prEN IEC 62680-1-2:2025

SLOVENSKI STANDARD
01-julij-2025
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2.
del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB
Universal serial bus interfaces for data and power - Part 1-2: Common components -
USB power delivery specification
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie
1-2: Composants communs - Spécification de l'alimentation électrique par port USB
Ta slovenski standard je istoveten z: prEN IEC 62680-1-2:2025
ICS:
35.200 Vmesniška in povezovalna Interface and interconnection
oprema equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

100/4327/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62680-1-2 ED8
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2025-06-06 2025-08-29
SUPERSEDES DOCUMENTS:
100/4319/RR
IEC TA 18 : MULTIMEDIA HOME SYSTEMS AND APPLICATIONS FOR END-USER NETWORKS
SECRETARIAT: SECRETARY:
Japan Mr Keisuke Koide
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):

ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING

This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some Countries” clau ses
to be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for submitting ISC
clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).

TITLE:
Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery
specification
PROPOSED STABILITY DATE: 2030
NOTE FROM TC/SC OFFICERS:
I have attached the specification provided by USB-IF. I would like you to convert this document into IEC format and
make it into a CDV.
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.

Universal Serial Bus
Power Delivery Specification
Revision: 3.2
Version: 1.1
Release Date: 2024-10
Revision History
Revision Version Comments Issue Date
1.0 1.0 Initial release Revision 1.0 5 July, 2012
1.0 1.1 Including errata through 31-October-2012 31 October 2012
1.0 1.2 Including errata through 26-June-2013 26 June, 2013
1.0 1.3 Including errata through 11-March-2014 11 March 2014
2.0 1.0 Initial release Revision 2.0 11 August 2014
2.0 1.1 Including errata through 7-May 2015 7 May 2015
2.0 1.2 Including errata through 25-March-2016 25 March 2016
2.0 1.3 Including errata through 11-January-2017 11 January 2017
3.0 1.0 Initial release Revision 3.0 11 December 2015
3.0 1.0a Including errata through 25-March-2016 25 March 2016
3.0 1.1 Including errata through 12-January-2017 12 January 2017
3.0 1.2 Including errata through 21-June-2018 21 June 2018
3.0 2.0 Including errata through 29-August-2019 29 August 2019
3.1 1.0 Including errata through May 2021 May 2021

3.1 1.1 Including errata through July 2021

This version incorporates the following ECNs:
July 2021
⚫ EPR Clarifications
⚫ Define AMS starting point
3.1 1.2 Including errata through October 2021

This version incorporates the following ECNs:

⚫ Clarify use of Retries
⚫ Battery Capabilities October 2021
⚫ FRS timing problem
⚫ PPS power rule clarifications
⚫ Peak current support for EPR AVS APDO

3.1 1.3 This version incorporates the following ECNs:

⚫ Robust EPR Source Operation
⚫ EPR Source Caps Editorial January 2022
⚫ SRC PPS behavior in low current request
⚫ Enter USB
3.1 1.4 Editorial changes
This version incorporates the following ECNs:

⚫ Capabilities Mismatch Update April 2022
⚫ Chunking Timing Issue
⚫ OT Mitigation
Page 2 Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10

Revision Version Comments Issue Date
3.1 1.5 Editorial changes
This version incorporates the following ECNs:

⚫ Timer Description Corrections July 2022
⚫ Change Source_Info Requirements
⚫ AMS Update
3.1 1.6 Editorial changes
This version incorporates the following ECNs:

⚫ USB4® V2 Updates
⚫ Data Reset Issues
October 2022
⚫ Increase tSenderResponse
⚫ PPS Power Limit Bit Update
⚫ Support for Asymmetric Mode
⚫ Timer Description Corrections Revisited
3.1 1.7 Editorial Changes
This version incorporates the following ECNs:

⚫ Data Reset Invalid Reject Handling
January 2023
⚫ Source request
⚫ Source Transition
⚫ EPR Entry
3.1 1.8 Editorial Changes
This version incorporates the following ECNs:

⚫ Slew rate exemption for Power Role Swap.

⚫ EUDO cable speed clarification. April 2023
⚫ Update to PPS Requirements.
⚫ Deprecate Interruptibility.
⚫ Section 7.3 restructure and update.
3.1 1.9 Editorial Changes July 2023
Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10 Page 3

Revision Version Comments Issue Date
3.2 1.0 This version incorporates the following ECNs:

⚫ VDM-use Conditions.
⚫ tTypeCSinkWaitCap.
⚫ tFirstSourceCap Clarification

⚫ Hard Reset Clarification. October 2023
⚫ Unrecognized Country Code
⚫ EPR Entry Process-1
⚫ SPR AVS Definition
⚫ EPR Power Rules Clarifications
3.2 1.1 This version incorporates the following ECNs:

⚫ Power Transition time from EPR to PR_Swap

⚫ Capabilities Mismatch Update

⚫ Deprecate GotoMin and GiveBack Features and Update

Power Reserve
⚫ EPR Entry requirements Clarification

⚫ EPRMDO and Entry Clarification.

⚫ Remove 10.2.4 power sharing between ports

⚫ Source PDP rating field clarifications

⚫ Source Power Rules update.
October 2024
⚫ Source_Info Message Clarifications.
⚫ Correction to BMC description.
⚫ EPR Source cap clarification.
⚫ Delaying of VCONN Swap.
⚫ EPR_Request in SPR Mode.
⚫ Generic transition diagram.
⚫ Removing the usage of Ping message
⚫ Sink Standby
⚫ Source Info Support
Page 4 Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10

LIMITED COPYRIGHT LICENSE
THE USB 3.0 PROMOTERS GRANT A CONDITIONAL COPYRIGHT LICENSE UNDER THE COPYRIGHTS EMBODIED
IN THE USB POWER DELVERY SPECIFICATION TO USE AND REPRODUCE THE SPECIFICATION FOR THE SOLE
PURPOSE OF, AND SOLELY TO THE EXTENT NECESSARY FOR, EVALUATING WHETHER TO IMPLEMENT THE
SPECIFICATION IN PRODUCTS THAT WOULD COMPLY WITH THE SPECIFICATION. WITHOUT LIMITING THE
FOREGOING, USE THE OF SPECIFICATION FOR THE PURPOSE OF FILING OR MODIFYING ANY PATENT
APPLICATION TO TARGET THE SPECIFICATION OR USB COMPLIANT PRODUCTS IS NOT AUTHORIZED. EXCEPT
FOR THIS EXPRESS COPYRIGHT LICENSE, NO OTHER RIGHTS OR LICENSES ARE GRANTED, INCLUDING
WITHOUT LIMITATION ANY PATENT LICENSES. IN ORDER TO OBTAIN ANY ADDITIONALY INTELLECTUAL
PROPERTY LICENSES OR LICENSING COMMITMENTS ASSOCIATED WITH THE SPECIFICATION A PARTY MUST
EXECUTE THE USB 3.0 ADOPTERS AGREEMENT. NOTE: BY USING THE SPECIFICATION, YOU ACCEPT THESE
LICENSE TERMS ON YOUR OWN BEHALF AND, IN THE CASE WHERE YOU ARE DOING THIS AS AN EMPLOYEE, ON
BEHALF OF YOUR EMPLOYER.
INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY
WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE
AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF
ANY PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OF INFORMATION IN THIS
SPECIFICATION. THE PROVISION OF THIS SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
® ®
USB Type-C and USB4 are trademarks of the Universal Serial Bus Implementers Forum (USB-IF).
® ® ®
USB Type-C , USB-C and USB4 are trademarks of the Universal Serial Bus Implementers Forum (USB-IF).
DisplayPort™ is a trademark of VESA. Thunderbolt™ is a trademark of Intel Corporation. All product names are
trademarks, registered trademarks, or service marks of their respective owners.
You may only use the Thunderbolt™ trademark or logo in conjunction with products designed to this specification
that complete proper certification and executing a Thunderbolt™ trademark license - see http://usb.org/
compliance for further information.
All product names are trademarks, registered trademarks, or service marks of their respective owners.
Corporation, Renesas, STMicroelectronics, and Texas Instruments.
All rights reserved.
Please send comments via electronic mail to techsup@usb.org.
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org.
Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10 Page 5

Editors
Bob Dunstan
Richard Petrie
Contributors
Charles Wang ACON, Advanced-Connectek, Inc. Zaki Moussaoui Apple
Conrad Choy ACON, Advanced-Connectek, Inc. Jeff Liu ASMedia Technology Inc.
Dennis Chuang ACON, Advanced-Connectek, Inc. Kuo Lung Li ASMedia Technology Inc.
Steve Sedio ACON, Advanced-Connectek, Inc. Ming-Wei Hsu ASMedia Technology Inc.
Sunney Yang ACON, Advanced-Connectek, Inc. PS Tseng ASMedia Technology Inc.
Vicky Chuang ACON, Advanced-Connectek, Inc. Sam Tzeng ASMedia Technology Inc.
Joseph Scanlon Advanced Micro Devices Thomas Hsu ASMedia Technology Inc.
Sujan Thomas Advanced Micro Devices Weikao Chang ASMedia Technology Inc.
Caspar Lin Allion Labs, Inc. Yang Cheng ASMedia Technology Inc.
Casper Lee Allion Labs, Inc. Aaron Hou Bizlink Technology Inc.
Danny Shih Allion Labs, Inc. Shawn Meng Bizlink Technology Inc.
Howard Chang Allion Labs, Inc. Bernard Shyu Bizlink Technology, Inc.
Greg Stewart Analogix Semiconductor, Inc. Eric Wu Bizlink Technology, Inc.
Mehran Badii Analogix Semiconductor, Inc. Morphy Hsieh Bizlink Technology, Inc.
Alexei Kosut Apple Sean O'Neal Bizlink Technology, Inc.
Bill Cornelius Apple Tiffany Hsiao Bizlink Technology, Inc.
Carlos Colderon Apple Weichung Ooi Bizlink Technology, Inc.
Chris Uiterwijk Apple Rahul Bhushan Broadcom Corp.
Colin Whitby-Strevens Apple Asila nahas Cadence Design Systems, Inc.
Corey Axelowitz Apple Claire Ying Cadence Design Systems, Inc.
Corey Lange Apple Jie min Cadence Design Systems, Inc.
Dave Conroy Apple Mark Summers Cadence Design Systems, Inc.
David Sekowski Apple Michal Staworko Cadence Design Systems, Inc.
Girault Jones Apple Sathish Kumar Ganesan Cadence Design Systems, Inc.
James Orr Apple Alessandro Ingrassia Canova Tech
Jason Chung Apple Andrea Colognese Canova Tech
Jay Kim Apple Antonio Orzelli Canova Tech
Jeff Wilcox Apple Davide Ghedin Canova Tech
Jennifer Tsai Apple Matteo Casalin Canova Tech
Karl Bowers Apple Michael Marioli Canova Tech
Keith Porthouse Apple Nicola Scantamburlo Canova Tech
Kevin Hsiue Apple Paolo Pilla Canova Tech
Matt Mora Apple Ray Huang Canyon Semiconductor
Paul Baker Apple Yi-Feng Lin Canyon Semiconductor
Reese Schreiber Apple YuHung Lin Canyon Semiconductor
Ricardo Janezic Pregitzer Apple David Tsai Chrontel, Inc.
Ruchi Chaturvedi Apple Anshul Gulati Cypress Semiconductor
Sameer Kelkar Apple Anup Nayak Cypress Semiconductor
Sasha Tietz Apple Benjamin Kropf Cypress Semiconductor
Scott Jackson Apple Dhanraj Rajput Cypress Semiconductor
Sree Raman Apple Ganesh Subramaniam Cypress Semiconductor
William Ferry Apple Jagadeesan Raj Cypress Semiconductor
Page 6 Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10

Junjie cui Cypress Semiconductor Chien-Cheng Kuo eEver Technology, Inc.
Manu Kumar Cypress Semiconductor Shyanjia Chen eEver Technology, Inc.
Muthu M Cypress Semiconductor Abel Astley Ellisys
Nicholas Bodnaruk Cypress Semiconductor Chuck Trefts Ellisys
Pradeep Bajpai Cypress Semiconductor Emmanuel Durin Ellisys
Rajaram R Cypress Semiconductor Mario Pasquali Ellisys
Rama Vakkantula Cypress Semiconductor Tim Wei Ellisys
Rushil Kadakia Cypress Semiconductor Chien-Cheng Kuo Etron Technology, Inc.
Simon Nguyen Cypress Semiconductor Jack Yang Etron Technology, Inc.
Steven Wong Cypress Semiconductor Richard Crisp Etron Technology, Inc.
Subu Sankaran Cypress Semiconductor Shyanjia Chen Etron Technology, Inc.
Sumeet Gupta Cypress Semiconductor TsungTa Lu Etron Technology, Inc.
Tejender Sheoran Cypress Semiconductor Christian Klein Fairchild Semiconductor
Venkat Mandagulathar Cypress Semiconductor Oscar Freitas Fairchild Semiconductor
Xiaofeng Shen Cypress Semiconductor Souhib Harb Fairchild Semiconductor
Zeng Wei Cypress Semiconductor Amanda Ying Feature Integration Technology Inc.
Adie Tan Dell Inc. Jacky Chan Feature Integration Technology Inc.
Adolfo Montero Dell Inc. Kenny Hsieh Feature Integration Technology Inc.
Bruce Montag Dell Inc. KungAn Lin Feature Integration Technology Inc.
Gary Verdun Dell Inc. Paul Yang Feature Integration Technology Inc.
Ken Nicholas Dell Inc. Su Jaden Feature Integration Technology Inc.
Marcin Nowak Dell Inc. Yu-Lin Chu Feature Integration Technology Inc.
Merle Wood Dell Inc. Yulin Lan Feature Integration Technology Inc.
Mohammed Hijazi Dell Inc. AJ Yang Foxconn / Hon Hai
Siddhartha Reddy Dell Inc. Bob Hall Foxconn / Hon Hai
Terry Matula Dell Inc. Chihyin Kan Foxconn / Hon Hai
Jay Hu Derun Semiconductor Fred Fons Foxconn / Hon Hai
Shelly Liu Derun Semiconductor Jie Zheng Foxconn / Hon Hai
Bindhu Vasu Dialog Semiconductor (UK) Ltd Patrick Casher Foxconn / Hon Hai
Chanchal Gupta Dialog Semiconductor (UK) Ltd Shruti Deore Foxconn / Hon Hai
Dipti Baheti Dialog Semiconductor (UK) Ltd Steve Sedio Foxconn / Hon Hai
Duc Doan Dialog Semiconductor (UK) Ltd Terry Little Foxconn / Hon Hai
Holger Petersen Dialog Semiconductor (UK) Ltd Bob McVay Fresco Logic Inc.
Jianming Yao Dialog Semiconductor (UK) Ltd Christopher Meyers Fresco Logic Inc.
John Shi Dialog Semiconductor (UK) Ltd Dian Kurniawan Fresco Logic Inc.
KE Hong Dialog Semiconductor (UK) Ltd Tom Burton Fresco Logic Inc.
Kevin Mori Dialog Semiconductor (UK) Ltd Abraham Levkoy Google Inc.
Larry Ping Dialog Semiconductor (UK) Ltd Adam Rodriguez Google Inc.
Mengfei Liu Dialog Semiconductor (UK) Ltd Alec Berg Google Inc.
Scott Brown Dialog Semiconductor (UK) Ltd Bartosz Szpila Google Inc.
Yimin Chen Dialog Semiconductor (UK) Ltd Benson Leung Google Inc.
Yong Li Dialog Semiconductor (UK) Ltd Chao Fei Google Inc.
Justin Lee Diodes Incorporated Dave Bernard Google Inc.
Dan Ellis DisplayLink (UK) Ltd. David Schneider Google Inc.
Jason Young DisplayLink (UK) Ltd. Diana Zigterman Google Inc.
Kevin Jacobs DisplayLink (UK) Ltd. Eric Herrmann Google Inc.
Paulo Alcobia DisplayLink (UK) Ltd. George-Daniel Matei Google Inc.
Peter Burgers DisplayLink (UK) Ltd. Jameson Thies Google Inc.
Richard Petrie DisplayLink (UK) Ltd. Jim Guerin Google Inc.
Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10 Page 7

Juan Fantin Google Inc. Lee Leppo HP Inc.
Ken Wu Google Inc. Rahul Lakdawala HP Inc.
Kyle Tso Google Inc. Robin Castell HP Inc.
Mark Hayter Google Inc. Roger Benson HP Inc.
Nathan Kolluru Google Inc. Steve Chen HP Inc.
Nithya Jagannathan Google Inc. Bai Sean Huawei Technologies Co., Ltd.
Srikanth Lakshmikanthan Google Inc. Chunjiang Zhao Huawei Technologies Co., Ltd.
Todd Broch Google Inc. JianQuan Wu Huawei Technologies Co., Ltd.
Toshak Singhal Google Inc. Li Zongjian Huawei Technologies Co., Ltd.
Vincent Palatin Google Inc. Liansheng Zheng Huawei Technologies Co., Ltd.
Xuelin Wu Google Inc. Lihua Duan Huawei Technologies Co., Ltd.
Zhenxue Xu Google Inc. Min Chen Huawei Technologies Co., Ltd.
Alan Kinningham Granite River Labs Wang Feng Huawei Technologies Co., Ltd.
Anand Murugan Granite River Labs Wei Haihong Huawei Technologies Co., Ltd.
Balamurugan Manialagan Granite River Labs Zhenning Shi Huawei Technologies Co., Ltd.
Medipalli Sowmya Granite River Labs James Xie Hynetek Semiconductor Co., Ltd
Mike Engbretson Granite River Labs Yingyang Ou Hynetek Semiconductor Co., Ltd
Mike Wu Granite River Labs Robert Heaton Indie Semiconductor
Mukesh Tatiya Granite River Labs Vincent Wang Indie Semiconductor
Naresh Botsa Granite River Labs Benjamin Kropf Infineon Technologies
PoornaKumar M. Granite River Labs Sie Boo Chiang Infineon Technologies
Prajwal Rathod Granite River Labs Tue Fatt David Wee Infineon Technologies
Rajaraman V Granite River Labs Wee Tar Richard Ng Infineon Technologies
Saai Ghoutham Revathi
Granite River Labs Wolfgang Furtner Infineon Technologies
Selvam
Sivan Perumal Granite River Labs Aruni Nelson Intel Corporation
Sivaram Murugesan Granite River Labs Bob Dunstan Intel Corporation
Tim Lin Granite River Labs Brad Saunders Intel Corporation
Vijay S. Granite River Labs Chee Lim Nge Intel Corporation
Vijayakumar P Granite River Labs Christine Krause Intel Corporation
Vishal Kakade Granite River Labs Chuen Ming Tan Intel Corporation
Yogeshwaran Venkatesan Granite River Labs Dan Froelich Intel Corporation
GuangDong OPPO Mobile
Jerry Qin
David Harriman Intel Corporation
Telecommunications Corp., Ltd.
Alan Berkema Hewlett Packard David Hines Intel Corporation
Lee Atkinson Hewlett Packard David Thompson Intel Corporation
Rahul Lakdawala Hewlett Packard Guobin Liu Intel Corporation
Robin Castell Hewlett Packard Harry Skinner Intel Corporation
Ron Schooley Hewlett Packard Henrik Leegaard Intel Corporation
Steve Chen Hewlett Packard Jenn Chuan Cheng Intel Corporation
Suketa Partiwala Hewlett Packard Jervis Lin Intel Corporation
Vaibhav Malik Hewlett Packard John Howard Intel Corporation
Walter Fry Hewlett Packard Karthi Vadivelu Intel Corporation
Hideyuki HAYAFUJI Hosiden Corporation Leo Heiland Intel Corporation
Keiji Mine Hosiden Corporation Maarit Harkonen  Intel Corporation Masaki
Yamaoka   Hosiden Corporation    Nge Chee Lim    Intel Corporation Takashi Muto
Hosiden Corporation    Paul Durley    Intel Corporation Yasunori Nishikawa   Hosiden
Corporation    Rahman Ismail    Intel Corporation Alan Berkema    HP Inc.
Rajaram Regupathy   Intel Corporation
Kenneth Chan HP Inc. Ronald Swartz Intel Corporation
Page 8 Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10

Lee Atkinson HP Inc. Sarah Sharp Intel Corporation
Page 8 Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10

Steve McGowan Intel Corporation Eric Wen Luxshare-ICT
Tim McKee Intel Corporation James Kirk Luxshare-ICT
Toby Opferman Intel Corporation James Stevens Luxshare-ICT
Uma Medepalli Intel Corporation Josue Castillo Luxshare-ICT
Venkataramani
Intel Corporation Pat Young Luxshare-ICT
Gopalakrishnan
Ziv Kabiry Intel Corporation Scott Shuey Luxshare-ICT
Jia Wei Intersil Corporation Stone Lin Luxshare-ICT
iST - Integrated Service
Weijie Huang
Chikara Kakizawa Maxim Integrated Products
Technology Inc.
Al Hsiao ITE Tech. Inc. Jacob Scott Maxim Integrated Products
Greg Song ITE Tech. Inc. Ken Helfrich Maxim Integrated Products
Richard Guo ITE Tech. Inc. Michael Miskho Maxim Integrated Products
Victor Lin ITE Tech. Inc. Chris Yokum MCCI Corporation
Y.C. Chou ITE Tech. Inc. Geert Knapen MCCI Corporation
Japan Aviation Electronics
Kenta Minejima
Terry Moore MCCI Corporation
Industry Ltd. (JAE)
Japan Aviation Electronics
Mark Saubert
Velmurugan Selvaraj MCCI Corporation
Industry Ltd. (JAE)
Japan Aviation Electronics
Toshio Shimoyama
Tung-Sheng Lin MediaTek Inc.
Industry Ltd. (JAE)
Brian Fetz Keysight Technologies Inc. Satoru Kumashiro MegaChips Corporation
Jit Lim Keysight Technologies Inc. Brian Marley Microchip Technology Inc.
Koji Asakawa Kinetic Technologies Inc. Dave Perchlik Microchip Technology Inc.
Babu Mailachalam Lattice Semiconductor Corp Don Perkins Microchip Technology Inc.
Gianluca Mariani Lattice Semiconductor Corp Fernando Gonzalez Microchip Technology Inc.
Joel Coplen Lattice Semiconductor Corp John Sisto Microchip Technology Inc.
Thomas Watza Lattice Semiconductor Corp Josh Averyt Microchip Technology Inc.
Vesa Lauri Lattice Semiconductor Corp Kiet Tran Microchip Technology Inc.
Bruce Chuang Leadtrend Mark Bohm Microchip Technology Inc.
Eilian Liu Leadtrend Matthew Kalibat Microchip Technology Inc.
Chetan Kopalle LeCroy Corporation Mick Davis Microchip Technology Inc.
Daniel H Jacobs LeCroy Corporation Prasanna Vengateshan Microchip Technology Inc.
Jake Jacobs LeCroy Corporation Rich Wahler Microchip Technology Inc.
Kimberley McKay LeCroy Corporation Richard Petrie Microchip Technology Inc.
Mike Engbretson LeCroy Corporation Ronald Kunin Microchip Technology Inc.
Mike Micheletti LeCroy Corporation Shannon Cash Microchip Technology Inc.
Roy Chestnut LeCroy Corporation Thomas Farkas Microchip Technology Inc.
Venkataraman
Tyler Joe LeCroy Corporation Microchip Technology Inc.
Krishnamoorthy
Phil Jakes Lenovo Andrew Yang Microsoft Corporation
Do Kyun Kim LG electronics Anthony Chen Microsoft Corporation
Won-Jong Choi LG electronics Arvind Murching Microsoft Corporation
Won-Jong Choi LG Electronics Ltd. Dave Perchlik Microsoft Corporation
Aaron Melgar Lion Semiconductor David Voth Microsoft Corporation
Chris Zhou Lion Semiconductor Geoff Shew Microsoft Corporation
Sehyung Jeon Lion Semiconductor Jayson Kastens Microsoft Corporation
Wonyoung Kim Lion Semiconductor Kai Inha Microsoft Corporation
Yongho Kim Lion Semiconductor Marwan Kadado Microsoft Corporation
Dave Thompson LSI Corporation Michelle Bergeron Microsoft Corporation
Alan Kinningham Luxshare-ICT Nathan Sherman  Microsoft Corporation Alan
Liu     Luxshare-ICT      Rahul Ramadas    Microsoft Corporation Scott
Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10 Page 9

Brenden    Intel Corporation    Randy Aull    Microsoft Corporation Sridharan
Ranganathan  Intel Corporation     Shiu Ng     Microsoft Corporation Daniel Chen
Luxshare-ICT      Tieyong Yin     Microsoft Corporation
Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10 Page 9

Timo Toivola Microsoft Corporation Hung-Chih Chiu Power Forest Technology Corporation
Toby Nixon Microsoft Corporation Jay Tu Power Forest Technology Corporation
Vahid Vassey Microsoft Corporation Adel Lahham Power Integrations
Vivek Gupta Microsoft Corporation Aditya Kulkarni Power Integrations
Yang You Microsoft Corporation Akshay Nayaknur Power Integrations
Adib Al Abaji Molex LLC Amruta Patra Power Integrations
Aaron Xu Monolithic Power Systems Inc. K R Rahul Raj Power Integrations
Bo Zhou Monolithic Power Systems Inc. Kaushik Raam Power Integrations
Christian Sporck Monolithic Power Systems Inc. Rahul Joshi Power Integrations
Di Han Monolithic Power Systems Inc. Ricardo Pregiteer Power Integrations
Zhihong Yu Monolithic Power Systems Inc. Shruti Anand Power Integrations
Dan Wagner Motorola Mobility Inc. Amit gupta Qualcomm, Inc
Ben Crowe MQP Electronics Ltd. George Paparrizos Qualcomm, Inc
Pat Crowe MQP Electronics Ltd. Giovanni Garcea Qualcomm, Inc
Sten Carlsen MQP Electronics Ltd. Jack Pham Qualcomm, Inc
Kenji Oguma NEC Corporation James Goel Qualcomm, Inc
ChinJui Lin Nexperia B.V. Joshua Warner Qualcomm, Inc
Max Guan Nexperia B.V. Karyn Vuong Qualcomm, Inc
Stefan Seider Nexperia B.V. Lalan Mishra Qualcomm, Inc
Frank Borngräber Nokia Corporation Nicholas Cadieux Qualcomm, Inc
Kai Inha Nokia Corporation Vamsi Samavedam Qualcomm, Inc
Pekka Leinonen Nokia Corporation Vatsal Patel Qualcomm, Inc
Richard Petrie Nokia Corporation Chris Sporck Qualcomm, Inc.
Sten Carlsen Nokia Corporation Craig Aiken Qualcomm, Inc.
Abhijeet Kulkarni NXP Semiconductors Narendra Mehta Qualcomm, Inc.
Ahmad Yazdi NXP Semiconductors Terry Remple Qualcomm, Inc.
Bart Vertenten NXP Semiconductors Will Kun Qualcomm, Inc.
Dennis Ha NXP Semiconductors Yoram Rimoni Qualcomm, Inc.
Dong Nguyen NXP Semiconductors Fan-Hau Hsu Realtek Semiconductor Corp.
Guru Prasad NXP Semiconductors Tsung-Peng Chuang Realtek Semiconductor Corp.
Ken Jaramillo NXP Semiconductors Atsushi Mitamura Renesas Electronics Corp.
Krishnan TN NXP Semiconductors Bob Dunstan Renesas Electronics Corp.
Michael Joehren NXP Semiconductors Brian Allen Renesas Electronics Corp.
Robert de Nie NXP Semiconductors Dan Aoki Renesas Electronics Corp.
Rod Whitby NXP Semiconductors Fengshuan Zhou Renesas Electronics Corp.
Vijendra Kuroodi NXP Semiconductors Hajime Nozaki Renesas Electronics Corp.
Winston Langeslag NXP Semiconductors John Carpenter Renesas Electronics Corp.
Robert Heaton Obsidian Technology Kiichi Muto Renesas Electronics Corp.
Andrew Yoo ON Semiconductor Masami Katagiri Renesas Electronics Corp.
Brady Maasen ON Semiconductor Nobuo Furuya Renesas Electronics Corp.
Bryan McCoy ON Semiconductor Patrick Yu Renesas Electronics Corp.
Christian Klein ON Semiconductor Peter Teng Renesas Electronics Corp.
Cor Voorwinden ON Semiconductor Philip Leung Renesas Electronics Corp.
Edward Berrios ON Semiconductor Steve Roux Renesas Electronics Corp.
Michael Smith ON Semiconductor Tetsu Sato Renesas Electronics Corp.
Oscar Freitas ON Semiconductor Toshifumi Yamaoka Renesas Electronics Corp.
Tom Duffy ON Semiconductor Yimin Chen Renesas Electronics Corp.
Brian Collins Parade Technologies Inc. Chunan Kuo Richtek Technology Corporation
Craig Wiley Parade Technologies Inc. Heinz Wei Richtek Technology Corporation
Page 10 Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10

Max Huang Richtek Technology Corporation Shannon Cash SMSC
TZUHSIEN CHUANG Richtek Technology Corporation Mark Bohm SMSC
Tatsuya Irisawa Ricoh Company Ltd. Tim Knowlton SMSC
Akihiro Ono Rohm Co. Ltd. William Chiechi SMSC
Chris Lin Rohm Co. Ltd. Shigenori Tagami Sony Corporation
Hidenori Nishimoto Rohm Co. Ltd. Shinichi Hirata Sony Corporation
Kris Bahar Rohm Co. Ltd. Amanda Hosler Specwerkz
Manabu Miyata Rohm Co. Ltd. Bob Dunstan Specwerkz
Ruben Balbuena Rohm Co. Ltd. Brad Saunders Specwerkz
Takashi Sato Rohm Co. Ltd. Diane Lenox Specwerkz
Vijendra Kuroodi Rohm Co. Ltd. Michael Munn StarTech.com Ltd.
Yusuke Kondo Rohm Co. Ltd. Fabien Friess ST-Ericsson
Kazuomi Nagai ROHM Co., Ltd. Giuseppe Platania ST-Ericsson
Matti Kulmala Salcomp Plc Jean-Francois Gatto ST-Ericsson
Toni Lehimo Salcomp Plc Milan Stamenkovic ST-Ericsson
Edward Lee Samsung Electronics Co. Ltd. Nicolas Florenchie ST-Ericsson
Tong Kim Samsung Electronics Co. Ltd. Patrizia Milazzo ST-Ericsson
Amit Bouzaglo Scosche Industries Christophe Cochard STMicroelectronics
Alvin Cox Seagate Technology LLC Christophe Lorin STMicroelectronics
Emmanuel Lemay Seagate Technology LLC Filippo Bonaccorso STMicroelectronics
John Hein Seagate Technology LLC Jessy Guilbot STMicroelectronics
Marc Noblitt Seagate Technology LLC Joel Huloux STMicroelectronics
Michael Morgan Seagate Technology LLC John Bloomfield STMicroelectronics
Ronald Rueckert Seagate Technology LLC Massimo Panzica STMicroelectronics
Tony Priborsky Seagate Technology LLC Meriem Mersel STMicroelectronics
Chin Chang Semtech Corporation Nathalie Ballot STMicroelectronics
Tom Farkas Semtech Corporation Pascal Legrand STMicroelectronics
Ankit Garg Siemens Industry Software Inc. Patrizia Milazzo STMicroelectronics
Ning Dai Silergy Corp. Richard O’Connor STMicroelectronics
Wanfeng Zhang Silergy Corp. Morten Christiansen Synopsys, Inc.
Kafai Leung Silicon Laboratories, Inc. Nivin George Synopsys, Inc.
Kok Hong Soh Silicon Laboratories, Inc. Prishkit Abrol Synopsys, Inc.
Sorin Badiu Silicon Laboratories, Inc. Zongyao Wen Synopsys, Inc.
Steven Ghang Silicon Laboratories, Inc. Joan Marrinan Tektronix
SiliConch Systems Private
Abhishek Sardeshpande Kimberley McKay Teledyne-LeCroy
Limited
SiliConch Systems Private
Aniket Mathad
Matthew Dunn Teledyne-LeCroy
Limited
SiliConch Systems Private
Chandana N
Tony Minchell Teledyne-LeCroy
Limited
SiliConch Systems Private
Jaswanth Ammineni
Anand Dabak Texas Instruments
Limited
SiliConch Systems Private
Jinisha Patel
Annamalai Kasthuri Texas Instruments
Limited
BIJU Erayamkot
SiliConch Systems Private
Kaustubh Kumar
Texas Instruments
Limited Panayamthatta
SiliConch Systems Private
Nitish
Bill Waters Texas Instruments
Limited
SiliConch Systems Private
Pavitra Balasubramanian Bing Lu Texas Instruments
Limited
SiliConch Systems Private
Rakesh Polasa
Deric Waters Texas Instruments
Limited
SiliConch Systems Private
Satish Anand Verkila
Grant Ley Texas Instruments
Limited
SiliConch Systems Private
Shubham Paliwal
Gregory Watkins Texas Instruments
Limited
SiliConch Systems Private
Vishnu Pusuluri
Ingolf Frank Texas Instruments
Limited
John Sisto SMSC Ivo Huber Texas Instruments
Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10 Page 11

Ken Gay SMSC Javed Ahmad Texas Instruments
Richard Wahler SMSC Jean Picard Texas Instruments
Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10 Page 11

John Perry Texas Instruments
Kasthuri Annamalai Texas Instruments
Martin Patoka Texas Instruments
Mike Campbell Texas Instruments
Scott Jackson Texas Instruments
Shafiuddin Mohammed Texas Instruments
Srinath Hosur Texas Instruments
Steven Tom Texas Instruments
Yoon Lee Texas Instruments
Tim Wilhelm The Silanna Group Pty. Ltd.
Tod Wolf The Silanna Group Pty. Ltd.
Chris Yokum Total Phase
Dylan Su UL LLC
Eric Wall UL LLC
Jason Smith UL LLC
Terry Kao UL LLC
Steven Chen Unigraf OY
Topi Lampiranta Unigraf OY
Brad Cox Ventev Mobile
Colin Vose Ventev Mobile
Dydron Lin VIA Technologies, Inc.
Fong-Jim Wang VIA Technologies, Inc.
Jay Tseng VIA Technologies, Inc.
Rex Chang VIA Technologies, Inc.
Terrance Shih VIA Technologies, Inc.
Ho Wen Tsai Weltrend Semiconductor
Hung Chiang Weltrend Semiconductor
Jeng Cheng Liu Weltrend Semiconductor
Priscilla Lee Weltrend Semiconductor
Wayne Lo Weltrend Semiconductor
Western Digital Technologies,
Charles Neumann
Inc.
Western Digital Technologies,
Curtis Stevens
Inc.
Western Digital Technologies,
John Maroney
Inc.
Joe O'Brien Wilder Technologies
Will Miller Wilder Technologies
Canfeng Chen Xiaomi Communications Co., Ltd.
Juejia Zhou Xiaomi Communications Co., Ltd.
Xiaoxing Yang Xiaomi Communications Co., Ltd.
Zhuhai Smartware Technology
Liu Qiong
Co., Ltd.
Zhuhai Smartware Technology
Long Zhang
Co., Ltd.
Zhuhai Smartware Technology
Yuanchao Liang
Co., Ltd.
Page 12 Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10

Table Of Contents
Revision History . 2
LIMITED COPYRIGHT LICENSE . 5
INTELLECTUAL PROPERTY DISCLAIMER . 5
Editors . 6
Contributors . 6
Table Of Contents . 13
List of Figures . 19
List of Tables . 27
1 Introduction . 34
1.1 Overview . 34
1.2 Purpose . 35
1.2.1 Scope . 36
1.3 Section Overview . 36
1.4 Conventions . 37
1.4.1 Precedence . 37
1.4.2 Keywords . 37
1.4.3 Numbering . 38
1.5 Related Documents . 39
1.6 Terms and Abbreviations . 40
1.7 Parameter Values . 52
1.8 Changes from Revision 3.0 . 52
1.9 Compatibility with Revision 2.0 . 52
2 Overview . 53
2.1 Introduction . 53
2.1.1 Power Delivery Source Operational Contracts . 53
2.1.2 Power Delivery Contract Negotiation. 53
2.1.3 Other Uses for Power Delivery . 54
2.2 Compatibility with Revision 2.0. 54
2.3 USB Power Delivery Capable Devices . 55
2.4 SOP* Communication . 57
2.4.1 Introduction . 57
2.4.2 SOP* Collision Avoidance . 57
2.4.3 SOP Communication . 57
2.4.4 SOP'/SOP'' Communication with Cable Plugs . 57
2.5 Operational Overview . 59
2.5.1 Source Operation . 59
2.5.2 Sink Operation . 62
2.5.3 Cable Plugs . 65
2.6 Architectural Overview . 66
2.6.1 Policy . 69
2.6.2 Message Formation and Transmission . 70
2.6.3 Collision Avoidance . 70
2.6.4 Power supply . 71
2.6.5 DFP/UFP . 71
Universal Serial Bus Power Delivery Specification, Revision 3.2, Version 1.1, 2024-10 Page 13

2.6.6 Cable and Connectors . 72
2.6.7 Interactions between Non-PD, BC, and PD devices . 72
2.6.8 Power Rules . 72
2.7 Extended Power Range (EPR) Operation . 73
2.8 Charging Models . 75
2.8.1 Fixed Supply Charging Models . 75
2.8.2 Programmable Power Supply (PPS) Charging Models . 75
2.8.3 Adjustable Voltage Supply (AVS) Charging Models . 76
3 USB Type-A and USB Type-B Cable Assemblies and Connectors . 77
4 Electrical Requirements . 78
4.1 Interoperability with other USB Specifications . 78
4.2 Dead Battery Detection / Unpowered Port Detection . 78
4.3 Cable IR Ground Drop (IR Drop) . 78
4.4 Cable Type Detection . 78
5 Physical Layer . 79
5.1 Physical Layer Overview . 79
5.2 Physical Layer Functions . 79
5.3 Symbol Encoding . 80
5.4 Ordered Sets . 81
5.5 Transmitted Bit Ordering . 83
5.6 Packet Format . 84
5.6.1 Packet Framing . 84
5.6.2 CRC . 86
5.6.3 Packet Detection Errors . 89
5.6.4 Hard Reset . 89
5.6.5 Cable Reset . 90
5.7 Collision Avoidance . 91
5.8 Bi-phase Mark Coding (BMC) Signaling Scheme . 92
5.8.1 Encoding and signaling. 92
5.8.2 Transmit and Receive Masks . 96
5.8.3 Transmitter Load Model. 103
5.8.4 BMC Common specifications . 105
5.8.5 BMC Transmitter Specifications . 106
5.8.6 BMC Receiver Specifications . 110
5.9 Built in Self-Test (BIST) . 113
5.9.1 BIST Carrier Mode . 113
5.9.2 BIST Test Data Mode . 113
6 Protocol Layer . 114
6.1 Overview . 114
6.2 Messages . 115
6.2.1 Message Construction . 115
6.3 Control Message . 128
6.3.1 GoodCRC Message. 129
6.3.2 GotoMin Message (Deprecated) . 129
6.3.3 Accept Message .
...