EN 60068-2-58:2004

SLOVENSKI SIST EN 60068-2-58:2005

STANDARD
september 2005
Okoljsko preskušanje – 2-58. del: Preskusi - Preskus Td: Preskusna metoda
za spajkanje, odpornost površinsko montiranih komponent (SMD) proti
razkrajanju pokovinjenja in vročini spajke
Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability,
resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
ICS 19.040; 31.190 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 60068-2-58
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2004

ICS 19.040; 31.190 Supersedes EN 60068-2-58:1999

English version
Environmental testing
Part 2-58: Tests –
Test Td: Test methods for solderability,
resistance to dissolution of metallization and
to soldering heat of surface mounting devices (SMD)
(IEC 60068-2-58:2004)
Essais d'environnement Umweltprüfungen
Partie 2-58: Essais – Teil 2-58: Prüfungen –
Essai Td: Méthodes d'essai Prüfung Td: Prüfverfahren für
de la soudabilité, de la résistance Lötbarkeit, Widerstandsfähigkeit
de la métallisation à la dissolution gegenüber Auflösen der Metallisierung
et de la résistance à la chaleur und Lötwärmebeständigkeit
de soudage des composants bei oberflächenmontierbaren
pour montage en surface (CMS) Bauelementen (SMD)
(CEI 60068-2-58:2004) (IEC 60068-2-58:2004)

This European Standard was approved by CENELEC on 2004-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60068-2-58:2004 E
Foreword
The text of document 91/447/FDIS, future edition 3 of IEC 60068-2-58, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was
approved by CENELEC as EN 60068-2-58 on 2004-09-01.
This European Standard supersedes EN 60068-2-58:1999.
This European Standard includes the following significant technical changes with respect to
EN 60068-2-58:1999:
– expansion of the scope so that it includes lead-free solder alloy in addition to the existing tin-lead
eutectic or near eutectic solder alloy (the structure of the document has been changed
accordingly);
– addition of the definitions "solderability" and "resistance to soldering heat" for SMDs;
– specification of the re flow temperature profiles for the resistance to soldering heat using lead-free
solder;
– addition of an Annex C enabling a quick overview of the test conditions.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-12-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-06-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60068-2-58:2004 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-4 NOTE Harmonized as EN 60068-2-4:1995 (not modified).
IEC 60068-2-54 NOTE Harmonized as EN 60068-2-54:1987 (not modified).
IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69:1996 (not modified).
__________
- 3 - EN 60068-2-58:2004
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance
2)
IEC 60068-2-20 1979 Part 2: Tests - Test T: Soldering HD 323.2.20 S3 1988

IEC 60194 1999 Printed board design, manufacture and - -
assembly - Terms and definitions

IEC 60749-20 2002 Semiconductor devices - Mechanical and EN 60749-20 2003
climatic test methods
Part 20: Resistance of plastic-
encapsulated SMDs to the combined
effect of moisture and soldering heat

IEC 61190-1-1 2002 Attachment materials for electronic EN 61190-1-1 2002
assembly
Part 1-1: Requirements for soldering
fluxes for high-quality interconnections in
electronics assembly
IEC 61190-1-2 2002 Attachment materials for electronic EN 61190-1-2 2002
assembly
Part 1-2: Requirements for solder pastes
for high-quality interconnections in
electronics assembly
IEC 61190-1-3 2002 Attachment materials for electronic EN 61190-1-3 2002
assembly
Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-
fluxed solid solders for electronic
soldering applications
IEC 61191-2 1998 Printed board assemblies EN 61191-2 1998
Part 2: Sectional specification -
Requirements for surface mount soldered
assemblies
1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068-1:1988.
2)
HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20.

Publication Year Title EN/HD Year
IEC 61249-2-7 2002 Materials for printed boards and other EN 61249-2-7 2002
interconnecting structures
Part 2-7: Reinforced base materials clad
and unclad - Epoxide woven E-glass
laminated sheet of defined flammability
(vertical burning test), copper-clad

IEC 61760-1 1998 Surface mounting technology EN 61760-1 1998
Part 1: Standard method for the
specification of surface mounting
components (SMDs)
NORME CEI
INTERNATIONALE IEC
60068-2-58
INTERNATIONAL
Troisième édition
STANDARD
Third edition
2004-07
Essais d'environnement –
Partie 2-58:
Essais – Essai Td: Méthodes d'essai de la
soudabilité, résistance de la métallisation à la
dissolution et résistance à la chaleur de brasage
des composants pour montage en surface (CMS)
Environmental testing –
Part 2-58:
Tests – Test Td: Test methods for solderability,
resistance to dissolution of metallization and to
soldering heat of surface mounting devices (SMD)
© IEC 2005 Droits de reproduction réservés ⎯ Copyright - all rights reserved
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60068-2-58 © IEC:2005 – 3 –
CONTENTS
FOREWORD.5
1 Scope and object.9
2 Normative references .9
3 Terms and definitions .11
4 Grouping of soldering processes using lead-free solder alloys .11
5 Preconditioning .13
6 Solder bath method .13
6.1 Test apparatus and materials for the solder bath method.13
6.2 Test procedure for solder bath method .15
7 Solder reflow methods .17
7.1 Test apparatus and materials for solder reflow methods .17
7.2 Test procedure for the solder reflow method.21
8 Test conditions .23
8.1 Test conditions for lead-free solder alloys .23
8.2 Test conditions for lead containing solder alloy.27
9 Final measurements .31
9.1 Flux removal.31
9.2 Recovery conditions .31
9.3 Evaluation .33
10 Information to be given in the relevant specification.35
Annex A (normative) Criteria for visual examination.39
Annex B (informative) Guidance.43
Annex C (informative) Overview of test conditions .49
Bibliography .53
Figure 1 – Examples of immersion .17
Figure 2 – Reflow temperature profile.23
Figure 3 – Identification of areas on metallic termination.33
Figure A.1 – Evaluation of wetting .41
Table 1 – Grouping of soldering processes related to lead-free solder alloys.13
Table 2 – Severities (duration and temperatures) – Solder bath method – Lead-free
solder alloys .25
Table 3 – Reflow temperature profile for wetting – Lead-free solder alloys .25
Table 4 – Reflow temperature profile for resistance to soldering heat – Lead-free
solder alloys .27
Table 5 – Severities (duration and temperature) .27
Table 6 – Reflow temperature profile for wetting – Lead containing solder alloys.29
Table 7 – Reflow temperature profile for resistance to soldering heat – Lead containing
solder alloys .31
Table C.1 – Overview of the temperature and duration conditions .51

60068-2-58 © IEC:2005 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 2-58: Tests – Test Td: Test methods for solderability,
resistance to dissolution of metallization and to
soldering heat of surface mounting devices (SMD)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The fo
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