iTeh StandardsiTeh Standards
EURUSD
Your shopping cart is empty.
CLC

EN 61191-4:1998

(Main)

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are totally terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting)

Elektronikaufbauten auf Leiterplatten - Teil 4: Rahmenspezifikation - Anforderungen an gelötete Baugruppen mit Lötstützpunkten

Ensembles de cartes imprimées - Partie 4: Spécification intermédiaire - Exigences relatives à l'assemblage de bornes par brasage

Donne des exigences relatives à l'assemblage de bornes par brasage. Les exigences de la présente spécification s'appliquent aux ensembles entièrement constitués d'après des structures d'interconnexion borne/fil et aux portions d'ensembles incluant d'autres techniques associées (par exemple montage en surface, montage par trous traversants, montage à puce).

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

General Information

Status
Withdrawn
Publication Date
27-Oct-1998
Withdrawal Date
30-Jun-2001
ICS
31.240 - Mechanical structures for electronic equipment
Technical Committee
CLC/SR 91 - Electronics assembly technology
Drafting Committee
IEC/TC 91 - IEC_TC_91
Parallel Committee
IEC/TC 91 - IEC_TC_91
Current Stage
9960 - Withdrawal effective - Withdrawal
Start Date
30-Aug-2020
Completion Date
30-Aug-2020
Ref Project
SIST EN 61191-4:2001 - Printed board assemblies -- Part 4: Sectional specification - Requirements for terminal soldered assemblies

Relations

Replaced By
EN 61191-4:2017 - Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Effective Date
01-Nov-2016

Buy Standard

EN 61191-4:2001EN 61191-4:2001
PreviousNext
Standard
EN 61191-4:2001
English language
20 pages
sale 10% off
Preview
sale 10% off
Preview
e-Library read for
1 day

Standards Content (Sample)


SLOVENSKI STANDARD
01-marec-2001
Printed board assemblies - Part 4: Sectional specification - Requirements for
terminal soldered assemblies
Printed board assemblies -- Part 4: Sectional specification - Requirements for terminal
soldered assemblies
Elektronikaufbauten auf Leiterplatten -- Teil 4: Rahmenspezifikation - Anforderungen an
gelötete Baugruppen mit Lötstützpunkten
Ensembles de cartes imprimées -- Partie 4: Spécification intermédiaire - Exigences
relatives à l'assemblage de bornes par brasage
Ta slovenski standard je istoveten z: EN 61191-4:1998
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.

This May Also Interest You

CLC
EN IEC 61760-2:2021(Main)
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
SIST EN IEC 61760-2:2021

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

  • Standard
    18 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 61760-1:2020(Main)
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
SIST EN IEC 61760-1:2022

IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses. This edition includes the following significant technical changes with respect to the previous edition: a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.

  • Standard
    47 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN 61191-2:2017/AC:2019-10(Corrigendum)
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
SIST EN 61191-2:2018/AC:2020
  • Corrigendum
    3 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN IEC 61191-1:2018(Main)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
SIST EN IEC 61191-1:2020

NEW!IEC 61191-1:2018 is available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; - the term "assembly drawing" has been changed to "assembly documentation" throughout; - references to IEC standards have been corrected; - Clause 9 was completely rewritten; - Annex B was removed because there are already procedures for circuit board assemblies.

  • Standard
    48 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN 61191-4:2017(Main)
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
SIST EN 61191-4:2019

IEC 61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting). This edition includes the following significant technical changes with respect to the previous edition: The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

  • Standard
    22 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN 61191-2:2017(Main)
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
SIST EN 61191-2:2018

IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; b) some of the terminology used in the document has been updated; c) references to IEC standards have been corrected; d) five termination styles have been added.

  • Standard
    36 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN 61191-3:2017(Main)
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
SIST EN 61191-3:2018

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

  • Standard
    24 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN 62739-3:2017(Main)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
SIST EN 62739-3:2018

IEC 62739-3:2017(E) describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

  • Standard
    34 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN 62739-2:2016(Main)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
SIST EN 62739-2:2017

IEC 62739-2:2016 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.

  • Standard
    19 pages
    English language
    sale 10% off
    e-Library read for
    1 day
CLC
EN 62739-1:2013(Main)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
SIST EN 62739-1:2014

IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

  • Standard
    21 pages
    English language
    sale 10% off
    e-Library read for
    1 day