IEC 60749-2:2002
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1 000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only. The contents of the corrigendum of August 2003 have been included in this copy.
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 2: Basse pression atmosphérique
Décrit l'essai de basse pression atmosphérique appliqué aux dispositifs à semiconducteurs. L'essai est essentiellement destiné à déterminer la capacité des éléments et des matériaux des composants à éviter les claquages provoqués par la rigidité diélectrique amoindrie de l'air et des autres matériaux isolants à des pressions réduites n'est applicable qu'aux dispositifs dont la tension de fonctionnement dépasse 1 000 V. Cet essai est applicable à tous les dispositifs à semiconducteurs qui sont installés dans des boîtiers pourvus de cavités internes. Cet essai est uniquement destiné aux applications militaires et spatiales. Le contenu du corrigendum d'août 2003 a été pris en considération dans cet exemplaire.
General Information
- Status
- Published
- Publication Date
- 11-Apr-2002
- Technical Committee
- TC 47 - Semiconductor devices
- Drafting Committee
- WG 2 - TC 47/WG 2
- Current Stage
- PPUB - Publication issued
- Start Date
- 31-May-2002
- Completion Date
- 12-Apr-2002
Relations
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
Overview
IEC 60749-2:2002 is an international standard published by the International Electrotechnical Commission (IEC) that defines the mechanical and climatic test methods focused on low air pressure effects on semiconductor devices. Specifically designed for military and space-related applications, this standard establishes a test procedure to evaluate semiconductor components operating above 1000 V, housed in cavity-type packages, against performance degradation caused by reduced atmospheric pressure.
Low air pressure testing simulates the harsh environments encountered in high-altitude aircraft and space vehicles where the dielectric strength of air and insulating materials drops, increasing the risk of voltage breakdown and corona discharge effects. The standard helps ensure the electrical and mechanical reliability of high-voltage semiconductor components under these conditions.
Key Topics
Scope and Applicability
- Tests are applicable exclusively to semiconductor devices with operating voltages exceeding 1000 V.
- Only relevant for devices in cavity-type packages used in military and aerospace environments.
Test Conditions
- Testing simulates atmospheric pressures from sea level down to high altitudes (up to 45,000 meters).
- Pressure conditions correlate to altitudes from 4,500 m to 45,000 m, with specific pressure levels defined in Pa.
- Ambient testing temperature is maintained at 25°C ± 10°C for at least 20 minutes before and during the test.
Test Apparatus
- A vacuum pump coupled with a sealed test chamber capable of maintaining reduced pressures.
- Equipment to allow visual observation of specimens.
- Pressure indicator for precise altitude simulation.
- Microammeter or oscilloscope to monitor electrical currents including corona discharge from DC to 30 MHz.
Test Procedure
- Specimens are subjected to voltage and monitored for current anomalies during pressure reduction and restoration.
- Observations focus on any corona effects, ionization, or voltage breakdown failures.
- Measurements ensure the specimens maintain electrical integrity under varied pressure conditions.
Technical Rationale
- Low air pressure leads to reduced dielectric strength of air, increasing corona discharge risks.
- Changes in insulating material properties and heat dissipation under thin air conditions may impact device performance.
Applications
IEC 60749-2:2002 is essential for organizations and engineers involved in:
- Military avionics and aerospace systems design, where semiconductors experience extreme altitudes and reduced atmospheric pressure.
- Spacecraft and satellite electronics manufacturing, ensuring devices tolerate vacuum and near-vacuum environments.
- Qualification and reliability testing of high-voltage semiconductor devices in critical safety applications.
- Development of semiconductor products requiring certification for high-altitude or space environments, contributing to improved mission reliability.
By implementing this standard, manufacturers can avoid costly failures linked to corona discharge and voltage breakdown during high-altitude operation, delivering safer and more robust semiconductor components.
Related Standards
- IEC 60068-2-13: Environmental testing - Part 2: Tests - Test M: Low air pressure, general environmental test procedures for low air pressure which IEC 60749-2 references and extends for semiconductors.
- IEC 60749 series: Other parts of the standard address mechanical and climatic testing of semiconductor devices under varied environmental stresses.
- ISO/IEC Directives, Part 3: The drafting guidelines followed for the preparation and publication of IEC standards including IEC 60749-2.
By adhering to IEC 60749-2, engineers and manufacturers ensure semiconductor devices meet rigorous performance requirements for low air pressure environments, offering peace of mind for critical high-altitude and space applications. This standard supports the advancement of reliable electronic technology resilient to the unique challenges of military and aerospace fields.
Frequently Asked Questions
IEC 60749-2:2002 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure". This standard covers: Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1 000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only. The contents of the corrigendum of August 2003 have been included in this copy.
Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1 000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only. The contents of the corrigendum of August 2003 have been included in this copy.
IEC 60749-2:2002 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 60749-2:2002 has the following relationships with other standards: It is inter standard links to IEC 60749:1996/AMD2:2001, IEC 60749:1996/AMD1:2000, IEC 60749:1996, IEC 60749-2:2002/COR1:2003. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
IEC 60749-2:2002 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
NORME CEI
INTERNATIONALE IEC
60749-2
INTERNATIONAL
Première édition
STANDARD
First edition
2002-04
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 2:
Basse pression atmosphérique
Semiconductor devices –
Mechanical and climatic test methods –
Part 2:
Low air pressure
Numéro de référence
Reference number
CEI/IEC 60749-2:2002
Numérotation des publications Publication numbering
Depuis le 1er janvier 1997, les publications de la CEI As from 1 January 1997 all IEC publications are
sont numérotées à partir de 60000. Ainsi, la CEI 34-1 issued with a designation in the 60000 series. For
devient la CEI 60034-1. example, IEC 34-1 is now referred to as IEC 60034-1.
Editions consolidées Consolidated editions
Les versions consolidées de certaines publications de la The IEC is now publishing consolidated versions of its
CEI incorporant les amendements sont disponibles. Par publications. For example, edition numbers 1.0, 1.1
exemple, les numéros d’édition 1.0, 1.1 et 1.2 indiquent and 1.2 refer, respectively, to the base publication,
respectivement la publication de base, la publication de the base publication incorporating amendment 1 and
base incorporant l’amendement 1, et la publication de the base publication incorporating amendments 1
base incorporant les amendements 1 et 2. and 2.
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constamment revu par la CEI afin qu'il reflète l'état under constant review by the IEC, thus ensuring that
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cette publication, y compris sa validité, sont dispo- relating to this publication, including its validity, is
nibles dans le Catalogue des publications de la CEI available in the IEC Catalogue of publications
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amendements et corrigenda. Des informations sur les and corrigenda. Information on the subjects under
sujets à l’étude et l’avancement des travaux entrepris consideration and work in progress undertaken by the
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NORME CEI
INTERNATIONALE IEC
60749-2
INTERNATIONAL
Première édition
STANDARD
First edition
2002-04
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 2:
Basse pression atmosphérique
Semiconductor devices –
Mechanical and climatic test methods –
Part 2:
Low air pressure
IEC 2002 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
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PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
Международная Электротехническая Комиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue
– 2 – 60749-2 CEI:2002
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
___________
DISPOSITIFS À SEMICONDUCTEURS –
MÉTHODES D'ESSAIS MÉCANIQUES ET CLIMATIQUES –
Partie 2: Basse pression atmosphérique
AVANT-PROPOS
1) La CEI (Commission Electrotechnique Internationale) est une organisation mondiale de normalisation
composée de l'ensemble des comités électrotechniques nationaux (Comités nationaux de la CEI).La CEI a pour
objet de favoriser la coopération internationale pour toutes les questions de normalisation dans les domaines
de l'électricité et de l'électronique. A cet effet, la CEI, entre autres activités, publie des Normes internationales.
Leur élaboration est confiée à des comités d'études, aux travaux desquels tout Comité national intéressé par le
sujet traité peut participer. Les organisations internationales, gouvernementales et non gouvernementales, en
liaison avec la CEI, participent également aux travaux. La CEI collabore étroitement avec l'Organisation
Internationale de Normalisation (ISO), selon des conditions fixées par accord entre les deux organisations.
2) Les décisions ou accords officiels de la CEI concernant les questions techniques représentent, dans la mesure
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sont représentés dans chaque comité d’études.
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4) Dans le but d'encourager l'unification internationale, les Comités nationaux de la CEI s'engagent à appliquer de
façon transparente, dans toute la mesure possible, les Normes internationales de la CEI dans leurs normes
nationales et régionales. Toute divergence entre la norme de la CEI et la norme nationale ou régionale
correspondante doit être indiquée en termes clairs dans cette dernière.
5) La CEI n’a fixé aucune procédure concernant le marquage comme indication d’approbation et sa responsabilité
n’est pas engagée quand un matériel est déclaré conforme à l’une de ses normes.
6) L’attention est attirée sur le fait que certains des éléments de la présente Norme internationale peuvent faire
l’objet de droits de propriété intellectuelle ou de droits analogues. La CEI ne saurait être tenue pour
responsable de ne pas avoir identifié de tels droits de propriété et de ne pas avoir signalé leur existence.
La Norme internationale CEI 60749-2 a été établie par le comité d'études 47 de la CEI:
Dispositifs à semiconducteurs.
Le texte de cette norme est issu des documents suivants:
FDIS Rapport de vote
47/1601/FDIS 47/1617/RVD
Le rapport de vote indiqué dans le tableau ci-dessus donne toute information sur le vote ayant
abouti à l'approbation de cette norme.
Cette méthode d'essais mécaniques et climatiques, relative à la basse pression atmosphé-
rique est le résultat de la réécriture complète de l’essai contenu dans l'article 3 du chapitre 3
de la CEI 60749.
Cette publication a été rédigée selon les directives ISO/CEI, Partie 3.
Le comité a décidé que le contenu de cette publication ne sera pas modifié avant 2007.
A cette date, la publication sera
• reconduite;
• supprimée;
• remplacée par une édition révisée, ou
• amendée.
Le contenu du corrigendum d’août 2003 a été pris en considération dans cet exemplaire.
60749-2 IEC:2002 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 2: Low air pressure
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-2 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1601/FDIS 47/1617/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This mechanical and climatic test method, as it relates to low air pressure, is a complete
rewrite of the test contained in clause 3, chapter 3 of IEC 60749.
This publication has been drafted in acco
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