ASTM E2444-11(2018)

This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation: E2444 −11 (Reapproved 2018)
Standard Terminology Relating to
Measurements Taken on Thin, Reflecting Films
This standard is issued under the fixed designation E2444; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
1. Scope 3-D data set—a three-dimensional group of points with a
topographical z-value for each (x, y) pixel location within the
1.1 This standard consists of terms and definitions pertain-
interferometric microscope’s field of view. E2244, E2245,
ing to measurements taken on thin, reflecting films, such as
E2246
found in microelectromechanical systems (MEMS) materials.
In particular, the terms are related to the standards in Section 2,
anchor—in a surface-micromachining process, the portion of
which were generated by Committee E08 on Fatigue and
the test structure where a structural layer is intentionally
Fracture. Terminology E1823 Relating to Fatigue and Fracture
attached to its underlying layer. E2244, E2245, E2246
Testing is applicable to this standard.
anchor lip—in a surface-micromachining process, the free-
1.2 The terms are listed in alphabetical order.
standing extension of the structural layer of interest around
1.3 This international standard was developed in accor-
the edges of the anchor to its underlying layer.
DISCUSSION—In some processes, the width of the anchor lip may be
dance with internationally recognized principles on standard-
zero. E2244, E2245, E2246
ization established in the Decision on Principles for the
Development of International Standards, Guides and Recom-
bulk micromachining—a MEMS fabrication process where
mendations issued by the World Trade Organization Technical
the substrate is removed at specified locations. E2244,
Barriers to Trade (TBT) Committee.
E2245, E2246
cantilever—a test structure that consists of a freestanding
2. Referenced Documents
2 beam that is fixed at one end. E2244, E2245, E2246
2.1 ASTM Standards:
E1823 Terminology Relating to Fatigue and FractureTesting
fixed-fixed beam —a test structure that consists of a freestand-
E2244 Test Method for In-Plane Length Measurements of
ing beam that is fixed at both ends. E2244, E2245
Thin, Reflecting Films Using an Optical Interferometer
in-plane length (or deflection) measurement, L (or D)
E2245 Test Method for Residual Strain Measurements of
[L]—the experimental determination of the straight-line
Thin, Reflecting Films Using an Optical Interferometer
distance between two transitional edges in a MEMS device.
E2246 Test Method for Strain Gradient Measurements of
DISCUSSION—This length (or deflection) measurement is made paral-
Thin, Reflecting Films Using an Optical Interferometer
lel to the underlying layer (or the xy-plane of the interferometric
microscope). E2244, E2245, E2246
3. Terminology
interferometer—a non-contact optical instrument used to
3.1 Terms and Their Definitions:
obtain topographical 3-D data sets.
DISCUSSION—The height of the sample is measured along the z-axis
2-D data trace—a two-dimensional group of points that is
of the interferometer. The x-axis is typically aligned parallel or
extracted from a topographical 3-D data set and that is
perpendicular to the transitional edges to be measured. E2244,
parallel to the xz-or yz-plane of the interferometric
E2245, E2246
microscope. E2244, E2245
MEMS—microelectromechanical systems. E2244, E2245,
E2246
This test method is under the jurisdiction ofASTM Committee E08 on Fatigue
microelectromechanical systems, MEMS—in general, this
and Fracture and is the direct responsibility of Subcommittee E08.02 on Standards
and Terminology. term is used to describe micron-scale structures, sensors,
Current edition approved May 1, 2018. Published May 2018. Orginially
actuators, and technologies used for their manufacture (such
ε1
approved in 2005. Last previous edition approved in 2011 as E2444–11 . DOI:
as, silicon process technologies), or combinations thereof.
10.1520/E2444-11R18.
E2244, E2245, E2246
...