EN IEC 61189-2-805:2024

SLOVENSKI STANDARD
01-januar-2022
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-805. del: Preskus X/Y CTE s termomehansko analizo (TMA)
za tanke podložne materiale
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-805: Essai à faible CDT X/Y par TMA
pour matériaux de base minces
Ta slovenski standard je istoveten z: prEN IEC 61189-2-805:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

91/1755/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61189-2-805 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2021-10-22 2022-01-14
SUPERSEDES DOCUMENTS:
91/1696/CD, 91/1752/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:

Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which
they are aware and to provide supporting documentation.

TITLE:
Test methods for electrical materials, printed board and other interconnection structures and
assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

PROPOSED STABILITY DATE: 2027
NOTE FROM TC/SC OFFICERS:
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.

IEC CDV 61189-2-805-Ed1  IEC:2021 – 2 – 91/1755/CDV
2 CONTENTS
4 FOREWORD . 3
5 1  Scope . 5
6 2  Normative references . 5
7 3 Terms and definitions. 5
8 4 Test Specimens . 5
9 4.1 Preparation . 5
10 4.2 Number …………………………………………………………………………………….5
11 4.3  Form . 5
12 4.4  Conditioning . 6
13 5 Apparatus and Materials . 6
14 6 Procedure . 6
15 7 Evaluation . 7
16 7.1 Calculation of coefficient of thermal expansion curve . 8
17 a) CTE below glass transition . 8
18 b) CTE above glass transition . 8
19 7.2 Calculation of instantaneous coefficient of thermal expansion curve
20 (optional) . 9
21 8 Report . 9
23 Figure 2 – TMA expansion curve . 7
IEC CDV 61189-2-805-Ed1  IEC:2021 – 3 – 91/1755/CDV
27 INTERNATIONAL ELECTROTECHNICAL COMMISSION
28 ____________
30 Test methods for electrical materials, printed board
31 and other interconnection structures and assemblies–
33 Part 2-805: X/Y CTE Test for Thin Base Materials by TMA
36 FOREWORD
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64 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
65 indispensable for the correct application of this publication.
66 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
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68 International Standard IEC 61189-2-805 has been prepared by subcommittee WG 10 of IEC
69 technical committee TC 91
70 The text of this International Standard is based on the following documents:
FDIS Report on voting
XX/XX/FDIS XX/XX/RVD
72 Full information on the voting for the approval of this International Standard can be found in the
73 report on voting indicated in the above table.
74 This docu
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