instead of:
Le c
...

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