Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2: Prüfverfahren für Materialien für Verbindungsstrukturen

Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2: Méthodes d'essai des matériaux pour structures d'interconnexion

Constitue un recueil de méthodes d'essai représentant les méthodologies et les procédures qui peuvent être appliquées pour essayer les matériaux utilisés pour fabriquer des structures d'interconnexion (cartes imprimées) et des ensembles. Il s'étend aux méthodes d'essais chimiques, mécaniques et électriques.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

General Information

Status
Withdrawn
Publication Date
24-Apr-1997
Withdrawal Date
31-Dec-1997
ICS
31.180 - Printed circuits and boards
Technical Committee
CLC/SR 91 - Electronics assembly technology
Drafting Committee
IEC/TC 91 - IEC_TC_91
Parallel Committee
IEC/TC 91 - IEC_TC_91
Current Stage
9960 - Withdrawal effective - Withdrawal
Start Date
01-Sep-2009
Completion Date
01-Sep-2009
Ref Project
SIST EN 61189-2:2001 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures

Relations

Replaced By
EN 61189-2:2006 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Effective Date
29-Jan-2023
Amended By
EN 61189-2:1997/A1:2000 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Effective Date
29-Jan-2023

Frequently Asked Questions

EN 61189-2:1997 is a standard published by CLC. Its full title is "Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures". This standard covers: Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

EN 61189-2:1997 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards. The ICS classification helps identify the subject area and facilitates finding related standards.

EN 61189-2:1997 has the following relationships with other standards: It is inter standard links to EN 61189-2:2006, EN 61189-2:1997/A1:2000. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

EN 61189-2:1997 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


SLOVENSKI STANDARD
01-junij-2001
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies - Part 2: Test methods for materials for interconnection
structures
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies -- Part 2: Test methods for materials for interconnection structures
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen -- Teil 2: Prüfverfahren für Materialien für Verbindungsstrukturen
Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles -- Partie 2: Méthodes d'essai des matériaux
pour structures d'interconnexion
Ta slovenski standard je istoveten z: EN 61189-2:1997
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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