Standard Test Method for Solderability of Metallic-Coated Products

SIGNIFICANCE AND USE
4.1 In order that a sound solder joint be formed simply and quickly in a production operation, the molten solder must readily wet and spread over the surfaces of the products being joined. For this to happen, the surfaces must be clean or be soiled only with contaminants that are easily removed by an appropriate flux. It often is necessary that the flux be only strong enough to remove the normally occurring soils. A more aggressive flux may corrode the product and have other harmful effects. Nonactivated rosin in alcohol is the standard flux used in this test method; however, provision is made for the use of other fluxes. Since rosin is a mild flux, it provides better discrimination between acceptable and unacceptable solderability in marginal cases than do more active fluxes.  
4.2 Metallic coatings are frequently used to provide solderable surfaces. But, an improperly produced coating may not yield the required solderability. There are many coating defects that cause poor solderability including porosity, codeposited impurities, incorrect thickness, and surface contamination. It may be difficult or impractical to test a coating directly for each of the undesirable conditions. In these instances solderability is tested. Products that pass the solderability test can be expected to solder satisfactorily in production. In the case of failure to pass the test, the test results will not reveal the cause of the inadequate solderability, though, with experience, an operator may be able to identify the cause.  
4.3 This test method measures the ability of a coated product to be soldered with Sn60Pb40 or Sn63Pb37 solder using a nonactivated rosin flux. This solder and this flux, or an activated form of it, are generally used in the assembly of electronic products.  
4.4 It is intended that the tested specimens be components of electronic products or articles with the same general shape and mass. Articles that are much more massive than this will heat up too slowly during...
SCOPE
1.1 This test method provides a procedure for evaluating the solderability of metallic-coated products and test specimens to assure satisfactory performance in manufacturing processes requiring soldering with soft (tin-lead) solder and rosin flux. This test method is applicable only for testing coatings that are normally readily solderable such as: tin, tin-lead alloy, silver, and gold.  
1.2 This test method is qualitative and broadly applicable. It is easy to perform and requires only simple equipment. There are other solderability tests not covered by this test method that are more applicable to specific situations, yield quantitative results, or both. Several are described in the literature.2 This is a “go-no-go” test and does not grade solderability as excellent, good, fair, and so forth.  
1.3 This standard may involve hazardous materials, operations, and equipment. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.  
1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

General Information

Status
Published
Publication Date
31-Oct-2023
Drafting Committee
B08.10 - Test Methods

Relations

Effective Date
01-Nov-2023
Effective Date
01-Nov-2023
Effective Date
01-Nov-2023
Effective Date
01-Nov-2023
Effective Date
01-Nov-2023
Effective Date
01-Nov-2023
Effective Date
01-Nov-2023

Overview

ASTM B678-23, Standard Test Method for Solderability of Metallic-Coated Products, establishes a qualitative procedure to evaluate the solderability of products and specimens with metallic coatings. This standard ensures reliable performance in manufacturing processes that require soldering with soft tin-lead (Sn-Pb) solder and rosin flux. It is particularly applicable to coatings that are typically solderable, such as tin, tin-lead alloy, silver, and gold. The test helps manufacturers verify that metallic-coated components will form satisfactory solder joints under production conditions, which is critical for the assembly of electronic products and other applications where soldered connections are essential.

Key Topics

  • Purpose and Significance
    The standard addresses the need for solder to readily wet and adhere to the surfaces being joined, which is crucial for reliable electronic assembly. Since surface cleanliness and correct flux strength are key, the method uses nonactivated rosin flux for better discrimination in marginal cases.

  • Testing Method

    • No pre-cleaning unless specified by the production process
    • Application of a standard rosin flux
    • Immersion of specimen in molten tin-lead solder (Sn60Pb40 or Sn63Pb37)
    • Qualitative evaluation for complete and uniform solder coverage
  • Applicability
    The method is suited to coatings expected to be readily solderable, such as tin, tin-lead alloy, silver, and gold. It uses a simple “go-no-go” evaluation, not grading solderability but providing a clear pass/fail criterion.

  • Limitations

    • Not intended for non-standard or complex coatings
    • Results do not quantify the degree of solderability or identify specific causes of failure
    • Safety and environmental concerns must be managed by users in accordance with local regulations

Applications

ASTM B678-23 is widely used in industries where solderable metallic coatings are essential for reliable electronic assembly, including:

  • Electronic Components and Circuit Boards:
    Ensures that terminals, leads, and pads will accept solder during manufacturing and assembly processes, reducing the risk of unreliable joints and product failures.
  • PCB Manufacturing:
    Assures that metallic finishes applied to printed circuit boards are suitable for soldering, preventing costly defects at later stages.
  • Quality Assurance:
    Plays a key role in incoming inspection, supplier qualification, and process validation by providing a standardized method for confirming coating quality.
  • Research and Development:
    Used in the development of new electroplating and coating processes to validate solderability performance before full-scale implementation.

By using this standard, manufacturers and suppliers can minimize the risks associated with poor soldering, such as component failure, field returns, and reliability issues in electronic products.

Related Standards

For best results and broader context, ASTM B678-23 is commonly referenced alongside other key industry standards:

  • ASTM B32 - Specification for Solder Metal:
    Specifies the composition of solder alloys used in testing and manufacturing.
  • ASTM D509 - Test Methods of Sampling and Grading Rosin:
    Provides methods for characterizing the rosin flux used in solderability testing.
  • ASTM D1193 - Specification for Reagent Water:
    Defines water quality standards for use in aging and cleaning processes.
  • Other Solderability Test Methods:
    More quantitative or specialized solderability tests are available for specific applications and are cited in related literature.

Summary

ASTM B678-23 enhances manufacturing consistency and product reliability by providing a standardized, practical method for assessing the solderability of metallic-coated products. Its application is crucial for manufacturers aiming to meet the rigorous quality and reliability demands of today's electronic industry. By adopting this qualitative “go-no-go” approach, organizations can efficiently ensure soldering success and reduce the risk of downstream defects.

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Frequently Asked Questions

ASTM B678-23 is a standard published by ASTM International. Its full title is "Standard Test Method for Solderability of Metallic-Coated Products". This standard covers: SIGNIFICANCE AND USE 4.1 In order that a sound solder joint be formed simply and quickly in a production operation, the molten solder must readily wet and spread over the surfaces of the products being joined. For this to happen, the surfaces must be clean or be soiled only with contaminants that are easily removed by an appropriate flux. It often is necessary that the flux be only strong enough to remove the normally occurring soils. A more aggressive flux may corrode the product and have other harmful effects. Nonactivated rosin in alcohol is the standard flux used in this test method; however, provision is made for the use of other fluxes. Since rosin is a mild flux, it provides better discrimination between acceptable and unacceptable solderability in marginal cases than do more active fluxes. 4.2 Metallic coatings are frequently used to provide solderable surfaces. But, an improperly produced coating may not yield the required solderability. There are many coating defects that cause poor solderability including porosity, codeposited impurities, incorrect thickness, and surface contamination. It may be difficult or impractical to test a coating directly for each of the undesirable conditions. In these instances solderability is tested. Products that pass the solderability test can be expected to solder satisfactorily in production. In the case of failure to pass the test, the test results will not reveal the cause of the inadequate solderability, though, with experience, an operator may be able to identify the cause. 4.3 This test method measures the ability of a coated product to be soldered with Sn60Pb40 or Sn63Pb37 solder using a nonactivated rosin flux. This solder and this flux, or an activated form of it, are generally used in the assembly of electronic products. 4.4 It is intended that the tested specimens be components of electronic products or articles with the same general shape and mass. Articles that are much more massive than this will heat up too slowly during... SCOPE 1.1 This test method provides a procedure for evaluating the solderability of metallic-coated products and test specimens to assure satisfactory performance in manufacturing processes requiring soldering with soft (tin-lead) solder and rosin flux. This test method is applicable only for testing coatings that are normally readily solderable such as: tin, tin-lead alloy, silver, and gold. 1.2 This test method is qualitative and broadly applicable. It is easy to perform and requires only simple equipment. There are other solderability tests not covered by this test method that are more applicable to specific situations, yield quantitative results, or both. Several are described in the literature.2 This is a “go-no-go” test and does not grade solderability as excellent, good, fair, and so forth. 1.3 This standard may involve hazardous materials, operations, and equipment. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

SIGNIFICANCE AND USE 4.1 In order that a sound solder joint be formed simply and quickly in a production operation, the molten solder must readily wet and spread over the surfaces of the products being joined. For this to happen, the surfaces must be clean or be soiled only with contaminants that are easily removed by an appropriate flux. It often is necessary that the flux be only strong enough to remove the normally occurring soils. A more aggressive flux may corrode the product and have other harmful effects. Nonactivated rosin in alcohol is the standard flux used in this test method; however, provision is made for the use of other fluxes. Since rosin is a mild flux, it provides better discrimination between acceptable and unacceptable solderability in marginal cases than do more active fluxes. 4.2 Metallic coatings are frequently used to provide solderable surfaces. But, an improperly produced coating may not yield the required solderability. There are many coating defects that cause poor solderability including porosity, codeposited impurities, incorrect thickness, and surface contamination. It may be difficult or impractical to test a coating directly for each of the undesirable conditions. In these instances solderability is tested. Products that pass the solderability test can be expected to solder satisfactorily in production. In the case of failure to pass the test, the test results will not reveal the cause of the inadequate solderability, though, with experience, an operator may be able to identify the cause. 4.3 This test method measures the ability of a coated product to be soldered with Sn60Pb40 or Sn63Pb37 solder using a nonactivated rosin flux. This solder and this flux, or an activated form of it, are generally used in the assembly of electronic products. 4.4 It is intended that the tested specimens be components of electronic products or articles with the same general shape and mass. Articles that are much more massive than this will heat up too slowly during... SCOPE 1.1 This test method provides a procedure for evaluating the solderability of metallic-coated products and test specimens to assure satisfactory performance in manufacturing processes requiring soldering with soft (tin-lead) solder and rosin flux. This test method is applicable only for testing coatings that are normally readily solderable such as: tin, tin-lead alloy, silver, and gold. 1.2 This test method is qualitative and broadly applicable. It is easy to perform and requires only simple equipment. There are other solderability tests not covered by this test method that are more applicable to specific situations, yield quantitative results, or both. Several are described in the literature.2 This is a “go-no-go” test and does not grade solderability as excellent, good, fair, and so forth. 1.3 This standard may involve hazardous materials, operations, and equipment. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

ASTM B678-23 is classified under the following ICS (International Classification for Standards) categories: 25.160.50 - Brazing and soldering. The ICS classification helps identify the subject area and facilitates finding related standards.

ASTM B678-23 has the following relationships with other standards: It is inter standard links to ASTM B678-86(2017), ASTM B734-97(2023), ASTM B700-20, ASTM B733-22, ASTM B607-21, ASTM B545-22, ASTM B488-18. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

ASTM B678-23 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation: B678 − 23
Standard Test Method for
Solderability of Metallic-Coated Products
This standard is issued under the fixed designation B678; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 2. Referenced Documents
2.1 ASTM Standards:
1.1 This test method provides a procedure for evaluating the
D509 Test Methods of Sampling and Grading Rosin
solderability of metallic-coated products and test specimens to
D1193 Specification for Reagent Water
assure satisfactory performance in manufacturing processes
requiring soldering with soft (tin-lead) solder and rosin flux.
3. Summary of Test Method
This test method is applicable only for testing coatings that are
3.1 The specimen to be tested is coated with rosin flux,
normally readily solderable such as: tin, tin-lead alloy, silver,
and gold. dipped briefly into molten tin-lead solder, and examined for
complete and uniform coverage by the solder. When specifi-
1.2 This test method is qualitative and broadly applicable. It
cally required, the specimens are artificially aged before testing
is easy to perform and requires only simple equipment. There
by exposure to hot, humid air.
are other solderability tests not covered by this test method that
are more applicable to specific situations, yield quantitative
4. Significance and Use
results, or both. Several are described in the literature. This is
4.1 In order that a sound solder joint be formed simply and
a “go-no-go” test and does not grade solderability as excellent,
quickly in a production operation, the molten solder must
good, fair, and so forth.
readily wet and spread over the surfaces of the products being
1.3 This standard may involve hazardous materials,
joined. For this to happen, the surfaces must be clean or be
operations, and equipment. This standard does not purport to
soiled only with contaminants that are easily removed by an
address all of the safety concerns, if any, associated with its
appropriate flux. It often is necessary that the flux be only
use. It is the responsibility of the user of this standard to
strong enough to remove the normally occurring soils. A more
establish appropriate safety, health, and environmental prac-
aggressive flux may corrode the product and have other
tices and determine the applicability of regulatory limitations
harmful effects. Nonactivated rosin in alcohol is the standard
prior to use.
flux used in this test method; however, provision is made for
1.4 This international standard was developed in accor-
the use of other fluxes. Since rosin is a mild flux, it provides
dance with internationally recognized principles on standard-
better discrimination between acceptable and unacceptable
ization established in the Decision on Principles for the
solderability in marginal cases than do more active fluxes.
Development of International Standards, Guides and Recom-
4.2 Metallic coatings are frequently used to provide solder-
mendations issued by the World Trade Organization Technical
able surfaces. But, an improperly produced coating may not
Barriers to Trade (TBT) Committee.
yield the required solderability. There are many coating defects
that cause poor solderability including porosity, codeposited
impurities, incorrect thickness, and surface contamination. It
This test method is under the jurisdiction of ASTM Committee B08 on Metallic
may be difficult or impractical to test a coating directly for each
and Inorganic Coatings and is the direct responsibility of Subcommittee B08.10 on
of the undesirable conditions. In these instances solderability is
Test Methods.
tested. Products that pass the solderability test can be expected
Current edition approved Nov. 1, 2023. Published January 2024. Originally
approved in 1986. Last previous edition approved in 2017 as B678 – 86 (2017). to solder satisfactorily in production. In the case of failure to
DOI: 10.1520/B0678-23.
Long, J. B., “A Critical Review of Solderability Testing,” in Properties of
Electrodeposits, Their Measurement and Significance, edited by Richard Sard, For referenced ASTM standards, visit the ASTM website, www.astm.org, or
Henry Leidheiser, Jr., and Fielding Ogburn, The Electrochemical Society, 1975. contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
Harding, W. B., “Solderability Testing,” Plating, Vol 52, No. 10, October 1965, Standards volume information, refer to the standard’s Document Summary page on
pp. 971–981. the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
B678 − 23
NOTE 2—If there is insufficient solder in the pot, the immersion of a
pass the test, the test results will not reveal the cause of the
room-temperature specimen will cool the solder out of the test range.
inadequate solderability, though, with experience, an operator
may be able to identify the cause.
8. Procedure
4.3 This test method measures the ability of a coated
8.1 Do not clean the specimens. The solderability test is to
product to be soldered with Sn60Pb40 or Sn63Pb37 solder
be performed on them in their as-received condition. If in the
using a nonactivated rosin flux. This solder and this flux, or an
normal production process the specimens are cleaned before
activated form of it, are generally used in the assembly of
they are soldered, it may be preferred to clean the test
electronic products.
specimens in the same way. If such cleaning is required, it shall
4.4 It is intended that the tested specimens be components
be specifically called for. Avoid contaminating the specimens.
of electronic products or articles with the same general shape
Particularly do not touch the areas to be tested with bare hands.
and mass. Articles that are much more massive than this will
Use tweezers, forceps, cotton gloves, or other appropriate
heat up too slowly during the solder immersion. If more
means.
massive specimens are to be tested, a longer immersion time
8.2 For tin and tin-lead coatings, if it is required that the
will have to be used, the time to be determined by experiment.
specimens be aged before solderability testing, proceed as
4.5 If the specimen tested is longer than 25 mm, its bottom
directed in 8.3. If the specimens are not to be aged, start the
end will be in the
...


This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: B678 − 86 (Reapproved 2017) B678 − 23
Standard Test Method for
Solderability of Metallic-Coated Products
This standard is issued under the fixed designation B678; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope
1.1 This test method provides a procedure for evaluating the solderability of metallic-coated products and test specimens to assure
satisfactory performance in manufacturing processes requiring soldering with soft (tin-lead) solder and rosin flux. This test method
is applicable only for testing coatings that are normally readily solderable such as: tin, tin-lead alloy, silver, and gold.
1.2 This test method is qualitative and broadly applicable. It is easy to perform and requires only simple equipment. There are
other solderability tests not covered by this test method that are more applicable to specific situations, yield quantitative results,
or both. Several are described in the literature. This is a “go-no-go” test and does not grade solderability as excellent, good, fair,
and so forth.
1.3 This standard may involve hazardous materials, operations, and equipment. This standard does not purport to address all
of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate
safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.
1.4 This international standard was developed in accordance with internationally recognized principles on standardization
established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued
by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
2. Referenced Documents
2.1 ASTM Standards:
B32 Specification for Solder Metal
D509 Test Methods of Sampling and Grading Rosin
D1193 Specification for Reagent Water
3. Summary of Test Method
3.1 The specimen to be tested is coated with rosin flux, dipped briefly into molten tin-lead solder, and examined for complete and
uniform coverage by the solder. When specifically required, the specimens are artificially aged before testing by exposure to hot,
humid air.
This test method is under the jurisdiction of ASTM Committee B08 on Metallic and Inorganic Coatings and is the direct responsibility of Subcommittee B08.10 on Test
Methods.
Current edition approved Nov. 1, 2017Nov. 1, 2023. Published December 2017January 2024. Originally approved in 1986. Last previous edition approved in 20112017
as B678 – 86 (2011).(2017). DOI: 10.1520/B0678-86R17.10.1520/B0678-23.
Long, J. B., “A Critical Review of Solderability Testing,” in Properties of Electrodeposits, Their Measurement and Significance, edited by Richard Sard, Henry
Leidheiser, Jr., and Fielding Ogburn, The Electrochemical Society, 1975.
Harding, W. B., “Solderability Testing,” Plating, Vol 52, No. 10, October 1965, pp. 971–981.
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
B678 − 23
4. Significance and Use
4.1 In order that a sound solder joint be formed simply and quickly in a production operation, the molten solder must readily wet
and spread over the surfaces of the products being joined. For this to happen, the surfaces must be clean or be soiled only with
contaminants that are easily removed by an appropriate flux. It often is necessary that the flux be only strong enough to remove
the normally occurring soils. A more aggressive flux may corrode the product and have other harmful effects. Nonactivated rosin
in alcohol is the standard flux used in this test method; however, provision is made for the use of other fluxes. Since rosin is a mild
flux, it provides better discrimination between acceptable and unacceptable solderability in marginal cases than do more active
fluxes.
4.2 Metallic coatings are frequently used to provide solderable surfaces. But, an improperly produced coating may not yield the
required solderability. There are many coating defects that cause poor solderability including porosity, codeposited impurities,
incorrect thickness, and surface contamination. It may be difficult or impractical to test a coating directly for each of the undesirable
conditions. In these instances solderability is tested. Products that pass the solderability test can be expected to solder satisfactorily
in production. In the case of failure to pass the test, the test results will not reveal the cause of the inadequate solderability, though,
with experience, an operator may be able to identify the cause.
4.3 This test method measures the ability of a coated product to be soldered with 60/40 tin/lead Sn60Pb40 or Sn63Pb37 solder
using a nonactivated rosin flux. This solder and this flux, or an activated form of it, are generally used in the assembly of electronic
products.
4.4 It is intended that the tested specimens be components of electronic products or articles with the same general shape and mass.
Articles that are much more massive than this will heat up too slowly during the solder immersion. If more massive specimens
are to be tested, a longer immersion time will have to be used, the time to be determined by experiment.
4.5 If the specimen tested is longer than 25 mm, its bottom end will be in the solder for significantly longer than the specified time.
Therefore, if the specimen is longer than 25 mm, the results obtained at the bottom end of the specimen are invalid. This part of
the specimen shall be discounted in the evaluation of the results. A second set of tests can be run on additional specimens in which
the specimens are only partly immersed. These would be used to evaluate the bottom ends.
5. Flux
5.1 The flux shall be a 25 6 5 mass % 25 mass % 6 5 mass % solution of water-white rosin, as defined by Test Methods D509,
Grade WW, dissolved in isopropyl alcohol of a minimum purity of 99 mass % 99 mass % (Note 1). A different flux, such as mildly
activated and activated rosin fluxes, may be used if the specifying authority requires it. Such deviation from the standard shall be
s
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