EN 60068-2-83:2011

SLOVENSKI STANDARD
01-januar-2012
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Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic
components for surface mounting devices (SMD) by the wetting balance method using
solder paste
Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung Tf: Prüfung der Lötbarkeit von
Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage
unter Verwendung von Lotpaste
Essais d'environnement - Partie 2-83: Essais - Essais Tf: Essai de brasabilité des
composants électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage utilisant de la pâte à braser
Ta slovenski standard je istoveten z: EN 60068-2-83:2011
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.020 Elektronske komponente na Electronic components in
splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60068-2-83
NORME EUROPÉENNE
October 2011
EUROPÄISCHE NORM
ICS 19.040; 31.190
English version
Environmental testing -
Part 2-83: Tests -
Test Tf: Solderability testing of electronic components for surface
mounting devices (SMD) by the wetting balance method using solder
paste
(IEC 60068-2-83:2011)
Essais d'environnement -  Umweltprüfungen -
Partie 2-83: Essais - Teil 2-83: Prüfungen -
Essais Tf: Essai de brasabilité des Prüfung Tf: Prüfung der Lötbarkeit von
composants électroniques pour les Bauelementen der Elektronik für
composants pour montage en surface Oberflächenmontage (SMD) mit der
(CMS) par la méthode de la balance de Benetzungswaage unter Verwendung von
mouillage utilisant de la pâte à braser Lotpaste
(CEI 60068-2-83:2011) (IEC 60068-2-83:2011)

This European Standard was approved by CENELEC on 2011-10-12. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60068-2-83:2011 E
Foreword
The text of document 91/975/FDIS, future edition 1 of IEC 60068-2-83, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 60068-2-83:2011.

The following dates are fixed:
(dop) 2012-07-12
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2014-10-12
• latest date by which the national
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.
Endorsement notice
The text of the International Standard IEC 60068-2-83:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-69 NOTE  Harmonized as EN 60068-2-69.
IEC 61189-5 NOTE  Harmonized as EN 61189-5.

- 3 - EN 60068-2-83:2011
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60068-1 - Environmental testing - EN 60068-1 -
Part 1: General and guidance
IEC 60068-2-20 2008 Environmental testing - EN 60068-2-20 2008
Part 2-20: Tests - Test T: Test methods for
solderability and resistance to soldering heat
of devices with leads
IEC 60068-2-58 - Environmental testing - EN 60068-2-58 -
Part 2-58: Tests - Test Td: Test methods for
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions

IEC 61190-1-3 - Attachment materials for electronic assembly -EN 61190-1-3 -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

IEC 60068-2-83 ®
Edition 1.0 2011-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-83: Tests – Test Tf: Solderability testing of electronic components for
surface mounting devices (SMD) by the wetting balance method using solder
paste
Essais d’environnement –
Partie 2-83: Essais – Essai Tf: Essai de brasabilité des composants
électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage utilisant de la pâte à braser

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX W
ICS 19.040; 31.190 ISBN 978-2-88912-665-1

– 2 – 60068-2-83  IEC:2011
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 Test . 9
4.1 General description . 9
4.2 Test methods . 9
5 Preconditioning . 9
6 Preparation . 10
6.1 Solder paste . 10
6.2 Test jig plate . 10
6.3 Specimen holder . 10
7 Quick heating method . 10
7.1 Equipment . 10
7.2 Test jig plate . 11
7.3 Preparation . 12
7.4 Test condition . 12
7.4.1 Test temperature . 12
7.4.2 Feed of solder paste and immersion condition . 13
7.4.3 Immersion and withdrawal conditions for test specimen . 14
7.5 Test procedure . 14
7.6 Presentation of the result . 15
7.7 Characterisation parameter examples . 15
8 Synchronous method . 16
8.1 Equipment . 16
8.2 Test jig plate . 17
8.3 Synchronous fixture . 17
8.4 Preparation . 17
8.5 Test condition . 17
8.5.1 Test temperature . 17
8.5.2 Feed of solder paste and immersion condition . 17
8.5.3 Immersion and withdrawal conditions for the test specimen . 17
8.6 Test procedure . 17
8.7 Presentation of the results . 18
8.8 Characterisation parameter examples . 19
9 Temperature profile method . 19
9.1 Equipment . 19
9.2 Test jig plate . 19
9.3 Preparation . 20
9.4 Test condition . 20
9.4.1 Test temperature . 20
9.4.2 Feed of solder paste and immersion condition . 21
9.4.3 Immersion and withdrawal conditions for test specimen . 21
9.5 Test procedure . 21

60068-2-83  IEC:2011 – 3 –
9.6 Presentation of the result . 22
9.7 Characterisation parameter examples . 23
Annex A (normative) Equipment for the quick heating and synchronous method . 24
Annex B (informative) Reading of the output data and correction of the result in the
quick heating test. 25
Annex C (normative) Test equipment for the temperature profile method . 28
Annex D (informative) Reading of the output data and correction of the result in the
temperature profile test . 29
Annex E (informative) Caveats / Notes. 32
Bibliography . 36

Figure 1 – Examples of the quick heating method test equipment . 11
Figure 2 – Example of test jig plate for quick heating and synchronous method . 12
Figure 3 – Example of the temperature profile. 13
Figure 4 – Example of applying solder paste to a test jig plate . 14
Figure 5 – Typical output shape of signal in the quick heating method . 15
Figure 6 – Example of synchronous method test equipment . 16
Figure 7 – Example of synchronous fixture . 17
Figure 8 – Typical output shape of signal in the synchronous method . 18
Figure 9 – Example of the system for temperature profile method test equipment . 19
Figure 10 – Example of the temperature profile . 20
Figure 11 – Example of applying solder paste to a test jig plate . 22
Figure 12 – Typical output shape of signal in the temperature profile method . 23
Figure B.1 – Typical wetting force changes in quick heating method . 26
Figure B.2 – Example of correction of the initial time of wetting (F is larger than
a
0,5F ) . 27
1,max
Figure B.3 – Example of correction of the initial time of wetting (F is 0,5F or
a 1,max
less) . 27
Figure D.1 – Typical output forms for profile temperature test . 30
Figure D.2 – The case when an extruding force (1,1F or larger) is generated
max
immediately after the beginning of wetting . 31
Figure E.1 – Explanation diagram of test procedure for the quick heating method . 33
Figure E.2 – Explanation diagram of test procedure for synchronous method . 34
Figure E.3 – Showing the wetting force (pull) of some solder pastes . 34
Figure E.4 – Explanation diagram of the test procedure for the temperature profile

method . 35

Table 1 – Specification of the test jig plate for quick heating and synchronous method . 11
Table 2 – Recommended test conditions of the quick heating and synchronous method
for rectangular SMD . 14
Table 3 – Specification of the test jig plate of the temperature profile method . 20
Table 4 – Recommended test conditions of the temperature profile method for
rectangular SMD . 21

– 4 – 60068-2-83  IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 2-83: Tests – Test Tf: Solderability testing
of electronic components for surface mounting devices (SMD)
by the wetting balance method using solder paste

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
International Standard IEC 60068-2-83 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/975/FDIS 91/992/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

60068-2-83  IEC:2011 – 5 –
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – 60068-2-83  IEC:2011
INTRODUCTION
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of patents as indicated below.
IEC takes no position concerning the evidence, validity and scope of patent rights.
The holders of the patent rights have assured the IEC that they are willing to negotiate
licences either free of charge or under reasonable and non-discriminatory terms and
conditions with applicants throughout the world. In this respect, the statement of the holders
of these patent rights are registered with IEC. Information may be obtained as indicated below.
a) EU patent 0920488.4 “Synchronous test method for assessing soldering pastes”
Gen3 Systems LTD
Unit B2
Armstrong Mall
Farnborough GU14 0NR
United Kingdom
b) JP Patent 2630712 “Testing method of characteristics of solder paste and the
equipment for the test”
Malcom Co., Ltd
4-15-10 Honmachi, Shibuya-ku
Tokyo, 151-0071
Japan
c) Patent JP 3789041 “Solderability measuring apparatus”
Patent JP 3552061 “Solderability tester and solderability test method”
Patent JP 3498100 “Method and device for testing solderability and microcrucible for
testing”
Patent JP 3153884 “Measuring device for soldering performance of cream solder”
Tarutin Kester Co., Ltd.
2-20-11 Yokokawa,
Sumida-ku
Tokyo, 130-0003
Japan
d) Sony Corporation
1-7-1 Konan Minato-ku
Tokyo 108-0075
Japan
Attention is drawn to the possibility that some of the elements of this standard may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
—————————
Status of patent: Pending.
60068-2-83  IEC:2011 – 7 –
ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of
patents relevant to their standards. Users are encouraged to consult the data bases for the
most up to date information concerning patents.

– 8 – 60068-2-83  IEC:2011
ENVIRONMENTAL TESTING –
Part 2-83: Tests – Test Tf: Solderability testing
of electronic components for surface mounting devices (SMD)
by the wetting balance method using solder paste

1 Scope
This part of IEC 60068 provides methods for comparative investigation of the wettability of the
metallic terminations or metallized terminations of SMDs with solder pastes.
Data obtained by these methods are not intended to be used as absolute quantitative data for
pass – fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69.
IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes
wetting balance evaluation using solder bath and solder globule method.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60068-1,
IEC 60068-2-20:2008, IEC 60068-2-58, IEC 60194, and IEC 61190-1-3 and the following
apply.
3.1
wettability
ease with which a metal or metal alloy can be wetted by molten solder

60068-2-83  IEC:2011 – 9 –
3.2
wetting balance method
method to measure wetting performance and solderability by measuring vertical force
(difference with surface tension and buoyancy) to the specimen and recording as a function of
time, when the specimen is immersed into molten solder
3.3
starting point of heating
time of the start of temperature rise by heating the solder paste applied to a testing jig
3.4
zero line
line extended to the time axis of the force experienced by the specimen as indicated by the
test equipment (force sensor) when the specimen is taken out from the molten solder after the
end of the measurement
4 Test
4.1 General description
The specimen is held on a holder suitable to the specimen and is suspended from sensitive
balance. The specimen is immersed into solder paste applied onto the test jig plate, then
solder paste is heated to melt. The resultant of the vertical forces of buoyancy and surface
tension (hereafter, referred to as “acting force”) acting upon the immersed specimen by force
sensor and converted into a signal which is continuously recorded or monitored as a function
of time on recorder.
NOTE The wetting force can be evaluated only for components of the same shape and size. The absolute
evaluation is not achieved by this method.
4.2 Test methods
There are three methods as described below. The choice of the method shall be specified in
the relevant specification.
a) Quick heating method: The wettability of electrodes of a component is evaluated while the
solder paste is melted in a rapid temperature rise. The specimen is immersed in the solder
paste before the temperature rise starts.
b) Synchronous method: The wettability of electrodes of a component is evaluated while the
solder paste is melted due to a rapid temperature rise. The specimen is immersed in the
solder paste when the temperature rise starts.
c) Temperature profile method: Solder paste is melted using a similar temperature profile
used in production and the wettability of the electrodes of a component is evaluated.
NOTE 1 This test (Tf) may be applicable to leaded SMD packages. In order to achieve comparable and
repeatable results, test Tf should be done on straight leads.
NOTE 2 Solder paste to be used is not specified in this standard.
5 Preconditioning
Unless otherwise specified in the detailed specification of the component, the test shall be
made on the specimens as received and care shall be taken not to contaminate the
specimens by fingers and other items. The specimen may be immersed in organic solvent at
room temperature to remove possible contamination such as grease attached to the surface if
the preconditioning is specified in the specification. No other method shall be used to clean
the specimen. The specimen thus cleaned may be dried in air.

– 10 – 60068-2-83  IEC:2011
When accelerated ageing is prescribed by the relevant specification, one of the methods of
4.1.4 (Ageing 1) of IEC 60068-2-20:2008 shall be used. The aging condition shall be specified
in the relevant specification.
6 Preparation
6.1 Solder paste
Use solder paste that has been stored in a sealed container and stored in a dark environment
and below 10 °C, avoiding exposure to direct sunlight. Before conducting this test, it is
important to prepare the solder paste properly.
a) The solder paste shall be allowed to achieve ambient conditions that shall be nominally
25 °C ± 5 °C and 50 % RH ± 10 % for 8 h or in accordance with the manufacturer’s data
sheet.
b) Open the supply container(s); remove any internal cover, scrape off paste adhering to the
lid(s), internal covers, and the container walls; and add this material to the paste in the
supply container(s).
c) Using a spatula, stir the paste gently for 1 min to 2 min to homogenize it; taking care to
avoid the introduction of air.
If necessary, gently transfer the paste to a test container of sufficient volume, taking care
to avoid the introduction of air.
6.2 Test jig plate
Test jig plates shall be stored in a sealed container. Immediately prior to their use, they shall
be cleaned using acid such as dilute hydrochloric acid. A new test jig plate shall be used for
each test. Unused test jig plates shall be discarded and not be returned to the sealed
container.
6.3 Specimen holder
The specimen holder is usually contaminated by creeping of flux used in a test. A specimen
holder shall be cleaned using a neutral organic solvent. It is desirable to use ultrasonic
agitation in cleaning.
7 Quick heating method
7.1 Equipment
The equipment used for the quick heating method consists of a measurement, heating and lift
system, as shown in Figure 1. The detailed requirements to the equipment are specified in
Annex A.
a) The measuring system consists of the force sensor that can measure the force vertically
acted on a specimen, signal transducer and a recorder.
b) The heating system shall be capable of controlling the determined set temperature within
± 3 °C.
c) The lift system shall be capable of carrying out immersion and withdrawal of the specimen,
as specified in 7.4.3.
60068-2-83  IEC:2011 – 11 –
9 10 11
5 6
IEC  1936/11
Key
1 Specimen 7 Holding jig of a test jig plate
2 Test jig plate 8 Housing
3 Solder paste 9 Sensor
4 Heating bath 10 Transducer
5 Lift for test jig plate 11 Recorder
6 Lift for heating bath 12 Controller
Figure 1 – Examples of the quick heating method test equipment
7.2 Test jig plate
The test jig plate shall be as specified in Table 1.
Table 1 – Specification of the test jig plate for quick heating and synchronous method
Item Specification of the test jig
Material Oxygen-free phosphate copper
Shape Circular indented pan
Dimensions (L, W) Less than 30 mm one the side, or less than a total area of 900 mm
Thickness (l) 0,3 mm ± 0,03 mm
9 mm to 10 mm at the bottom,
Drawn diameter
(D , D )
1 2 13 mm to 14 mm at the top
Drawn depth (h)
0,4 mm ± 0,04 mm
Solder resist (D , D )
Inner diameter of 10 mm ± 0,02 mm, and over 20 mm for the outer diameter
3 4
Resist coat thickness 0,035 mm ± 0,01 mm
Warp
± 0,05 mm (for the longer side for a rectangular shape)
An example of the test jig plate used in the quick heating and synchronous method is shown
in Figure 2.
– 12 – 60068-2-83  IEC:2011
L  A-A’
D
D
h (0,4 ± 0,04)
l (0,3± 0,03)
A
A’
W
D (10 ± 0,02)
D
IEC  1937/11
Key
1 Drawing for solder resist h Drawing depth
2 Solder resist l Thickness
L, W Outer dimension
D Outer diameter of drawing D Inner diameter of solder resist
1 3
D Inner diameter of drawing D Outer diameter of solder resist
2 4
Figure 2 – Example of test jig plate for quick heating and synchronous method
7.3 Preparation
See Clause 6 for details.
7.4 Test condition
7.4.1 Test temperature
The test jig plate shall be processed using the temperature profile as specified. Figure 3
shows a typical example.
60068-2-83  IEC:2011 – 13 –
t
t
T
T
Time (s)
t
IEC  1938/11
Symbol SAC type Sn-Pb type
T 217 °C 183 °C
T 245 °C ± 3 °C 235 °C ± 3°C
Key
T Solder melting temperature T Test temperature
1 2
t Test duration (5 s to15 s) t Time from start to T
1 1
t Time from start to T
2 2
The test starts at a temperature of 50 °C or less.
Time from start to T (t ) shall be 1,5 s or less.
1 1
Time from start to T (t ) shall be 3 s or less.
2 2
The ramp down rate is not specified.
Figure 3 – Example of the temperature profile
7.4.2 Feed of solder paste and immersion condition
The recommended condition of immersing a specimen into the solder paste is given in Table 2.
For components not specified in Table 2, test conditions shall be specified in the relevant
specification or agreed upon between the trading partners.
Temperature (°C)
– 14 – 60068-2-83  IEC:2011
Table 2 – Recommended test conditions of the quick heating
and synchronous method for rectangular SMD
Angle and direction of
a b, c
Sizes of specimen Immersion depth specimen immersing
into solder paste
1005 (0402) 0,15 mm Horizontal
1608 (0603)
Resistors Rectangular SMD
2012 (0805) 0,20 mm
3216 (1206)
1005 (0402) 0,15 mm
Solder paste
1608 (0603)
Capacitors
2012 (0805) 0,20 mm
3216 (1206)
a
Designation of the size, for example of 1005, means a specimen with a length of 1,0 mm and a width
of 0,5 mm. In parentheses, dimensions are expressed in Imperial.
b
The immersion depths specified in this table are recommended since the buoyancy force varies
depending upon the electrode configuration.
c
The immersion depth is the target values.
7.4.3 Immersion and withdrawal conditions for test specimen
The immersion speed of the specimen into the solder paste shall be 0,5 mm/s to 1 mm/s. The
immersion speed of the test jig into the heating bath shall be 1 mm/s to 5 mm/s.
7.5 Test procedure
Test procedure shall be as follows.
a) Apply solder paste to the test jig keeping the surface flat. Figure 4 shows an example.

IEC  1939/11
Key
1 Test jig plate 3 Squeegee
2 Solder paste 4 Direction of squeeze movement
Figure 4 – Example of applying solder paste to a test jig plate
b) Mount a specimen into the clip until the angle specified in 7.4.2 is realized. The clip shall
be centralised to the upper surface of a test jig plate into which the solder paste has been
applied.
c) Adjust the output of the force sensor and the recorder to zero before the test commences.
d) The specimen shall be immersed into the solder paste to the specified depth in 7.4.2.
Then, heat the jig plate to melt the solder paste in accordance with the temperature profile
as specified in Figure 3.
NOTE The specimen may need to be immersed into the solder paste to the depth of twice or more the
specified depth, and then the specified depth. The purpose of this procedure is to apply flux on the portion of
the specimen which corresponds to the immersion depth, before heating.

60068-2-83  IEC:2011 – 15 –
e) Withdraw the specimen from the molten solder paste when measurement is finished.
Recording of the result is completed when the force reaches to a stable state or specified
duration.
7.6 Presentation of the result
The recorder records the force acted to the specimen in the vertical direction. The force acted
to the upper direction (pushing force or buoyancy) is recorded as a negative value, and the
force acted downward to the specimen (wetting force) is recorded as a positive value.
A typical shape of the output signal obtained is shown in Figure 5. The meaning and
correction of the data if different from the shape shown in Figure 5 are given in Annex B.

t
t
D
C 1
E1
B
A 1
Zero line
F
Time
IEC  1940/11
Key
A Reference point to start time measurement.
NOTE Point A is the first positive force peak during the test.
B Instance when the force curve crosses the zero line.
C Instance when the wetting force reaches to 2/3 of the maximum wetting force.
D Instance when the maximum force is obtained in the measurement.
E Instance when the specimen is withdrawn after the measurement is completed.
F Instance when the force reaches stable state after the specimen is withdrawn from the jig plate.
t Time to start wetting. Time duration from point A to point B .
01 1 1
t Wetting time. The time duration from point B to point C .
11 1 1
F Maximum wetting force. The maximum force obtained (the value from the zero line) in the measurement.
1,max
F Final wetting force. The force obtained (the value from the zero line) at the end of the test.
1,end
Figure 5 – Typical output shape of signal in the quick heating method
7.7 Characterisation parameter examples
a) The time to start wetting: t
b) Wetting time: t
c) Maximum wetting force: F
1,max
d) Wetting stability: Sb ; The ratio of the final wetting force (F ) and the maximum
1 1,end
wetting force (F ).
1,max
Acting force
Negative
Positive
2/3F
1,max
F
1,max
F
1,end
– 16 – 60068-2-83  IEC:2011
NOTE Wetting stability is calculated from Sb = F /F .
1 1,end 1,max
8 Synchronous method
8.1 Equipment
The equipment used for the synchronous method consists of measurement, heating and lift
system as shown in Figure 6. The detailed requirements to the equipment are specified in
Annex A.
a) The measuring system consists of the force sensor that can measure the force vertically
acted on a specimen, signal transducer and a recorder.
b) The heating system shall be capable of controlling the set temperature within the preset
tolerances specified in 8.5.1.
c) The lift system shall be capable of carrying out immersion and withdrawal of the specimen
as specified in 8.5.3.
d) The synchronous fixturing system shall be capable of permitting the simultaneous
immersion and heating of the specimen as specified in 8.6.

9              9

11 12
7 2
IEC  1941/11
Key
1 8
Specimen Mini crucible
2 9
Test jig plate Support bars with spring
3 10
Solder paste Sensor
4 11
Heating bath Transducer
5 12
Lift Recorder
6 13
Base Controller
Test jig plate holder
Figure 6 – Example of synchronous method test equipment

60068-2-83  IEC:2011 – 17 –
8.2 Test jig plate
The test jig plate shall be as specified in Table 1.
An example of the test jig plate used in the synchronous heating method is shown in Figure 2.
8.3 Synchronous fixture
An example of the synchronous fixture is shown below in Figure 7.

IEC  1942/11
Figure 7a – Test jig plate holder Figure 7b – Mini crucible
Figure 7 – Example of synchronous fixture
8.4 Preparation
See Clause 6 for details.
8.5 Test condition
8.5.1 Test temperature
The test jig plate shall be processed using the temperature profile as specified. Figure 3
shows a typical example.
8.5.2 Feed of solder paste and immersion condition
The recommended condition of immersing a specimen into the solder paste is given in Table 2.
For component not specified in Table 2, test conditions shall be specified in the relevant
specification or agreed upon between the trading partners.
8.5.3 Immersion and withdrawal conditions for the test specimen
The immersion speed of the specimen into the solder paste shall be 0,5 mm/s to 1 mm/s, and
that of the mini crucible shall be 1 mm/s to 5 mm/s.
8.6 Test procedure
Test procedure shall be as follows.
a) Apply solder paste to the test jig keeping the surface flat. Figure 4 shows an example.
b) Mount a specimen into the clip until the angle specified in 7.4.2 is realized. The clip shall
be centralised to the upper surface of a test jig plate into which the solder paste has been
applied.
c) Adjust the output of the force sensor and the recorder to zero before the test commences.

– 18 – 60068-2-83  IEC:2011
d) Mount the jig plate holder onto the supporting bars, adjust the supporting bars’ height just
above the surface of the solder paste close to the bottom edge of the electrode. Then,
heat the jig plate to melt the solder paste in accordance with the temperature profile, as
specified in Figure 3, and the specimen and the solder paste are then brought into contact
synchronously. The immersion speed shall be as specified in 8.5.3.
e) Withdraw the specimen from the molten solder paste when the measurement is finished.
Recording of the result is completed when the force reaches stable state or after a
specified duration.
8.7 Presentation of the results
The recorder records the force acted to the specimen in the vertical direction. The force acted
to the upper direction (pushing force or buoyancy) is recorded as a negative value, and the
force acted downward to the specimen (wetting force) is recorded as a positive value.
A typical shape of the output signal obtained is shown in Figure 8.
B C
2 2
t
D
E
t
A
Zero line
Time
IEC  1943/11
Key
A Instance when the measurement starts. The specimen is brought in contact with solder paste that is
melting.
B Instance when the output crosses the zero line. The downward force of the surface tension is exactly
equal to the buoyancy force.
C Instance when the wetting force reaches 2/3 of the maximum wetting force.
D Instance when the maximum wetting force is obtained in the measurement.
E Instance when the specimen is withdrawn and the measurement is completed.
t Time to start wetting. Time duration from point A to point B .
02 2 2
t Wetting time. The time duration from point B to C .
12 2 2
F Maximum wetting force. The maximum force optained (the value from the zero line) in the
2,max
measurement.
2/3 of the maximum wetting force.
2/3 F
2,max
F Final wetting force. The force obtained (the value from the zero line) at the end of the test.
2,end
NOTE Certain solder pastes may cause an initial wetting (pull) force that may be attributed to the wetting agents
contained in some solder pastes (see Annex E).
Figure 8 – Typical output shape of signal in the synchronous method
Acting force
Negative
Positive
2/3 F
2,max
F
2,max
F
2,end
60068-2-83  IEC:2011 – 19 –
8.8 Characterisation parameter examples
a) The time to start wetting: t
b) Wetting time: t
c) Maximum wetting force: F
2,max
d) Wetting stability: Sb ; The ratio of the final wetting force (F ) and the maximum wetting
2 2,end
force (F ).
2,max
NOTE Wetting stab
...