IEC TR 62878-2-7:2019

IEC TR 62878-2-7 ®
Edition 1.0 2019-03
TECHNICAL
REPORT
colour
inside
Device embedding assembly technology
Part 2-7: Guidelines – Accelerated stress testing of passive embedded circuit
boards
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IEC TR 62878-2-7 ®
Edition 1.0 2019-03
TECHNICAL
REPORT
colour
inside
Device embedding assembly technology

Part 2-7: Guidelines – Accelerated stress testing of passive embedded circuit

boards
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-6680-9

– 2 – IEC TR 62878-2-7:2019  IEC 2019
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Overview of accelerated stress testing of passive embedded circuit boards . 5
4.1 Testing under combined stresses . 5
4.2 Test coupon design . 6
5 Test procedure . 8
5.1 General . 8
5.2 Setting test temperature . 8
5.3 Placement of samples on bending tester . 8
5.4 Imposing combined stresses . 9
5.5 Evaluation of results . 9
6 Results . 10
Annex A (informative) Test coupon design rule . 11
Annex B (informative) Bending testing . 12

Figure 1 – Testing principal . 6
Figure 2 – Embedded circuit board panel with test coupons . 6
Figure 3 – Test coupon structure . 7
Figure 4 – Opened and closed sample jig . 8
Figure 5 – Bending of test coupons . 9
Figure 6 – Output voltage . 10
Figure 7 – Cross section of sample after testing . 10
Figure 8 – Cross section of failed sample . 10
Figure B.1 – Bending tester in the chamber . 12

Table 1 – Design information for test coupon . 7
Table 2 – Stack-up information for test coupon . 7
Table 3 – Coupon testing results . 10
Table A.1 – Test coupon design rules . 11

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY

Part 2-7: Guidelines – Accelerated stress testing of
passive embedded circuit boards

FOREWORD
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IEC TR 62878-2-7, which is a technical report, has been prepared by IEC technical committee
91: Electronics assembly technology.

– 4 – IEC TR 62878-2-
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