EN 61249-3-5:1999
(Main)Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
Materialien für Leiterplatten und andere Verbindungsstrukturen - Teil 3-5: Rahmenspezifikation für unverstärkte, kaschierte und unkaschierte Basismaterialien (für flexible Leiterplatten) - Transfer-Kleberfilme für flexible Leiterplatten
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 3-5: Collection de spécifications intermédiaires pour les matériaux de base non renforcés, recouverts ou non (prévus pour les ciruits imprimés flexibles) - Films à transfert de colle
Donne les prescriptions pour les films à transfert de colle destinés à la fabrication des cartes souples multicouches ou des cartes imprimées flexo-rigides.
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
General Information
- Status
- Published
- Publication Date
- 14-Apr-1999
- Withdrawal Date
- 31-Dec-2001
- Technical Committee
- CLC/SR 91 - Electronics assembly technology
- Drafting Committee
- IEC/TC 91 - IEC_TC_91
- Parallel Committee
- IEC/TC 91 - IEC_TC_91
- Current Stage
- 6060 - Document made available - Publishing
- Start Date
- 15-Apr-1999
- Completion Date
- 15-Apr-1999
Relations
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 09-Feb-2026
- Referred By
EN 115-1:2017 - Safety of escalators and moving walks - Part 1: Construction and installation - Effective Date
- 09-Feb-2026
Overview
EN 61249-3-5:1999 (published under CLC) is a sectional specification for transfer adhesive films intended for use with unreinforced base materials - both clad and unclad - in flexible printed boards. The standard defines the scope and requirements for adhesive films used in the fabrication of flexible multilayer boards and flex-rigid printed boards, helping manufacturers and specifiers ensure consistent material performance and reliable interconnect assemblies.
Key Topics
The standard addresses technical categories and test-based requirements typically needed for high-reliability flexible PCB manufacture, including:
- Material definition and scope - applicable types of transfer adhesive films for flexible substrates (unreinforced, clad/unclad).
- Mechanical properties - adhesion performance and mechanical integrity under bending and flexing.
- Thermal performance - resistance to process temperatures encountered during lamination, soldering and curing.
- Electrical properties - dielectric behavior and insulation characteristics relevant to interconnects.
- Chemical and processing compatibility - suitability for lamination, plating, etching and other board fabrication processes.
- Dimensional and storage requirements - film thickness, uniformity, cleanliness and shelf/storage conditions to preserve performance.
- Test methods and inspection - standard tests used to verify compliance (peel/adhesion, thermal ageing, visual inspection, etc.).
Note: EN 61249-3-5 sets requirement categories and test expectations rather than prescribing specific manufacturing recipes; it provides a common baseline for material selection and quality control.
Applications
This standard is practical for organizations and roles involved in the printed circuit board supply chain:
- PCB material manufacturers developing and certifying transfer adhesive films
- Flexible PCB and flex-rigid board fabricators specifying adhesive materials for multilayer lamination
- Electronics OEMs and contract manufacturers selecting reliable PCB materials for products with flex circuits
- Quality assurance, procurement and design engineers ensuring compatibility between adhesive films and flexible base materials
Using EN 61249-3-5 helps reduce manufacturing defects, improve lamination yield, and ensure long-term reliability of flexible interconnect assemblies.
Related Standards
- Other parts of the EN 61249 series covering base materials for printed boards
- Industry standards for flexible PCB design and testing (refer to relevant IPC/IEC documents when specifying process- or product-level tests)
Keywords: transfer adhesive films, flexible printed boards, flex-rigid printed boards, flexible multilayer boards, PCB materials, material specifications, lamination, adhesive film requirements.
Frequently Asked Questions
EN 61249-3-5:1999 is a standard published by CLC. Its full title is "Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films". This standard covers: Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
Gives requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.
EN 61249-3-5:1999 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards. The ICS classification helps identify the subject area and facilitates finding related standards.
EN 61249-3-5:1999 has the following relationships with other standards: It is inter standard links to EN 60249-1:1993, EN 60249-2-8:1994, EN 61189-2:1997, EN 115-1:2008+A1:2010, EN 115-1:2017. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN 61249-3-5:1999 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive filmsMaterialien für Leiterplatten und andere Verbindungsstrukturen -- Teil 3-5: Rahmenspezifikation für unverstärkte, kaschierte und unkaschierte Basismaterialien (für flexible Leiterplatten) - Transfer-Kleberfilme für flexible LeiterplattenMatériaux pour circuits imprimés et autres structures d'interconnexion -- Partie 3-5: Collection de spécifications intermédiaires pour les matériaux de base non renforcés, recouverts ou non (prévus pour les ciruits imprimés flexibles) - Films à transfert de colleMaterials for pri
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