EN IEC 61189-2-720:2024

SLOVENSKI STANDARD
oSIST prEN IEC 61189-2-720:2023
01-april-2023
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-720. del: Odkrivanje napak v povezovalnih strukturah z
merjenjem kapacitivnosti
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-720: Detection of defects in interconnection structures by
measurement of capacitance
Ta slovenski standard je istoveten z: prEN IEC 61189-2-720:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
oSIST prEN IEC 61189-2-720:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

oSIST prEN IEC 61189-2-720:2023

oSIST prEN IEC 61189-2-720:2023
91/1832/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61189-2-720 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2023-02-10 2023-05-05
SUPERSEDES DOCUMENTS:
91/1786/CD, 91/1829/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:

Other TC/SCs are requested to indicate their interest, if
any, in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft
for Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of
• any relevant patent rights of which they are aware and to provide supporting documentation,
• any relevant “in some countries” clauses to be included should this proposal proceed. Recipients are
reminded that the enquiry stage is the final stage for submitting "in some countries" clauses. See
AC/22/2007.
TITLE:
Test methods for electrical materials, printed board and other interconnection structures and
assemblies – Part 2-720: Detection of defects in interconnection structures by measurement of
capacitance
PROPOSED STABILITY DATE: 2028
NOTE FROM TC/SC OFFICERS:
download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National
Committee positions. You may not copy or "mirror" the file or printed version of the document, or any part of it,
for any other purpose without permission in writing from IEC.

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1 CONTENTS
3 FOREWORD . 3
4 1 Scope . 5
5 2 Normative references . 5
6 3 Terms and Definitions . 5
7 4 Objective . 5
8 5 Test specimen . 6
9 6 Test method . 6
10 7. Test procedures . 7
11 8. Report . 7
12 Annex A . 9
13 A.1 Test schematic . 9
14 A.2 Test result . 9
16 Figure 1 – The capacitance difference depending on the defect of mouse bite . 5
17 Figure 2– Test specimen . 6
18 Figure 3 – Schematic of the capacitance test method . 6
19 Figure 4 – Test schematic . 9
21 Table 1 – Test result for the test specimen . 10
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24 INTERNATIONAL ELECTROTECHNICAL COMMISSION
25 ____________
27 Test methods for electrical materials, printed board and other
28 interconnection structures and assemblies – Part 2-720: Detection of
29 defects in interconnection structures by measurement of capacitance
32 FOREWORD
33 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
34 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
35 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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41 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
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60 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
61 indispensable for the correct application of this publication.
62 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
63 rights. IEC shall not be held responsible for identifying any or all such patent rights.
64 International Standard IEC 61189-2-720 has been prepared by IEC technical committee TC91:
65 Electronics assembly technology.
66 The text of this International Standard is based on the following documents:
FDIS Report on voting
XX/XX/FDIS XX/XX/RVD
68 Full information on the voting for the approval of this International Standard can be found in the
69 report on voting indicated in the above table.
70 This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
71 The committee has decided that the contents of this document will remain unchanged until the
72 stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
73 the specific document. At this date, the document will be

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74 • reconfirmed,
75 • withdrawn,
76 • replaced by a revised edition, or
77 • amended.
79 The National Committees are requested to note that for this document the stability date
80 is 2028.
81 THIS TEXT IS INCLUDED FOR THE INFORMATION
...