EN 16603-20-08:2014

SLOVENSKI STANDARD
01-november-2014
Vesoljska tehnika - 20-08. del: Fotonapetostni sestavi in komponente
Space engineering - Part 20-08: Photovoltaic assemblies and components
Raumfahrttechnik - Teil 20-08: Fotovoltaische Baugruppen und Komponenten
Ingéniérie spatiale - Partie 20-08: Ensembles et composants photovoltaïque
Ta slovenski standard je istoveten z: EN 16603-20-08:2014
ICS:
27.160 6RQþQDHQHUJLMD Solar energy engineering
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 16603-20-08
NORME EUROPÉENNE
EUROPÄISCHE NORM
August 2014
ICS 49.140
English version
Space engineering - Part 20-08: Photovoltaic assemblies and
components
Ingéniérie spatiale - Partie 20-08: Ensembles et Raumfahrttechnik - Teil 20-08: Fotovoltaische Baugruppen
composants photovoltaïque und Komponenten
This European Standard was approved by CEN on 10 February 2014.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16603-20-08:2014 E
worldwide for CEN national Members and for CENELEC
Members.
Table of contents
Foreword . 10
Introduction . 11
1 Scope . 12
2 Normative references . 13
3 Terms, definitions and abbreviated terms . 14
3.1 Terms from other standards . 14
3.2 Terms specific to the present standard . 14
3.3 Abbreviated terms. 19
4 General . 22
4.1 Overview . 22
4.1.1 Objective and organization . 22
4.1.2 Interfaces with other areas . 23
4.2 Physical properties . 24
4.3 Test and storage . 25
4.3.1 Test environment . 25
4.3.2 Test tolerances and accuracies . 25
4.3.3 Margins . 26
4.4 Critical materials . 26
5 Photovoltaic assemblies . 27
5.1 Overview . 27
5.1.1 Description . 27
5.1.2 Purpose and objective . 27
5.2 Conditions and method of test . 28
5.3 Photovoltaic assembly design . 29
5.3.1 Overview . 29
5.3.2 Parameters related to parts, materials and processes (PMP) . 29
5.3.3 Parameters related to design . 30
5.4 PVA manufacturing . 34
5.4.1 Process validation . 34
5.4.2 Defect acceptability . 34
5.4.3 In-process testing . 34
5.4.4 Identification and traceability . 35
5.4.5 Recording . 36
5.5 PVA tests . 36
5.5.1 Qualification tests . 36
5.5.2 Acceptance tests for qualification coupons . 41
5.5.3 Definition of tests and checks . 42
5.6 Failure definition . 53
5.6.1 Failure criteria . 53
5.6.2 Failed qualification coupons . 53
5.7 Data documentation . 53
5.8 Delivery . 54
5.9 Packaging, packing, handling and storage . 54
6 Solar cell assemblies . 55
6.1 General . 55
6.1.1 Testing . 55
6.1.2 Conditions and methods of test . 55
6.1.3 Deliverable components . 55
6.1.4 Identification and traceability . 55
6.2 Production control (process identification document) . 56
6.3 Acceptance tests . 56
6.3.1 General . 56
6.3.2 Test methods and conditions . 56
6.3.3 Electrical performance acceptance test (EPA) . 57
6.4 Qualification tests . 57
6.4.1 General . 57
6.4.2 Qualification . 59
6.4.3 Test methods, conditions and measurements . 60
6.5 Failure definition . 71
6.5.1 Failure criteria . 71
6.5.2 Failed SCAs . 72
6.6 Data documentation . 72
6.7 Delivery . 72
6.8 Packing, dispatching, handling and storage . 72
6.8.1 Overview . 72
6.8.2 ESD Sensitivity . 72
7 Bare solar cells . 73
7.1 Testing, deliverable components and marking . 73
7.1.1 Testing . 73
7.1.2 Deliverable components . 74
7.1.3 Marking . 74
7.2 Production control (process identification document) . 74
7.3 Acceptance tests . 75
7.3.1 General . 75
7.3.2 Test methods and conditions . 76
7.3.3 Documentation . 76
7.4 Qualification tests . 77
7.4.1 General . 77
7.4.2 Qualification . 79
7.5 Test methods, conditions and measurements . 80
7.5.1 Visual inspection (VI) . 80
7.5.2 Dimensions and weight (DW) . 82
7.5.3 Electrical performance (EP) . 82
7.5.4 Temperature coefficients (TC) . 83
7.5.5 Spectral response (SR) . 84
7.5.6 Optical properties (OP) . 84
7.5.7 Humidity and temperature (HT) . 85
7.5.8 Coating adherence (CA) . 86
7.5.9 Contact uniformity (CU) . 87
7.5.10 Contact thickness (CT) . 87
7.5.11 Surface finish (SF) . 87
7.5.12 Pull test (PT) . 88
7.5.13 Electron irradiation (EI) . 88
7.5.14 Proton irradiation (PI) . 89
7.5.15 Photon irradiation and temperature annealing (PH). 90
7.5.16 Solar cell reverse bias test (RB) . 90
7.5.17 Thermal cycling (CY) . 91
7.5.18 Active-passive interface evaluation test (IF) . 91
7.5.19 Flatness test (FT) . 91
7.6 Failure definition . 92
7.6.1 Failure criteria . 92
7.6.2 Failed components . 92
7.7 Data documentation . 92
7.8 Delivery . 92
7.9 Packing, dispatching, handling and storage . 93
7.9.1 Overview . 93
7.9.2 ESD Sensitivity . 93
8 Coverglasses . 94
8.1 Overview . 94
8.1.1 Purpose . 94
8.1.2 Description . 94
8.2 Interfaces . 94
8.3 Testing, deliverable components and marking . 95
8.3.1 Testing . 95
8.3.2 Deliverable components . 95
8.3.3 Marking (coating orientation) . 96
8.4 Production control (Process identification document) . 96
8.5 Acceptance tests . 96
8.5.1 Acceptance test samples . 96
8.5.2 Acceptance test sequence . 97
8.5.3 Test methods and conditions . 97
8.5.4 Documentation . 97
8.6 Qualification tests . 98
8.6.1 General . 98
8.6.2 Qualification . 98
8.7 Test methods, conditions and measurements . 100
8.7.1 Visual inspection (VI) . 100
8.7.2 Transmission into air (TA) . 101
8.7.3 Electro-optical properties (EO) . 102
8.7.4 Mechanical properties . 102
8.7.5 Reflectance properties (OP) . 103
8.7.6 Normal emittance (e ) (NE) . 105
N
8.7.7 Surface resistivity . 105
8.7.8 Flatness or bow (FT) . 105
8.7.9 Transmission into adhesive (TH) . 106
8.7.10 Boiling water test (BW) . 106
8.7.11 Humidity and temperature . 106
8.7.12 UV exposure (UV) . 107
8.7.13 Electron irradiation (EI) . 108
8.7.14 Proton irradiation (PI) . 108
8.7.15 Breaking strength (BS) . 108
8.7.16 Thermal cycling (CY) . 109
8.7.17 Abrasion resistance (coated surface) (AE) . 109
8.7.18 Coating adhesion (TD) . 109
8.8 Failure definition . 109
8.8.1 Failure criteria . 109
8.8.2 Failed components . 110
8.9 Data documentation . 110
8.10 Delivery . 110
8.11 Packing, dispatching, handling and storage . 110
9 Solar cell protection diodes . 111
9.1 Overview . 111
9.2 Testing, deliverable components and marking . 111
9.2.1 Testing . 111
9.2.2 Deliverable components . 113
9.2.3 Marking . 113
9.3 Production control (process identification document) . 113
9.3.1 Integral protection diodes . 113
9.3.2 External protection diodes . 113
9.4 Acceptance tests . 114
9.4.1 General . 114
9.4.2 Integral protection diodes . 114
9.4.3 External protection diodes . 114
9.4.4 External and integral diodes . 115
9.4.5 Test methods and conditions . 115
9.4.6 Documentation . 116
9.5 Qualification tests . 116
9.5.1 General . 116
9.5.2 Integral protection diodes . 116
9.5.3 External protection diodes . 117
9.5.4 Integral and external protection diodes . 118
9.6 Test methods, conditions and measurements . 119
9.6.1 General . 119
9.6.2 Visual inspection (VI) . 119
9.6.3 Dimensions and weight (DW) . 120
9.6.4 Thermal cycling (CY) . 121
9.6.5 Burn in (BI) . 121
9.6.6 Humidity and temperature (HT) . 122
9.6.7 Contact uniformity (CU) . 122
9.6.8 Contact thickness (CT) . 123
9.6.9 Surface Finish (SF) . 123
9.6.10 Contact adherence (CA) . 123
9.6.11 Pull test (PT) . 124
9.6.12 Electron irradiation (EI) . 124
9.6.13 Temperature annealing (TA) . 125
9.6.14 Temperature behaviour (TB) . 125
9.6.15 Diode characterization (DC) . 126
9.6.16 Human body ESD (DE) . 127
9.6.17 Switching test (DS) . 128
9.6.18 Life test (DL) . 130
9.7 Failure definition . 132
9.7.1 Failure criteria . 132
9.7.2 Failed components . 133
9.8 Data documentation . 133
9.9 Delivery . 133
9.10 Packing, despatching, handling and storage . 133
9.10.1 Overview . 133
9.10.2 ESD sensitivity . 133
10 Sun simulators and calibration procedures . 134
10.1 Sun simulators . 134
10.1.1 Spectral distribution . 134
10.1.2 Irradiance uniformity . 142
10.1.3 Irradiance stability . 142
10.2 Standard cell and Sun simulator calibration . 143
10.2.1 Primary standards . 143
10.2.2 Secondary working standards (SWS) . 144
10.2.3 Standards cells documentation . 145
10.2.4 Maintenance of standards . 146
10.2.5 Recalibration and intercomparation . 146
10.2.6 Sun simulator calibration and maintenance . 146
11 Capacitance measurement methods . 147
11.1 Single junction solar cell capacitance measurement . 147
11.1.1 Overview . 147
11.1.2 Signal measurement method . 148
11.1.3 Measurement procedure . 148
11.1.4 Measurement analysis . 152
11.1.5 Measurement of the capacitance of a multi-junction cell . 155
11.2 Time domain capacitance measurement . 155
11.2.1 Overview . 155
11.2.2 Measurement procedure . 156
Annex A (normative) Source control drawing for photovoltaic assembly
(SCD-PVA) - DRD . 158
Annex B (normative) Source control drawing for solar cell assembly
(SCD-SCA) - DRD . 164
Annex C (normative) Source control drawing for bare solar cell
(SCD-BSC) - DRD . 169
Annex D (normative) Source control drawing for coverglass
(SCD-CVG) - DRD . 178
Annex E (normative) Source control drawing for External Protection
Diodes (SCD-EPD) - DRD . 184
Annex F (normative) Process identification document (PID) - DRD . 188
Annex G (normative) Data documentation package (DDP) - DRD . 190
Bibliography . 193

Figures
Figure 4-1: Specification hierarchy . 23
Figure 6-1: Definition of cell defects. 61
Figure 6-2: Test points for electrical performance measurement . 63
Figure 7-1: Definition of bare solar cell defects . 81
Figure 8-1: Methods of defining coverglass orientation . 96
Figure 8-2: Edge chip parameters . 101
Figure 8-3: Corner chip parameters . 101
Figure 8-4: Coverglass manufacturing tolerance limits . 103
Figure 8-5: Schematic for calculating surface resistivity . 105
Figure 8-6: Definition of coverglass flatness . 106
Figure 9-1: Diode forward and reverse test profile . 129
Figure 9-2: Diode switching test profile . 130
Figure 11-1: Solar cell impedance measurement equipment . 149
Figure 11-2: Channel balancing and reduction of the parasitic inductances. 150
Figure 11-3: Measurement of the resistance value of the shunt in the measuring
conditions (shunt in parallel with the input of the network analyser). 151
Figure 11-4: Small signal electrical schema biased with a DC voltage associated
impedance . 153
Figure C-1 : BSC front side . 171
Figure C-2 : BSC rear side . 172
Figure C-3 : BSC contact . 172

Tables
Table 4-1: Test tolerances on temperature . 26
Table 5-1: Qualification test plan for PVA . 37
Table 5-2: Acceptance test plan . 42
Table 6-1: Qualification test plan for SCA . 58
Table 6-2: Maximum dimensions of corner chips, edge chips and surface nicks . 61
Table 7-1: Acceptance test matrix . 75
Table 7-2: Qualification test plan for bare solar cells . 78
Table 7-3: Maximum dimensions of corner chips, edge chips and surface nicks . 81
Table 8-1: Qualification test plan for coverglasses . 99
Table 9-1: Acceptance test matrix IPD . 114
Table 9-2: Acceptance test matrix EPD . 114
Table 9-3: Qualification test plan for integral protection diode. 117
Table 9-4: Qualification test plan for external protection diodes . 118
Table 9-5: Diode life test parameters . 132
Table 10-1: AM0 solar spectral irradiance (WRC) . 135
Table 10-2: Classes of single and multi-source solar simulators . 140
Table 10-3: Classes of solar simulators with respect to nonconformity of irradiance
uniformity . 142
Table 10-4: Classes of solar simulators with respect to temporal instability of irradiance . 143
Table B-1 : Minimum current requirement for solar assemblies (25 °C or operating
temperature) . 166
Table C-1 : Electrical performance pass-fail criteria . 174

Foreword
This document (EN 16603-20-08:2014) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16603-20-08:2014) originates from ECSS-E-ST-20-08C Rev.1.
This European Standard shall be given the status of a national standard, either
by publication of an identical text or by endorsement, at the latest by February
2015, and conflicting national standards shall be withdrawn at the latest by
February 2015.
Attention is drawn to the possibility that some of the elements of this document
may be the subject of patent rights. CEN [and/or CENELEC] shall not be held
responsible for identifying any or all such patent rights.
This document has been prepared under a mandate given to CEN by the
European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
According to the CEN-CENELEC Internal Regulations, the national standards
organizations of the following countries are bound to implement this European
Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United
Kingdom.
Introduction
The qualification, procurement, storage and delivery of space solar arrays are
defined in the dedicated solar array specification, where requirements for the
solar array electrical layout, structure and mechanism are specified.
This Standard outlines the requirements for the qualification, procurement,
storage and delivery of the main assemblies and components of the space solar
array electrical layout: photovoltaic assemblies, solar cell assemblies, bare solar
cells, coverglass and protection diodes. This Standard does not outline the
requirements for the qualification, procurement, storage and delivery of the
solar array subsystem, comprising the solar panels, structural parts and
mechanisms.
The general requirements are covered in the main part of this Standard
(clauses 5 to 11). Annex A to Annex E specify the contents of the source control
drawing of photovoltaic and solar cell assemblies, bare solar cells coverglasses
and protection diodes and include the inspection data, physical and electrical
characteristics, other ratings and acceptance and qualification specific
requirements, which can be different for each space project.
This Standard is divided into five specific subjects, each one corresponding to
each assembly or component:
• Clause 5 defines requirements for photovoltaic assemblies,
• Clause 6for solar cell assemblies,
• Clause 7 for bare solar cells,
• Clause 8for coverglasses,
• Clause 9 for protection diodes.
Two additional clauses are dedicated to Sun simulators and calibration
procedures (clause 10 and capacitance measurement methods (clause 11).
Scope
This Standard specifies the general requirements for the qualification,
procurement, storage and delivery of photovoltaic assemblies, solar cell
assemblies, bare solar cells, coverglasses and protection diodes suitable for
space applications.
This standard does not cover the particular qualification requirements for a
specific mission.
This Standard primarily applies to qualification approval for photovoltaic
assemblies, solar cell assemblies, bare solar cells, coverglasses and protection
diodes, and to the procurement of these items.
This standard is limited to crystaline Silicon and single and multi-junction
GaAs solar cells with a thickness of more than 50 µm and does not include thin
film solar cell technologies and poly-crystaline solar cells.
This Standard does not cover the concentration technology, and especially the
requirements related to the optical components of a concentrator (e.g. reflector
and lens) and their verification (e.g. collimated light source).
This Standard does not apply to qualification of the solar array subsystem, solar
panels, structure and solar array mechanisms.
This standard may be tailored for the specific characteristic and constrains of a
space project in conformance with ECSS-S-ST-00.

Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revision of any of these publications
do not apply, However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the more recent editions of
the normative documents indicated below. For undated references, the latest
edition of the publication referred to applies.

EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system – Glossary of terms
EN 16602-60 ECSS-Q-ST-60 Space product assurance — Electrical, electronic and
electromechanical (EEE) components
EN 16602-70-06 ECSS-Q-ST-70-06 Space product assurance – Particle and UV radiation
testing for space materials
EN 16602-70-09 ECSS-Q-ST-70-09 Space product assurance – Measurements of thermo-
optical properties of thermal control materials
ISO 15387:2005 Space Systems – Single junction space solar cells –
Measurement and calibration procedures
ISO 14644-1:1999 Cleanrooms and associated controlled environments –
Part 1: Classification of air cleanliness
MIL-E-12397B Eraser, rubber pumice for testing coated optical
elements
IEC 60749-26:2006 Semiconductor devices – Mechanical and climatic test
methods - Part 26: Electrostatic discharge (ESD)
sensitivity testing – Human body model (HBM)
ASTM D1193-99 Standard specification for reagent water
ESCC 23800 Issue 1 Electrostatic Discharge Sensitivity Test Method
ESCC 24900 Issue 2 Minimum Requirements for Controlling
Environmental Contamination of Components
DIN 53289 Testing of adhesives for metals; floating roller peel test
Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this Standard, the terms and definitions from
ECSS-S-ST-00-01 apply, in particular for the following terms:
qualification
verification
3.2 Terms specific to the present standard
3.2.1 General
3.2.1.1 blistering
forming of multiple small air bubbles inside the perimeter of a finish layer
3.2.1.2 bubbles
gaseous inclusion in the cell, coverglass or coverglass adhesive
3.2.1.3 chip
local absence of material along the edges and corners of a complete component
and which extend through the thickness of the component
3.2.1.4 crack
fissure in the component with no separated portion from the remainder
NOTE Cracks can propagate from the edge of the material
(edge cracks) or terminate at both ends within the
material (surface cracks).
3.2.1.5 delamination
physical separation between two material layers, which are joined in design
3.2.1.6 discolouration
local variation of solar cell anti–reflection coating colour due to the influence of
the structure orientation of the cell layer immediately below or the variation of
the anti–reflection coating layer thickness
3.2.1.7 dig
cavities in the surface of a component caused by impact with a pointed object or
by crushing a material into the surface
3.2.1.8 inclusion
volume contained within the component that is devoid of the substrate material
3.2.1.9 in–process testing
tests performed during the manufacturing of a component or assembly in order
to identify, in advance, defects or low performances
3.2.1.10 nick
local absence of material on the surface of a complete component which does
not extend through the thickness of the component
3.2.1.11 peeling
forming of a delamination of a finish layer at the edge of the finished area. A
blister at the edge of the surface
3.2.1.12 procurement lot
set of shipment lots of solar cells assemblies, bare solar cells and coverglasses,
manufactured with the same processes and materials, with identical
manufacturing lines, that fill the same purchase order
3.2.1.13 scratch
linear marking of the component that represents a volume devoid of the
substrate material emanating from a single face of the component and not
penetrating through the whole thickness of the substrate at any point
3.2.1.14 shipment lot
solar cell assemblies, bare solar cells and coverglasses manufactured with the
same processes and materials with identical manufacturing lines delivered to
the customer as a part of a purchase order
3.2.1.15 spatter
small bits of solid coating material imbedded on or in the coating or substrate
3.2.1.16 voids
absence of deposited materials
NOTE Examples are absence of cell contact material or
anti–reflection coating.
3.2.2 Photovoltaic assemblies
3.2.2.1 photovoltaic assembly
power generating network comprising the interconnected solar cell assemblies
(strings and sections), the shunt and blocking diodes, the
...