HD 323.2.20 S3:1988
(Main)Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).
Umweltprüfungen - Teil 2: Prüfungen - Prüfgruppe T: Löten
Essais fondamentaux climatiques et de robustesse mécanique - Partie 2: Essais - Essai T: Soudure
Décrit les modes opératoires des essais de "soudabilité" applicables aux sorties par fils ou par cosses (Ta), ou aux cartes de circuits imprimés (Tc) : décrit les essais de résistance à la chaleur de soudage, applicables aux composants (Tb).
Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
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SLOVENSKI SIST HD 323.2.20 S3:2003
STANDARD
julij 2003
Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
ICS 19.040 Referenčna številka
SIST HD 323.2.20 S3:2003(en)
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