EN 60603-7:1997

SLOVENSKI STANDARD
01-september-2002
1DGRPHãþD
kSIST FprEN 60603-7:2008
Connectors for frequencies below 3 MHz for use with printed boards - Part 7:
Detail specification for connectors, 8-way, including fixed and free connectors
with common mating features, with assessed quality (IEC 60603-7:1996)
Connectors for frequencies below 3 MHz for use with printed boards -- Part 7: Detail
specification for connectors, 8-way, including fixed and free connectors with common
mating features, with assessed quality
Steckverbinder für Frequenzen unter 3 MHz für gedruckte Schaltungen -- Teil 7:
Bauartspezifikation für Steckverbinder mit bewerteter Qualität, 8-polig, einschließlich
fester und freier Steckverbinder mit gemeinsamen Steckmerkmalen
Connecteurs pour fréquences inférieures à 3 MHz pour utilisation avec cartes imprimées
-- Partie 7: Spécification particulière pour connecteurs à 8 voies, comprenant des
embases et des fiches ayant des caractéristiques d'accouplement communes, avec
assurance de la qualité
Ta slovenski standard je istoveten z: EN 60603-7:1997
ICS:
31.220.10 9WLþLLQYWLþQLFHNRQHNWRUML Plug-and-socket devices.
Connectors
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

NORME
CEI
INTERNATIONALE
IEC
603-7
INTERNATIONAL
STANDARD
QC 010000XX0003
Deuxième édition
Second edition
1996-11
Connecteurs pour fréquences inférieures à 3 MHz
pour utilisation avec cartes imprimées –
Partie 7:
Spécification particulière pour connecteurs
à 8 voies, comprenant des embases et des fiches
ayant des caractéristiques d’accouplement
communes, avec assurance de la qualité
Connectors for frequencies below 3 MHz
for use with printed boards –
Part 7:
Detail specification for connectors, 8-way,
including fixed and free connectors with common
mating features, with assessed quality
 CEI 1996  Droits de reproduction réservés  Copyright - all rights reserved
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microfilms, sans l'accord écrit de l'éditeur. in writing from the publisher
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International Electrotechnical Commission PRICE CODE
Pour prix, voir catalogue en vigueur
For price, see current catalogue

603-7  IEC:1996 − 3 −
CONTENTS
Page
FOREWORD . 5
Clause
1 Scope. 9
2 IEC type designation. 13
3 Common features and isometric view . 14
3.1 Isometric view. 14
3.2 Mating information . 15
3.3 Survey of types. 25
4 Dimensions . 25
4.1 General . 25
4.2 Type A – Fixed connectors (panel-mounted) . 26
4.3 Type B – Fixed connectors (board-mounted) . 32
4.4 Type C – Free connectors. 47
4.5 Type D – Free coupler connectors (under consideration) . 48
4.6 Mounting information for type A fixed connectors (panel-mounted) . 49
4.7 Mounting information for type B fixed connectors (board-mounted) . 52
5 Gauges . 53
5.1 Fixed connectors . 53
5.2 Free connectors. 56
5.3 Test panels (for voltage proof test). 60
6 Characteristics . 61
6.1 Climatic category . 61
6.2 Electrical . 61
6.3 Mechanical . 65
7 Test schedule. 65
8 Quality assessment procedures . 83
8.1 Qualification approval testing . 83
8.2 Quality conformance inspection. 85
Annexes
A Gauging requirements . 89
B Locking device mechanical operation – Test procedure and requirements. 91
C Gauging continuity procedure. 93
D Flowing mixed gas corrosion test . 99

603-7  IEC:1996 − 5 −
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_____________
CONNECTORS FOR FREQUENCIES BELOW 3 MHz
FOR USE WITH PRINTED BOARDS –
Part 7: Detail specification for connectors, 8-way,
including fixed and free connectors with common mating features,
with assessed quality
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization
comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to
promote international co-operation on all questions concerning standardization in the electrical and electronic
fields. To this end and in addition to other activities, the IEC publishes International Standards. Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt
with may participate in this preparatory work. International, governmental and non-governmental organizations
liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the
form of standards, technical reports or guides and they are accepted by the National Committees in that
sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the
subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 603-7 has been prepared by subcommittee 48B: Connectors, of IEC
technical committee 48: Electromechanical components and mechanical structures for
electronic equipment.
This second edition cancels and replaces the first edition published in 1990 and constitutes a
technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
48B/489/FDIS 48B/546/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

603-7  IEC:1996 − 7 −
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this International Standard may involve the use of a patent
concerning connectors, 8-way, for interconnect systems given in clauses 3 and 4.
The IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he is willing to negotiate licences under
reasonable and non-discriminatory terms and conditions with applicants throughout the world.
In this respect, the statement of the holder of this patent right is registered with the IEC.
Information may be obtained from:
AT&T
Intellectual Property Licensing and Management Organization
10 Independence Boulevard
P.O. Box 4911
Warren, New Jersey 07060-0911
United States of America
Attention is drawn to the possibility that some of the elements of this International Standard
may be the subject of patent rights other than those identified above. IEC shall not be held
responsible for identifying any or all such patent rights.
Annexes A, B, C and D form an integral part of this document.
The QC number that appears on the front cover of this publication is the specification number in
the IEC Quality Assessment Systems for Electronic Components (IECQ).

603-7  IEC:1996 − 9 −
CONNECTORS FOR FREQUENCIES BELOW 3 MHz
FOR USE WITH PRINTED BOARDS –
Part 7: Detail specification for connectors, 8-way,
including fixed and free connectors with common mating features,
with assessed quality
1 Scope
This part of IEC 603 covers an 8-way connector system of 4, 6 or 8 contacts consisting of a
range of free and fixed connectors. The connectors cover a variety of different mounting
configurations and termination types with a common mating configuration.
Fixed connectors are provided with terminations suitable for solder, insulation displacement,
screw terminal, crimp, insulation piercing termination, printed-board mounting and flying leads.
Free connectors are provided for crimp, insulation piercing and insulation displacement
terminations to cable assemblies with tinsel, stranded or solid wire conductors. At the present
time, free connectors may only be available with a limited range of terminations and variants.
1.1 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this part of IEC 603. At the time of publication, the editions indicated
were valid. All normative documents are subject to revision, and parties to agreements based
on this part of IEC 603 are encouraged to investigate the possibility of applying the most recent
editions of the normative documents indicated below. Members of IEC and ISO maintain
registers of currently valid International Standards.
IEC 50(581): 1978, International Electrotechnical Vocabulary (IEV) – Chapter 581: Electro-
mechanical components for electronic equipment
IEC 68-1: 1988, Environmental testing – Part 1: General and guidance
IEC 326-3: 1991, Printed boards – Part 3: Design and use of printed boards
IEC 352-2: 1990, Solderless connections – Part 2: Solderless crimped connections − General
requirements, test methods and practical guidance
IEC 352-3: 1993, Solderless connections – Part 3: Solderless accessible insulation
displacement connections − General requirements, test methods and practical guidance
IEC 352-4: 1994, Solderless connections – Part 4: Solderless non-accessible insulation
displacement connections – General requirements, test methods and practical guidance
IEC 410: 1973, Sampling plans and procedures for inspection by attributes

603-7  IEC:1996 − 11 −
IEC 512-2: 1985, Electromechanical components for electronic equipment, basic testing
procedures and measuring methods – Part 2: General examination, electrical continuity and
contact resistance tests, insulation tests and voltage stress tests
IEC 512-3: 1976, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 3: Current-carrying capacity tests
IEC 512-4: 1976, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 4: Dynamic stress tests
IEC 512-5: 1992, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 5: Impact tests (free components), static load tests
(fixed components), endurance tests and overload tests
IEC 512-6: 1984, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 6: Climatic tests and soldering tests
IEC 512-7: 1988, Electromechanical components for electronic equipment; basic testing
procedures and measuring methods – Part 7: Mechanical operating tests and sealing tests
IEC
...