CECC 23 700-801:1998

Overview

CECC 23 700-801:1998 is a Capability Detail Specification published under the CLC framework that defines requirements for flex-rigid double-sided printed boards with through connections. The standard covers assemblies made with specified materials and surface finishes, and is intended to describe the capability and acceptance criteria for manufacturers producing these hybrid flexible‑rigid printed circuit boards (PCBs). It is used to harmonize supplier capabilities and ensure consistent quality across procurement and production.

Key Topics

• Scope and definitions - Terminology specific to flex‑rigid and double‑sided PCBs, and the meaning of “through connections” in this context.
• Materials - Requirements related to substrate laminates, flexible and rigid core materials, adhesives and bonding layers (general material categories rather than proprietary specifications).
• Surface finishes - Acceptable coating or plating types used to protect conductive surfaces and finish through connections.
• Construction and layer stack-up - General expectations for combining flexible and rigid sections, layer arrangement and transitions between flex and rigid zones.
• Through connections - Functional and manufacturing considerations for plated or filled through‑holes and vias that provide interconnection between board faces.
• Quality and capability criteria - Manufacturer capability statements, inspection/acceptance criteria, and production controls that demonstrate compliance with the specification.
• Documentation and marking - Requirements for drawings, process documentation, and traceability for supplied parts.

(Note: the standard text provides the scope and title; for specific test methods or numeric tolerances, consult the full CECC document.)

Applications

This specification is practical for organizations that design, specify, procure or manufacture flex‑rigid double‑sided printed boards with through connections, including:

• PCB fabricators and contract manufacturers seeking recognized capability criteria.
• OEM procurement and quality engineers who need supplier qualification requirements.
• Design and product engineers working on compact or mechanically complex electronics where flex‑rigid PCBs are used (e.g., consumer electronics, medical devices, automotive modules, industrial controllers).
• Certification and compliance teams aligning supplier capabilities with European component acceptance schemes.

Using CECC 23 700-801 helps buyers and manufacturers ensure consistent material selection, surface finish practices and reliable through‑connection manufacturing for hybrid flex‑rigid board solutions.

Related Standards (if applicable)

This CECC capability specification is typically used alongside other industry standards and guidance for PCB design, materials and testing (for example, established IPC and IEC/EN documents). Consult the full CECC publication and relevant industry standards for detailed test methods, dimensional tolerances and qualification procedures.