IEC 60749-42:2014

IEC 60749-42 ®
Edition 1.0 2014-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 42: Temperature and humidity storage

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 42: Stockage de température et d'humidité

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing more than 30 000 terms and
Technical Specifications, Technical Reports and other definitions in English and French, with equivalent terms in 14
documents. Available for PC, Mac OS, Android Tablets and additional languages. Also known as the International
iPad. Electrotechnical Vocabulary (IEV) online.

IEC publications search - www.iec.ch/searchpub IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a More than 55 000 electrotechnical terminology entries in
variety of criteria (reference number, text, technical English and French extracted from the Terms and Definitions
committee,…). It also gives information on projects, replaced clause of IEC publications issued since 2002. Some entries
and withdrawn publications. have been collected from earlier publications of IEC TC 37,

77, 86 and CISPR.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: csc@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Catalogue IEC - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
Application autonome pour consulter tous les renseignements
Le premier dictionnaire en ligne de termes électroniques et
bibliographiques sur les Normes internationales,
électriques. Il contient plus de 30 000 termes et définitions en
Spécifications techniques, Rapports techniques et autres
anglais et en français, ainsi que les termes équivalents dans
documents de l'IEC. Disponible pour PC, Mac OS, tablettes
14 langues additionnelles. Egalement appelé Vocabulaire
Android et iPad.
Electrotechnique International (IEV) en ligne.

Recherche de publications IEC - www.iec.ch/searchpub
Glossaire IEC - std.iec.ch/glossary
Plus de 55 000 entrées terminologiques électrotechniques, en
La recherche avancée permet de trouver des publications IEC
en utilisant différents critères (numéro de référence, texte, anglais et en français, extraites des articles Termes et
comité d’études,…). Elle donne aussi des informations sur les Définitions des publications IEC parues depuis 2002. Plus
projets et les publications remplacées ou retirées. certaines entrées antérieures extraites des publications des

CE 37, 77, 86 et CISPR de l'IEC.
IEC Just Published - webstore.iec.ch/justpublished

Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications IEC. Just
Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur cette
Disponible en ligne et aussi une fois par mois par email. publication ou si vous avez des questions contactez-nous:
csc@iec.ch.
IEC 60749-42 ®
Edition 1.0 2014-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –

Part 42: Temperature and humidity storage

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –

Partie 42: Stockage de température et d'humidité

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX H
ICS 31.080.01 ISBN 978-2-8322-1785-6

– 2 – IEC 60749-42:2014 © IEC 2014
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Test equipment . 5
3.1 Capacity of the equipment . 5
3.2 Materials and construction of the thermostatic/humidistatic chamber . 5
3.3 Water to be used in the test . 5
4 Procedure . 5
4.1 Preconditioning . 5
4.2 Initial measurements . 6
4.3 Tests . 6
4.3.1 Inserting and removing specimens . 6
4.3.2 Test conditions . 6
4.3.3 Test duration . 6
4.3.4 Post treatment . 7
4.3.5 End-point measurement . 7
5 Failure criteria . 7
6 Information to be given in applicable procurement document . 8

Figure 1 – Unsaturated pressurized vapour test conditions profile. 7

Table 1 – Temperature and humidity storage test conditions . 6

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 42: Temperature and humidity storage

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-42 has been prepared by IEC technical committee 47:
Semiconductor devices.
This first edition is based on Japan Electronics and Information Technology Industries
Association, EIAJ ED-4701/100, Environmental and endurance test methods for
semiconductor devices, test method 103. It is used with permission of the copyright holder,
Japan Electronics and Information Technology Industries Association (JEITA).

– 4 – IEC 60749-42:2014 © IEC 2014
The text of this standard is based on the following documents:
FDIS Report on voting
47/2200/FDIS 47/2204/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 42: Temperature and humidity storage

1 Scope
This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor
devices used in high temperature and high humidity environments.
This test method is used to evaluate the endurance against corrosion of the metallic
interconnection of chips of semiconductor devices contained in plastic moulded and other
types of packages. It is also used as a means of accelerating the leakage phenomena due to
the moisture penetration through the passivation film and as a pre-conditioning for various
kinds of tests.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20:
Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering
heat
3 Test equipment
3.1 Capacity of the equipment
The chamber to be used in this test shall be capable of maintaining the test temperature and
humidity conditions specified in 4.3 throughout the test duration.
3.2 Materials and construction of the thermostatic/humidistatic chamber
The chamber shall be made of materials that do not deteriorate under high humidity
conditions. The design of the chamber shall prevent water condensed on the ceiling of the
chamber from dropping on the specimen.
3.3 Water to be used in the test
Water to be used in the tests shall be distilled water or deionised water, with a resistivity of
500 Ωm or more at 23 °C.
4 Procedure
4.1 Preconditioning
When the specimen is a plastic-moulded SMD, the moisture soaking and soldering heat stress
treatment specified in IEC 60749-20 shall be carried out before executing this test.

– 6 – IEC 60749-42:2014 © IEC 2014
4.2 Initial measurements
The initial measurements shall be carried out in accordance with the applicable procurement
document.
4.3 Tests
4.3.1 Inserting and removing specimens
The specimens shall be placed in the chamber at the high temperature and high humidity
conditions required by the applicable procurement document. When putting the specimen in
and out of the chamber, care shall be taken to ensure that water droplets not to adhere to the
specimen and that the specimen does not come into contact with any condensed water.
NOTE When a SMD is to be mounted on a jig for evaluation, the relevant conditions (board materials, size of the
land, soldering method, flux cleaning, etc.) are specified in the applicable procurement document.
4.3.2 Test conditions
The temperature and humidity conditions shall be selected from Table 1. Unless otherwise
required by the applicable procurement document, condition C shall be used. Where
Conditions D, E, and F are specified, the temperature shall be controlled from the start to the
end of the test and the humidity shall be controlled between temperature ramp-up and
temperature ramp-down, in accordance with the profile of Figure 1, unless otherwise specified
in the applicable procurement document. Care should be taken because failure modes
consisting of short-circuits (leaks) between external leads through plating metal, that do not
occur in the field, may occur under condition C (temperature 85 °C, humidity 85 %), and
conditions D, E, and F (the unsaturated pressurized vapour test).
4.3.3 Test duration
The test duration shall be in accordance with Table 1, except when otherwise specified in the
applicable procurement document. In this case, acceleration and diffusion models that
estimate moisture exposure duration in the use conditions shall be documented and added to
the procurement document. Under conditions D, E, and F, the time count shall be started
when the vapour pressure and temperature stabilise as shown in Figure 1.
Table 1 – Temperature and humidity storage test conditions
a
Test condition Temperature Humidity Test duration Vapor pressure
°C % h Pa
+168
A
40 ± 2 90 ± 5 8 000 7,4 × 10
−24
+168
B 60 ± 2 90 ± 5 4 000 1,9 × 10
−24
+168
C 85 ± 2 85 ± 5 5,0 × 10
1 000
−24
+8
D 110 ± 2 85 ± 5 264 1,2 × 10
+4
E 120 ± 2 85 ± 5 168 1,7 × 10
+2
F
130 ± 2 85 ± 5 96 2,3 × 10
a
Reference value
...