EN IEC 61188-6-4:2019

SLOVENSKI STANDARD
01-november-2019
Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-4. del:
Razmestitev priključkov - Splošne zahteve za merske risbe elementov za
površinsko montažo (SMD) glede na razmestitev njihovih priključkov
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern
design - Generic requirements for dimensional drawings of surface mounted components
(SMD) from the viewpoint of land pattern design
Ta slovenski standard je istoveten z: EN IEC 61188-6-4:2019
ICS:
01.100.25 Risbe s področja Electrical and electronics
elektrotehnike in elektronike engineering drawings
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61188-6-4

NORME EUROPÉENNE
EUROPÄISCHE NORM
July 2019
ICS 31.180
English Version
Printed boards and printed board assemblies - Design and use -
Part 6-4: Land pattern design - Generic requirements for
dimensional drawings of surface mounted components (SMD)
from the viewpoint of land pattern design
(IEC 61188-6-4:2019)
Cartes imprimées et cartes imprimées équipées - Leiterplatten und Flachbaugruppen - Konstruktion und
Conception et utilisation - Partie 6-4: Conception de la zone Anwendung - Teil 6-4: Allgemeine Anforderungen an SMD-
de report - Exigences génériques pour les dessins Maßzeichnungen hinsichtlich der Konstruktion des
dimensionnels de composants montés en surface (CMS) du Anschlussflächenbilds
point de vue de la conception de la zone de report (IEC 61188-6-4:2019)
(IEC 61188-6-4:2019)
This European Standard was approved by CENELEC on 2019-06-06. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of Nort Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2019 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61188-6-4:2019 E
EN 61188-6-4:2019 (E)
European foreword
The text of document 91/1561/FDIS, future edition 1 of IEC 61188-6-4, prepared by IEC/TC 91 "Electronics
assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
EN 61188-6-4:2019.
The following dates are fixed:
• latest date by which the document has to be implemented at national level by (dop) 2020-03-06
publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2022-06-06
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61188-6-4:2019 was approved by CENELEC as a European
Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60191-1 NOTE Harmonized as EN IEC 60191-1
IEC 60191-6 NOTE Harmonized as EN 60191-6
IEC 60191-6-1 NOTE Harmonized as EN 60191-6-1
IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1
IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2
IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3
IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4
IEC 61188-5-5 NOTE Harmonized as EN 61188-5-5
IEC 61188-5-6 NOTE Harmonized as EN 61188-5-6
IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8
IEC 61191-1 NOTE Harmonized as EN IEC 61191-1
IEC 61191-2 NOTE Harmonized as EN 61191-2
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content constitutes
requirements of this document. For dated references, only the edition cited applies. For undated references, the
latest edition of the referenced document (including any amendments) applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu.

Publication Year Title EN/HD Year
IEC 60194 -  Terms and definitions for printed circuits - -
IEC 60194-2 -  Printed boards design, manufacture and
- -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61188-6-4 ®
Edition 1.0 2019-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed boards and printed board assemblies – Design and use –

Part 6-4: Land pattern design – Generic requirements for dimensional drawings

of surface mounted components (SMD) from the viewpoint of land pattern

design
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –

Partie 6-4: Conception de la zone de report – Exigences génériques pour les

dessins dimensionnels de composants montés en surface (CMS) du point

de vue de la conception de la zone de report

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-6866-7

– 2 – IEC 61188-6-4:2019 © IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and symbols. 6
4 Applicable SMDs . 8
5 Requirements . 9
5.1 Figures and dimensional symbols . 9
5.2 Common requirements . 9
5.2.1 General . 9
5.2.2 Requirements for solder joint fillet design . 9
5.2.3 Requirements for courtyard design . 10
5.2.4 Height parameters . 10
5.2.5 Bottom view . 12
5.2.6 Detail view . 12
5.2.7 Distinguish between metal and resin . 12
5.2.8 Consistency of various dimensions . 12
5.2.9 The relation between a land pattern and an element-placement position . 13
5.2.10 Coplanarity . 14
5.3 Requirements for a specific SMD . 14
5.3.1 General . 14
5.3.2 End-terminal type . 14
5.3.3 Gull-wing terminals type, inward L-shaped ribbon terminals type and
under-body L type . 18
5.3.4 Bottom surface terminal type and flat lug terminals type . 30
6 Supplementary dimensions . 39
Bibliography . 40

Figure 1 – Example of the dimensional relationship to the drawings of SMDs, the land
pattern design and the after soldering state . 12
Figure 2 – Example of dimensional consistency for an asymmetrical SMD . 13
Figure 3 – Example of the direction of recommendation for land pattern position of an
asymmetrical SMD . 14
Figure 4 – Influence of good and bad (after soldering) coplanarity . 14
Figure 5 – Example of the dimensional relationship between the drawings of
components with rectangular terminals and the land pattern design . 16
Figure 6 – Example of the dimensional notations for a component with rectangular
terminals . 17
Figure 7 – Example of the dimensional notations for cylindrical components with end
cap terminals . 18
Figure 8 – Example of the dimensional relationship between the drawings of gull-wing
terminals type and the land pattern design . 19
Figure 9 – Example of the dimensional notations for gull-wing terminals type (QFP) . 20
Figure 10 – Details of terminal (case 1) . 21
Figure 11 – Details of terminal (case 2) . 22
Figure 12 – Details of terminal (case 3) . 22

IEC 61188-6-4:2019 © IEC 2019 – 3 –
Figure 13 – Details of terminal (case 4) . 23
Figure 14 – Details of terminal (case 5) . 23
Figure 15 – Example of the dimensional relationship between the drawings of inward
L-shaped ribbon terminals type and the land pattern design . 24
Figure 16 – Example of the dimensional notations for inward L-shaped ribbon terminals

type . 25
Figure 17 – Example of the dimensional notations for under-body L type . 26
Figure 18 – Terminal shape expansion drawing of under-body L type (capacitor) . 27
Figure 19 – Example of the dimensional notations for a connector . 28
Figure 20 – The cross-sectional a-a detail (terminal shape) of Figure 18, side view . 29
Figure 21 – Example of the drawing showing the moving range (lock lever open state) . 29
Figure 22 – Example of the upper surface cap constitution . 29
Figure 23 – Example of the dimensional relationship between the drawings of a BGA
and the land pattern design. 31
Figure 24 – Example of the dimensional notations for BGA . 32
Figure 25 – Example of details of solder balls (side view) . 33
Figure 26 – Example of the dimensional relationship between the drawings of QFN and
the land pattern design . 34
Figure 27 – Example of the dimensional notations for bottom surface terminals .
...