CECC 23 200-801:1998

Overview

CECC 23 200-801:1998 is a Capability Detail Specification (CDS) published under CLC procedures for single and double-sided printed boards with plated‑through holes. It supersedes EN 123200-800:1992 and relates to CECC/SC 52 (disbanded). The specification defines the capability, acceptance and qualification expectations for manufacturers of printed circuit boards (PCBs) with metallized (plated) through-holes and was later adopted as SIST CECC 23 200-801:2002 in Slovenia. ICS classification: 31.180 - Printed circuits and boards.

Key Topics

This capability detail specification focuses on the practical and quality aspects of single- and double-sided PCBs with plated-through holes. Key topics typically covered include:

• Scope and definitions relevant to single-sided and double-sided printed boards with plated-through holes.
• Manufacturer capability and qualification requirements for producing plated-through hole boards.
• Material and construction considerations for base substrates, copper cladding and plating interfaces (general, not prescriptive values).
• Manufacturing process controls including drilling, through-hole plating and pattern etching as part of capability demonstration.
• Inspection and test methods to verify plating integrity, hole quality, conductor pattern continuity and solderability.
• Acceptance criteria and sampling for production runs or qualification lots.
• Documentation and traceability expectations for supplier declarations, quality records and test reports.
• Quality assurance and compliance processes for demonstrating ongoing capability to supply conforming boards.

(Note: the above topics reflect the scope and structure of a CDS rather than specific numeric parameters; where precise limits are required, refer to the full standard text.)

Applications

CECC 23 200-801 is intended to be used by organizations that need standardized proof of capability and consistent quality for PCBs with plated-through holes:

• PCB manufacturers seeking to qualify processes and demonstrate capability to customers.
• OEMs and electronics manufacturers who require supplier qualification for single- and double-sided boards.
• Procurement and quality engineers issuing purchase specifications or supplier audits.
• Contract electronics manufacturers and contractors integrating PCB supply chains.
• Regulatory/compliance teams needing harmonized documentation for cross-border sourcing.

Using this CDS helps reduce supplier risk, speed qualification, and ensure interoperability of procurement requirements.

Related standards

• EN 123200-800:1992 (superseded)
• National adoptions such as SIST CECC 23 200-801:2002
• Other PCB and IPC standards (for detailed test methods and numerical tolerances) - consult relevant IPC/IEC documents when precise technical parameters are needed.

Keywords: CECC 23 200-801, capability detail specification, printed circuit boards, plated-through holes, single-sided PCB, double-sided PCB, CECC, CLC, SIST.