EN 61191-3:1998
(Main)Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage
Ensembles de cartes imprimées - Partie 3: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage de trous traversants
Décrit les exigences relatives aux ensembles de composants à trous traversants (broches et trous) montés par brasage. Les exigences s'appliquent aux ensembles entièrement constitués d'après une technique de montage par trous traversants (THT) et aux portions THT d'ensembles incluant d'autres techniques associées (par exemple montage en surface, montage à puce, montage à borne).
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
General Information
- Status
- Withdrawn
- Publication Date
- 27-Oct-1998
- Withdrawal Date
- 30-Jun-2001
- Technical Committee
- CLC/SR 91 - Electronics assembly technology
- Drafting Committee
- IEC/TC 91 - IEC_TC_91
- Parallel Committee
- IEC/TC 91 - IEC_TC_91
- Current Stage
- 9960 - Withdrawal effective - Withdrawal
- Start Date
- 04-Jul-2020
- Completion Date
- 04-Jul-2020
Relations
- Effective Date
- 05-Sep-2017
Frequently Asked Questions
EN 61191-3:1998 is a standard published by CLC. Its full title is "Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies". This standard covers: Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
EN 61191-3:1998 is classified under the following ICS (International Classification for Standards) categories: 31.240 - Mechanical structures for electronic equipment. The ICS classification helps identify the subject area and facilitates finding related standards.
EN 61191-3:1998 has the following relationships with other standards: It is inter standard links to EN 61191-3:2017. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN 61191-3:1998 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-marec-2001
Printed board assemblies - Part 3: Sectional specification - Requirements for
through-hole mount soldered assemblies
Printed board assemblies -- Part 3: Sectional specification - Requirements for through-
hole mount soldered assemblies
Elektronikaufbauten auf Leiterplatten -- Teil 3: Rahmenspezifikation - Anforderungen an
gelötete Baugruppen in Durchsteckmontage
Ensembles de cartes imprimées -- Partie 3: Spécification intermédiaire - Exigences
relatives à l'assemblage par brasage de trous traversants
Ta slovenski standard je istoveten z: EN 61191-3:1998
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
SIST EN
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