Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Oberflächenmontage

Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface

Etablit des exigences relatives aux connexions brasées pour montage en surface. Les exigences se rapportent aux ensembles intégrant uniquement le montage en surface ou aux portions d'ensembles pour montage en surface incluant d'autres technologies associées (par exemple montage par trous traversants, montage à puce, à borne, etc.).

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

General Information

Status
Withdrawn
Publication Date
27-Oct-1998
Withdrawal Date
30-Jun-2001
Drafting Committee
IEC/TC 91 - IEC_TC_91
Parallel Committee
IEC/TC 91 - IEC_TC_91
Current Stage
9960 - Withdrawal effective - Withdrawal
Start Date
10-Jul-2016
Completion Date
10-Jul-2016

Relations

Effective Date
29-Jan-2023

Frequently Asked Questions

EN 61191-2:1998 is a standard published by CLC. Its full title is "Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies". This standard covers: Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

EN 61191-2:1998 is classified under the following ICS (International Classification for Standards) categories: 31.240 - Mechanical structures for electronic equipment. The ICS classification helps identify the subject area and facilitates finding related standards.

EN 61191-2:1998 has the following relationships with other standards: It is inter standard links to EN 61191-2:2013. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

EN 61191-2:1998 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assembliesElektronikaufbauten auf Leiterplatten -- Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in OberflächenmontageEnsembles de cartes imprimées -- Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surfacePrinted board assemblies -- Part 2: Sectional specification - Requirements for surface mount soldered assemblies31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:EN 61191-2:1998SIST EN 61191-2:2001en01-marec-2001SIST EN 6119
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