EN 60352-5:2008

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance (IEC 60352-5:2008)Connexions sans soudure - Partie 5: Connexions insérées a force - Exigences générales, méthodes d'essai et guide pratique (CEI 60352-5:2008)Lötfreie Verbindungen - Teil 5: Einpressverbindungen - Allgemeine Anforderungen, Prüfverfahren und Anwendungshinweise (IEC 60352-5:2008)Ta slovenski standard je istoveten z:EN 60352-5:2008SIST EN 60352-5:2008en,fr29.120.20ICS:SIST EN 60352-5:2002/A1:2004SIST EN 60352-5:20021DGRPHãþDSLOVENSKI
STANDARDSIST EN 60352-5:200801-maj-2008

EUROPEAN STANDARD EN 60352-5 NORME EUROPÉENNE
EUROPÄISCHE NORM March 2008
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2008 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60352-5:2008 E
ICS 31.220.10 Supersedes EN 60352-5:2001 + A1:2003
English version
Solderless connections -
Part 5: Press-in connections -
General requirements, test methods and practical guidance (IEC 60352-5:2008)
Connexions sans soudure -
Partie 5: Connexions insérées à force -
Exigences générales,
méthodes d'essai et guide pratique (CEI 60352-5:2008)
Lötfreie Verbindungen -
Teil 5: Einpressverbindungen -
Allgemeine Anforderungen,
Prüfverfahren und Anwendungshinweise (IEC 60352-5:2008)
This European Standard was approved by CENELEC on 2008-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.

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Foreword The text of document 48B/1805A/FDIS, future edition 3 of IEC 60352-5, prepared by SC 48B, Connectors, of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60352-5 on 2008-02-01. This European Standard supersedes EN 60352-5:2001 + A1:2003. EN 60352-5:2008 includes the following significant technical changes with respect to EN 60352-5:2001: – a recommendation to use four layer test boards in 5.1; – removal of sample tolerance range requirements in 5.3.2.1; they have been moved to Annex B; – Subclause 6.4.2 has been modified to clarify that platings other than tin or tin/lead may be used. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2008-11-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2011-02-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60352-5:2008 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following note has to be added for the standard indicated: IEC 61249-2-2 NOTE
Harmonized as EN 61249-2-2:2005 (not modified). __________

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Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year IEC 60050-581 A1 1978 1998 International Electrotechnical Vocabulary (IEV) -
Chapter 581: Electromechanical components for electronic equipment -
-
IEC 60068-1 + corr. October
+ A1 1988 1988 1992 Environmental testing -
Part 1: General and guidance
EN 60068-1
IEC 61249 Series Materials for printed boards and other interconnecting structures EN 61249 Series
IEC 60352-1
1997 Solderless connections -
Part 1: Wrapped connections - General requirements, test methods and practical guidance EN 60352-1 1997
IEC 60512 Series Connectors for electronic equipment - Tests and measurements
EN 60512 Series
IEC 60512-1-100 - 1) Connectors for electronic equipment - Tests and measurements -
Part 1-100: General - Applicable publications EN 60512-1-100 2006 2)
IEC 61188-5-1 - 1) Printed boards and printed board
assemblies - Design and use -
Part 5-1: Attachment (land/joint) considerations - Generic requirements EN 61188-5-1 2002 2)
IEC 62326-4 1996 Printed boards -
Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specificationEN 62326-4 1997
1) Undated reference.
2) Valid edition at date of issue.

IEC 60352-5Edition 3.0 2008-01INTERNATIONAL STANDARD NORME INTERNATIONALESolderless connections –
Part 5: Press-in connections – General requirements, test methods and practical guidance
Connexions sans soudure –
Partie 5: Connexions insérées à force – Exigences générales, méthodes d’essai et guide pratique
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE WICS 31.220.10 PRICE CODECODE PRIXISBN 2-8318-9522-7

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CONTENTS FOREWORD.4 INTRODUCTION.6
1 Scope and object.7 2 Normative references.7 3 Terms and definitions.8 4 Requirements.9 4.1 General.9 4.2 Tools.9 4.2.1 Tools evaluation.9 4.3 Press-in terminations.9 4.3.1 Materials.9 4.3.2 Dimensions of the press-in zone.9 4.3.3 Surface finishes.9 4.3.4 Design features.10 4.4 Printed boards.10 4.4.1 General.10 4.4.2 Materials.10 4.4.3 Thickness of printed boards.10 4.4.4 Plated-through hole.10 4.5 Press-in connections.11 4.6 Manufacturer´s specification.11 5 Tests.12 5.1 General.12 5.1.1 General remarks.12 5.1.2 Standard conditions for testing.13 5.1.3 Mounting of specimens/sets of parts.13 5.2 Test and measuring methods.13 5.2.1 General examination.13 5.2.2 Mechanical tests.14 5.2.3 Electrical tests.18 5.2.4 Climatic tests.18 5.3 Test schedules.19 5.3.1 General.19 5.3.2 Qualification test schedule.19 5.3.3 Application test schedule.21 5.3.4 Flow chart.23 5.4 Test report.24 5.4.1 Qualification test report.24 5.4.2 Application test report.24 6 Practical guidance.25 6.1 Current-carrying capacity.25 6.2 Tool information.25 6.2.1 Termination insertion tool.25 6.2.2 Support block.25 6.2.3 Termination removal tool.26

60352-5 © IEC:2008 – 3 –
6.3 Termination information.26 6.3.1 General.26 6.3.2 Design features.26 6.3.3 Materials and surface finishes.26 6.3.4 Press-in termination with wrap post.27 6.3.5 Press-in terminations with connector contact elements.27 6.4 Printed board information.28 6.4.1 General.28 6.4.2 Plated-through hole.28 6.5 Connection information.29 6.5.1 General.29 6.5.2 Repair of press-in connections.30 6.5.3 Combination of press-in connections and soldered connections.31 6.5.4 Bimetallic electrolytic corrosion effects.31
Annex A (normative)
Solid press-in terminations.32 Annex B (informative)
Plated through hole tolerance range.34
Bibliography.36
Figure 1 – Test arrangement, bending.14 Figure 2 – Test arrangement – push-out force.15 Figure 3 – Transverse section of a press-in connection.17 Figure 4 – Longitudinal section of a press-in connection.17 Figure 5 – Test arrangement for contact resistance.18 Figure 6 – Qualification test schedule.23 Figure 7 – Press-in connection made with a press-in termination, application level a).29 Figure 8 – Press-in connection made with a press-in termination, application level b).30 Figure 9 – Example of a termination removal tool.31 Figure A.1 – Parallelism of a solid press-in zone.33 Figure B.1 – Example of hole ranges.34
Table 1 – Finished plated-through holes.11 Table 2 – Vibration, preferred test severities.16 Table 3 – Push-out force for application level b).29 Table A.1 – Plated-through holes for solid press-in zones.32

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INTERNATIONAL ELECTROTECHNICAL COMMISSION _____________
SOLDERLESS CONNECTIONS –
Part 5: Press-in connections –
General requirements, test methods and practical guidance
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60352-5 has been prepared by subcommittee 48B: Connectors, of IEC technical committee 48: Electromechanical components and mechanical structures for electronic equipment. This third edition cancels and replaces the second edition published in 2001 and its amendment 1 (2003). This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: 1) A recommendation to use four layer test boards in
5.1. 2) Removal of sample tolerance range requirements in 5.3.2.1; they have been moved to Annex B. 3) Subclause 6.4.2 has been modified to clarify that platings other than tin or tin/lead may be used.

60352-5 © IEC:2008 – 5 –
The text of this standard is based on the following documents: FDIS Report on voting 48B/1805A/FDIS 48B/1830/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. A list of all parts of the IEC 60352 series, under the general title Solderless connections, can be found on the IEC website. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.

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INTRODUCTION This part of IEC 60352 includes requirements, tests and practical guidance information. Two test schedules are provided. a) The qualification test schedule applies to individual press-in connections (press-in zone).
They are tested to the specification provided by the manufacturer of the press-in zone (see 4.6) taking into account the requirements of Clause 4.
The qualification is independent of the application of the press-in zone in a component. b) The application test schedule applies to press-in connections which are part of a component and are already qualified to the qualification test schedule.
Test sequences focus on the performance of the press-in connection which is affected by the implementation in a component. As the manufacturer of the press-in zone has to provide the main part of the information needed for qualification, the use of the words "the manufacturer" is implemented throughout this standard for simplicity. IEC Guide 109 advocates the need to minimise the impact of a product on the natural environment throughout the product life cycle. It is understood that some of the materials permitted in this standard may have a negative environmental impact. As technological advances lead to acceptable alternatives for these materials, they will be eliminated from the standard.

60352-5 © IEC:2008 – 7 –
SOLDERLESS CONNECTIONS –
Part 5: Press-in connections – General requirements, test methods and practical guidance
1 Scope and object This part of IEC 60352 is applicable to solderless press-in connections for use in tele-communication equipment and in electronic devices employing similar techniques. The press-in connection consists of a termination having a suitable press-in zone which is inserted into a plated-through hole of a double-sided or multilayer printed board. Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Only compliant press-in zones can be qualified according to this part of IEC 60352. Solid press-in zones are in use. Information about these is given in Annex A. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050(581):1978, International Electrotechnical Vocabulary (IEV) – Chapter 581: Electromechanical components for electronic equipment
Amendment 1 (1998) IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
Amendment 1 (1992) IEC 61249 (all parts), Materials for printed boards and other interconnecting structures
IEC 60352-1:1997, Solderless connections – Part 1: Wrapped connections – General require-ments, test methods and practical guidance IEC 60512 (all parts), Connectors for electronic equipment – Tests and measurements
IEC 60512-1-100, Connectors for electronic equipment – Tests and measurements –
Part 1-100: General - Applicable publications IEC 61188-5-1: Printed boards and printed board assemblies – Design and use – Part 5-1: Attachment (land/joint) considerations – Generic requirements

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IEC 62326-4:1996, Printed boards – Part 4: Rigid multilayer printed boards with interlayer connections – Sectional specification 3 Terms and definitions For the purposes of this document, the terms and definitions of IEC 60050(581) and IEC 60512-1 as well as the following apply. 3.1
press-in connection solderless connection made by inserting a press-in termination into a plated-through hole of a printed board
[IEV 581-03-46] 3.2
press-in termination (press-in post) termination having a specially shaped zone suitable to provide for a solderless press-in connection
[IEV 581-03-39] 3.2.1 solid press-in termination press-in termination having a solid press-in zone
[IEV 581-03-40] 3.2.2 compliant press-in termination press-in termination having a compliant press-in zone
[IEV 581-03-41] 3.3
press-in zone specially shaped section of a press-in termination which is suitable to provide for the press-in connection
[IEV 581-03-52] 3.4
termination insertion tool device used to insert press-in terminations or components equipped with press-in terminations into a printed board
[IEV 581-05-22] 3.5
termination removal tool device for removing a press-in termination from a printed board
[IEV 581-05-23] 3.6
part press-in terminations and a printed board with plated-through holes. The press-in terminations are not inserted in the printed board.

60352-5 © IEC:2008 – 9 –
3.7
specimen printed board, or a part of a printed board, with an inserted press-in termination, with or without a component housing 4 Requirements 4.1 General This Clause is applicable to compliant press-in zones only. For solid press-in zones, see Annex A. The connections shall be processed in a careful and workmanlike manner, in accordance with good current practice. 4.2 Tools Tools shall be used and inspected according to the instructions and dimensions provided by the manufacturer. The tools shall be capable of making uniformly reliable connections during their useful life. The tools shall be so designed that they do not damage the press-in termination or the printed board when correctly operated. 4.2.1 Tools evaluation Tools are evaluated for performance by testing the connections made by them and carrying out tests according to 4.5 and 5.1.2. They shall meet the requirements of 4.6d) and 5.2.1.4. 4.3 Press-in terminations 4.3.1 Materials Material used in the press-in zone shall be specified by the manufacturer. For information on materials, see 6.3.3. 4.3.2 Dimensions of the press-in zone The performance of a press-in connection depends on the dimensions of the specially shaped press-in zone and the materials used for the press-in termination together with the dimensions and materials of the plated-through hole in the printed board. The dimensions and shape including the tolerances of the press-in zone shall be specified by the manufacturer. NOTE For dimensions of plated-through holes, see 4.4.4.2. 4.3.3 Surface finishes The press-in zone of the press-in termination shall be either unplated or plated. The surface finish shall be specified by the manufacturer. The surface shall be free of detrimental contamination or corrosion. For information on surface finishes, see 6.3.3.

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4.3.4 Design features For the shape of the press-in zone, a wide variety of designs can be used. The press-in termination shall be so designed that a press-in connection is achieved by inserting the press-in zone to a predetermined depth in a specified plated-through hole in the board. The press-in terminations and their press-in zones shall be so designed and manufactured that damage to the plated-through hole in the printed board is avoided (see also 4.5). Press-in terminations shall have insert features, for example a shoulder or suitable surface, to facilitate the insertion operation. 4.4 Printed boards 4.4.1 General Printed boards according to IEC 61188-5-1 and IEC 62326-4 or to a specification given by the manufacturer shall be used. 4.4.2 Materials The manufacturer shall specify the types of base material for which the press-in zone is designed. Examples of base materials may be found in IEC 61249.
4.4.3 Thickness of printed boards The manufacturer shall specify for which range of board thicknesses the press-in zone is designed. 4.4.4 Plated-through hole 4.4.4.1 Plating of the plated-through hole The thickness of the plating of the plated-through hole shall be: copper ≥ 25 μm. Further plating requirements shall be specified by the manufacturer. 4.4.4.2 Hole dimensions The hole diameter prior to plating is of great importance in determining the reliability of a press-in connection. The tolerances on the hole diameters prior to and after plating are given in Table 1.

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Table 1 – Finished plated-through holes
All dimensions are in millimetres Nominal hole diameter Diameter of the finished plated-through hole Recommended diameter of the hole prior to platinga b
0,50 0,50 ± 0,05 0,60 ± 0,01
0,55 0,55 ± 0,05 0,64 ± 0,01
0,60 0,60 ± 0,05 0,70 ± 0,02
0,65 0,65 07,004,0+− 0,80 003,0+−
0,70 0,70 07,005,0+− 0,80 03,002,0+−
0,75 0,75 05,007,0+− 0,85 01,004,0+−
0,80 0,80 09,003,0+− 0,90 ±0,025
0,85 0,85 10,005,0+− 1,00 01,004,0+−
0,90 0,90 ± 0,07 1,00 ± 0,025
1 1,00 09,006,0+− 1,15 ± 0,025
1,45 1,45 09,006,0+− 1,60 ± 0,025
1,60 1,60 09,006,0+− 1,75 ± 0,025 a These are typical values for the as-drilled pc board hole diameters for FR4 materials and do not necessarily apply to other pc board materials. b
These values do not apply to moulded interconnection devices.
4.5 Press-in connections a) The combination of press-in termination, printed board and termination insertion tool shall be compatible and specified by the manufacturer. b) The press-in termination shall be correctly mounted in the plated-through hole of the printed board as specified in the specification of the manufacturer of the press-in zone. c) The press-in operation may result in deformation of the plated-through hole (visible by microsectioning).
d) The press-in termination shall not be damaged (e.g. cracked or bent). e) There shall be no deformation of the printed conductor and/or the plating of the plated-through hole caused by the termination insertion tool or device. f) There shall be no lands fractured or lifted. g) There shall be no delamination, blistering or cracking of layers. h) After the press-in operation, no detrimental plating particle chips shall be visible. i) At the opposite side of the press-in direction, no plating of the plated-through hole shall be loosened. 4.6 Manufacturer´s specification The following information shall be supplied by the manufacturer of the press-in zone and/or the component:

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a) Printed board and hole information – printed board material; – maximum number of conductive layers; – printed board minimum and maximum thickness; – printed board plating material; – finished plated through holes dimension (Table 1); – hole dimension prior to plating. b) Press-in zone information – material of the press-in termination; – plating; – dimensions, including tolerances. c) Information on the application – straight or right angle termination; – rear plug up; – wrapped connection; – individual press-in termination; – connector with pre-assembled press-in terminations. d) Instruction and tools for the press-in operation – tools to be used; – numbers of repairs with or without a new press-in termination. e) Press-in characteristics – maximum press-in force per termination; – minimum push-out force per termination. f) Any other significant information If this information cannot be disclosed, the qualification of the press-in connection will not take place. 5 Tests 5.1 General remarks 5.1.1 General As explained in the introduction, there are two test schedules which shall be applied according to the following conditions. a) Press-in connections, according to the requirements in Clause 4 and the requirements in the manufacturer’s specification, shall be tested in accordance with the qualification test schedule in 5.3.2.
This test schedule is intended to be applied on individual press-in terminations without component housing. b) Press-in connections which are part of a component and already qualified to the qualification test schedule shall be tested in accordance with the application test schedule in 5.3.3.
This test schedule is intended to be applied on complete components consisting of multiple press-in terminations mounted in a component housing. The application test schedule shall be implemented in the detail specification of the component in such a way that the duplication of tests may be avoided.

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Therefore, the test phases in test group D (see 5.3.3.2) may be inserted in any test group of the component specification, as long as the sequence, conditioning and environment comply with the requirements of this standard. Four layer printed circuit boards shall be used for testing unless otherwise specified in the component specification or in the manufacturer’s specification. 5.1.2 Standard conditions for testing 5.1.2.1 General Unless otherwise specified, all tests shall be carried out under standard conditions for testing as specified in IEC 60512-1.
The ambient temperature and the relative humidity at which the measurements are made shall be stated in the test report. In case of dispute about test results, the test shall be repeated at one of the referee conditions of IEC 60068-1. 5.1.2.2 Preconditioning Where specified, the connections shall be preconditioned under standard conditions for testing in accordance with the requirements of IEC 60512-1 for a minimum period of 24 h and no longer than 25 h. 5.1.2.3 Recovery Where specified, the specimens shall be allowed to recover under standard conditions for testing for a period of a minimum of 2 h after conditioning. 5.1.3 Mounting of specimens/sets of parts For the qualification test schedule, the sets of parts consist of press-in terminations and a printed board with plated-through holes. When mounting is required in a test, the specimens shall be mounted using the mounting method described in the manufacturer’s specification. For the application test schedule, complete components shall be pressed on a printed board, using the normal mounting method, unless otherwise specified in the component specification or in the manufacturer’s specification. NOTE For the definitions of part and specimen, see 3.6 and 3.7. 5.2 Test and measuring methods NOTE As far as test methods are described in this subclause, it is intended that the description be replaced by a reference to IEC 60512 as soon as the relevant test method is included in IEC 60512. 5.2.1 General examination 5.2.1.1 Visual examination of parts The test shall be carried out in accordance with IEC 60512, test 1a. Magnification shall be five times, and all parts shall be examined to ensure that the applicable requirements of 4.3 to 4.6 have been met.

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5.2.1.2 Examination of dimensions The test shall be carried out in accordance with IEC 60512, test 1b. All parts shall be examined to ensure that the applicable requirements of 4.3 to 4.6 have been met. 5.2.1.3 Visual examination of specimens The test shall be carried out in accordance with IEC 60512, test 1a. Magnification shall be five times, and all specimens shall be examined to ensure that the applicable requirements of 4.3 to 4.6 have been met. 5.2.1.4 Inspection of tools The tools shall be inspected and controlled according to the manufacturer’s instructions and specifications to be sure that the applicable requirements of 4.2 and 4.6 have been met. 5.2.2 Mechanical tests 5.2.2.1 Bending This test is only applicable to press-in terminations having a free post length of ≥10 mm protruding from the board. The object of this test is to assess the ability of a press-in connection to withstand the mechanical stress caused by an unintentional bending of the free length of the termination and following adjustment. The test specimen shall consist of a printed board or a part of a printed board, with an inserted press-in termination having a free post length of ≥10 mm for bending. 15°15°1230IEC
138/01 Figure 1 – Test arrangement, bending The free end of one press-in termination shall be bent in one direction and the free end of a second press-in termination shall be bent in the perpendicular direction. Bending over distances 1, 2 and 3 shall be considered to be one cycle as shown in Figure 1. Test severity: One cycle shall be carried out unless otherwise specified by the manufacturer. 5.2.2.2 Press-in force The force necessary to insert a press-in termination into the plated-through hole of a printed board is determined by – the type of press-in zone; – the type of printed board; – the diameter of the plated-through hole; – the surface material of the metal plating in the hole.

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The upper limit of the press-in force shall be specified by the manufacturer. The recommended speed for application of the press-in force during measurement shall be 25 mm/min to 50 mm/min. 5.2.2.3 Push-out force This test is only applicable in the qualification test schedule. This test relates only to the press-in connection between the press-in zone and the metal plating of a plated-through hole in a printed board. The minimum value given in the manufacturer’s specification shall ensure a good electrical performance of the press-in connection before and after mechanical, electrical and climatic conditioning according to the test schedules. The object of this test is to assess the ability of a press-in connection to withstand the mechanical stress caused by a force acting along the longitudinal axis of the press-in termination. The test specimen shall consist of a printed board or a part of a printed board with a press-in termination inserted as shown in Figure 2. After the press-in operation and before carrying out the push-out test, the test specimens shall be allowed to recover for a period of at least 24 h.
Push-out device Printed board Press-in termination Press-in direction Push-out directionF IEC
2352/07
Figure 2 – Test arrangement – push-out force A force F shall be applied to the press-in termination against the press-in direction. A suitable device shall be used, for example a tensile testing machine. The head of the tensile testing machine shall travel steadily at a speed <12 mm/min. The specimen shall be tested until the press-in termination moves in the plated-through hole of the printed board. The ultimate load shall be measured. Requirement: The minimum and maximum push-out force shall be specified by the manu-facturer of the press-in zone. NOTE Where, for technical reasons, when carrying out the push-out test, the push-out operation cannot be applied, a pull-out operation may be applied. For information on additional mechanical stresses acting on the press-in termination due to the application of the press-in connection, see 6.5.1.

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5.2.2.4 Vibration This test is only applicable in the application test schedule. The test shall be carried out in accordance with IEC 60512, test 6d. The test specimens shall be firmly held on a vibration table. A suitable test arrangement for testing press-in connections shall be defined in the component specification. Preferred severities are given in Table 2. Contact disturbance shall be monitored during vibration test in accordance with IEC 60512, test 2e. Requirement: No contact disturbance exceeding 1 μs unless otherwise specified in the applicable detail specification of the component. Table 2 – Vibration, preferred test severities Range of frequency 10 Hz to 55 Hz 10 Hz to 500 Hz 10 Hz to 2 000 Hz Full duration 2 h + 5 min/– 0 min 6 h+ 5 min/– 0 min 6 h+ 5 min/– 0 min Displacement amplitude below
the cross-over frequency 0,35 mm 0,35 mm 1,5 mm Acceleration amplitude above
the cross-over frequency – 50 m/s2 200 m/s2 Directions Three axes Three axes Three axes Number of sweep cycles per direction 8 10 8
Unless otherwise specified in the relevant component detail specification, the 10 Hz to 500 Hz range shall be carried out. 5.2.2.5 Microsectioning 5.2.2.5.1 General The test shall be carried out in accordance with IEC 61188-5-1. 5.2.2.5.2 Transverse sectioning The deformation "a" of the drilled hole contour in the plated-through hole shall be smaller than 70 μm.
The minimum remaining thickness "b" of the plating shall be more than 8 μm. There shall be no cracks in the plating of the through hole. See Figure 3. Compliance is checked by inspection and measurement.

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Press-indirectionLocation of themicrosectionMeasurement ofthe deformationOriginal holecontour0,3+0,2–0,1baIEC
140/01 Dimensions in millimetres Figure 3 – Transverse section of a press-in connection 5.2.2.5.3 Longitudinal sectioning The deformation "c" of the connected pattern to the plated-through hole shall be not more than 50 μm (see Figure 4). Neither the plating of the plated-through hole nor the conductor may have cracks ("d"). For double-sided printed boards, these requirements are applicable to the outer layers. Compliance is checked by inspection, measurement and visual examination according to 5.2.1.3. The measurement shall be recorded.
Press-in zone Printed board c d IEC
2353/07
Figure 4 – Longitudinal section of a press-in connection The area of contact between the press-in zone and the hole shall be appropriate to carry the specified current. 5.2.2.6 Replacement (repairing) The manufacturer shall specify if replacement is allowed and, if so, the number of replace-ments allowed. The test of the ability of a press-in zone to withstand replacement and its possibility to show equal performance is made by having a part of the press-in zone replaced.

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Replacement is always carried out with new press-in terminations, using the tools specified by the manufacturer. All requirements are identical to those applicable to the first press-in cycle. The repaired sets of parts shall be inspected. No loose parts of metal or cracks in the board layer or conductors shall be visible. If the component allows the replacement of the press-in termination, the operation and the tools shall be specified by the manufacturer of the component or a detail specification. 5.2.3 Electrical tests 5.2.3.1 Contact resistance The contact resistance test shall be carried out in accordance with IEC 60512, test 2a. Care shall be taken regarding the resolution of the micro-voltmeter as well as corrections for thermo-electrical voltage. The measuring points should be made as close as possible to minimize the bulk resistance. Figure 5 shows an example of the test arrangement.
Press-in zone Printed board μV mAIEC
2354/07
Figure 5 – Test arrangement for contact resistance Requirements after mechanical, electrical or climatic conditioning: a) qualification test schedule: The maximum change of contact resistance shall be less than 0,5 mΩ for each test phase. b) application test schedule: The maximum change of contact resistance shall be specified in the component detail specification, if any, or in the manufacturer’s specification.
If necessary, when direct measurement of press-in connection is not possible, an overall measurement of contact resistance shall be specified and the requirement for the press-in connection shall be included in the value required for the component. 5.2.4 Climatic tests 5.2.4.1 General The detail specification of the component, if any, or the manufacturer’s specification shall prescribe the upper category temperature (UCT) and the lower category temperature (LCT) which shall be used in the following tests.
When the printed board associated with this component has a different temperature category, the climatic test shall be carried out with the temperature category either of the component, or the printed board, whichever is the less severe. NOTE The maximum operating temperature of the printed board is the limiting value.

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5.2.4.2 Rapid change of temperature The test shall be carried out in accordance with IEC 60512, test 11d. Unless otherwise specified by the manufacturer of the component or a detail specification, the following details shall apply: – low temperature TA –40 °C (LCT) – high temperature TB 85 °C (UCT) – duration of exposure t1 30 min – number of cycles
10 5.2.4.3 Climatic sequence The test shall be carried out in accordance with IEC 60512, test 11a. Unless otherwise specified by the manufacturer of the component or a detail specification, the following details shall apply: – dry heat, test temperature 85 °C (UCT) – cold, test temperature –40 °C (LCT) – damp heat, cyclic, remaining cycles 5 5.2.4.4 Dry heat
The test shall be carried out in accordance with IEC 60512, test 11i. Unless otherwise specified by the manufacturer of the component or a detail specification, the following details shall apply: – test temperature 85 °C (UCT) – test duration 1 000 h 5.2.4.5 Flowing mixed gas corrosion test The test shall be carried out in accordance with IEC 60512, test 11g. Unless otherwise specified by the manufacturer of the component or a detail specification, the following details shall apply:
– method 1 – duration of exposure 10 days NOTE This test i
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