IEC 61760-2:2007

IEC 61760-2
Edition 2.0 2007-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology –
Part 2: Transportation and storage conditions of surface mounting devices
(SMD) – Application guide
Technique du montage en surface –
Partie 2: Conditions de transport et de stockage des composants pour montage
en surface (CMS) – Guide d’application

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IEC 61760-2
Edition 2.0 2007-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology –
Part 2: Transportation and storage conditions of surface mounting devices
(SMD) – Application guide
Technique du montage en surface –
Partie 2: Conditions de transport et de stockage des composants pour montage
en surface (CMS) – Guide d’application

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
J
CODE PRIX
ICS 31.240 ISBN 2-8318-9113-2
– 2 – 61760-2 © IEC:2007
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) –
Application guide
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
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Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61760-2 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 1998, and constitutes
a technical revision.
The main changes with regard to the previous edition concern:
The standard was updated and editorially revised. Specific reference is made to:
IEC/TS 61340-5-1 : Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements
___________
A new edition of this publication exists: IEC 61340-5-1.

61760-2 © IEC:2007 – 3 –
IEC/TR 61340-5-2: Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
For convenience of the reader, an informative Annex A was added, which contains information
about the climatic and mechanical conditions during transportation and storage (extracted
from IEC 60721-3-1 and IEC 60721-3-2).
This bilingual version, published in 2008-05, corresponds to the English version.
The text of this standard is based on the following documents:
CDV Report on voting
91/569/CDV 91/634/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 61760 series, under the general title Surface mounting
technology, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 4 – 61760-2 © IEC:2007
SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) –
Application guide
1 Scope and object
This International Standard describes the transportation and storage conditions for surface
mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of
surface mounting devices, both active and passive. (Conditions for printed boards are not
taken into consideration.)
The object of this standard is to ensure that users of SMDs receive and store products that
can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability.
Improper transportation and storage of SMDs may cause deterioration and result in assembly
problems such as poor solderability, delamination and ”popcorning”.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60286-3, Packaging of components for automatic handling – Part 3: Packaging of surface
mount components on continuous tapes
IEC 60286-4, Packaging of components for automatic handling – Part 4: Stick magazines for
electronic components encapsulated in packages of form E and G
IEC 60286-5, Packaging of components for automatic handling – Part 5: Matrix trays
IEC 60286-6, Packaging of components for automatic handling – Part 6: Bulk case packaging
for surface mounting components
IEC 60721-3-1, Classification of environmental conditions – Part 3: Classification of groups of
environmental parameters and their severities – Section 1: Storage
IEC 60721-3-2, Classification of environmental conditions – Part 3: Classification of groups of
environmental parameters and their severities – Section 2: Transportation
IEC 60749 (all parts), Semiconductor devices – Mechanical and climatic test methods
IEC/TS 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide

61760-2 © IEC:2007 – 5 –
3 General conditions
Surface mounting devices shall be packed in such a way that products are protected during
transportation and storage without loss of their properties arising from mechanical,
environmental and electrical influences. Packing requirements as defined in various IEC
publications, such as IEC 60286-3, IEC 60286-4, IEC 60286-5, IEC 60286-6, may contribute
to the protection of components during transportation and storage.
Usually, transportation conditions are less controlled than storage conditions. Nevertheless,
conditions shall be controlled and deviations from the advised conditions in this standard
should be reduced to as little time as possible.
4 Transportation conditions
4.1 General transportation conditions
During transportation, the SMDs, including their chosen style of tapes or stick magazines, etc.,
shall be protected against extreme temperature, humidity and mechanical forces. Unless
otherwise specified by the component supplier, the following environmental conditions shall
be met:
Climatic condition according to IEC 60721-3-2, class 2K2, except
– low air temperature: –40 °C,
– change of temperature air/air: –40 °C / +30 °C,
– low air pressure: 30 kPa,
– change of air pressure: 6 kPa/min.
Mechanical condition according to IEC 60721-3-2, class 2M1. Transportation shall be
managed in such a way that boxes are not deformed and forces are not directly passed on to
the inner packaging.
Total transportation time shall be as short as possible, but preferably not exceed 10 days.
(Total transportation time is time when products are not within controlled storage conditions.)
4.2 Specific transportation conditions
Depending on the sensitivi
...