IEC 60749-40:2011

IEC 60749-40 ®
Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 40: Board level drop test method using a strain gauge

Dispositifs à semiconducteurs – Méthodes d'essais climatiques et mécaniques –
Partie 40: Méthode d’essai de chute au niveau de la carte avec utilisation d’une
jauge de contrainte
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IEC 60749-40 ®
Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 40: Board level drop test method using a strain gauge

Dispositifs à semiconducteurs – Méthodes d'essais climatiques et mécaniques –
Partie 40: Méthode d’essai de chute au niveau de la carte avec utilisation d’une
jauge de contrainte
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX S
ICS 31.080.01 ISBN 978-2-88912-583-8

– 2– 60749-40  IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test equipment . 6
5 Test procedure . 6
5.1 Test specimen . 6
5.2 Test substrate . 6
5.3 Solder paste . 6
5.4 Mounting method . 7
5.5 Pre-conditionings . 7
5.6 Initial measurements . 7
5.7 Intermediate measurement . 7
5.8 Final measurement . 7
6 Test method . 7
6.1 Purpose of test method . 7
6.2 Example of drop test equipment . 7
6.3 Example of substrate-securing jig . 8
6.4 Example of distance between supporting points . 8
6.5 Example of impacting surface . 8
6.6 Strain gauge . 8
6.7 Strain gauge attachment . 8
6.8 Strain measurement instrument . 9
6.9 Test condition . 10
6.9.1 Drop test conditions . 10
6.9.2 Test procedure . 10
6.9.3 Drop height. 11
6.9.4 Pre-test characterization . 11
6.9.5 Direction . 13
6.9.6 Number of drops . 13
7 Summary . 13
Annex A (normative) Drop impact test method using test rod . 15
Annex B (informative) An example of strain gauge attachment procedure . 18

Figure 1 – Example of drop test equipment and substrate securing jig . 9
Figure 2 – Position of strain gauge attachment . 10
Figure 3 – Strain measurement instrument . 11
Figure 4 – Waveform of strain and electrical conductivity of daisy chain . 11
Figure 5a – Number of times of drop to failure . 13
Figure 5b – Pulse duration . 13
Figure 5 – Correlation strain and number of failures and strain and pulse duration . 13
Figure 6 – Correlation between pulse duration and distance between supporting points . 13
Figure 7 – Correlation between the number of times of failure and the maximum strain. 14
Figure 8 – Direction of dropping . 14

60749-40  IEC:2011 – 3 –
Figure A.1 – Outline of test apparatus . 16
Figure A.2 – Waveform of strain and electrical conductivity of a daisy chain . 18
Figure B.1 – Equipment and materials . 19
Figure B.2 – Example of Attaching Strain Gauge and Guide Mark Dimensions . 20
Figure B.3 – Strain gauge attachment procedure, part 1 . 21
Figure B.4 – Strain gauge attachment procedure, part 2 . 22

– 4– 60749-40  IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 40: Board level drop test method using a strain gauge

FOREWORD
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