IEC 60194-2:2017

IEC 60194-2 ®
Edition 1.0 2017-12
INTERNATIONAL
STANDARD
colour
inside
Printed boards design, manufacture and assembly – Vocabulary –
Part 2: Common usage in electronic technologies as well as printed board and
electronic assembly technologies
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 20 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

IEC publications search - www.iec.ch/searchpub IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 65 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

CISPR.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: csc@iec.ch.
IEC 60194-2 ®
Edition 1.0 2017-12
INTERNATIONAL
STANDARD
colour
inside
Printed boards design, manufacture and assembly – Vocabulary –

Part 2: Common usage in electronic technologies as well as printed board and

electronic assembly technologies

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-5133-1

– 2 – IEC 60194-2:2017 © IEC 2017
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
3.1 A . 5
3.2 B . 8
3.3 C . 11
3.4 D . 17
3.5 E . 19
3.6 F . 20
3.7 G . 22
3.8 H . 23
3.9 I . 24
3.10 J . 25
3.11 K . 25
3.12 L . 25
3.13 M . 28
3.14 N . 30
3.15 O . 30
3.16 P . 30
3.17 Q . 34
3.18 R . 35
3.19 S . 37
3.20 T . 40
3.21 U . 41
3.22 V . 42
3.23 W . 42
3.24 Z . 43
Bibliography . 44

Figure 1 – Ball grid array (BGA) . 9
Figure 2 – Bumped die . 11
Figure 3 – Chip on board (COB) . 13
Figure 4 – Flip chip . 22
Figure 5 – Histogram . 23
Figure 6 – Leaded surface-mount component – Gull wing-shaped lead . 26
Figure 7 – Passive array . 31
Figure 8 – Pin grid array . 32

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS DESIGN, MANUFACTURE
AND ASSEMBLY – VOCABULARY –
Part 2: Common usage in electronic technologies as well
as printed board and electronic assembly technologies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60194-2 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This
edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to
IEC 60194:2015:
a) exclusion of 32 general terms better served by other TCs;
b) exclusion of 47 terms no longer used by the electronics assembly industry;
c) inclusion of 13 new terms related with device embedded substrate technology;
d) removal of identification codes for terms as well as annexes.

– 4 – IEC 60194-2:2017 © IEC 2017
The text of this International Standard is based on the following documents:
CDV Report on voting
91/1442/CDV 91/1473/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
PRINTED BOARDS DESIGN, MANUFACTURE
AND ASSEMBLY – VOCABULARY –
Part 2: Common usage in electronic technologies as well
as printed board and electronic assembly technologies

1 Scope
This part of IEC 60194 covers terms and definitions related to printed board and electronic
assembly technologies as well as other electronic technologies.
2 Normative references
There are no normative references in this document.
3 Terms and definitions
For the purposes of electronics assembly technology, the terms and definitions in 3.1 to 3.24
apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
...