SIST EN 61076-4:2002

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Connectors with assessed quality, for use in d.c., low frequency analogue and digital high-speed data applications - Part 4: Sectional specification - Printed board connectors (IEC 61076-4:1995)Steckverbinder mit bewerteter Qualität für Gleichspannungs- und Niederfrequenzanwendungen sowie digitale Anwendungen mit hoher Übertragungsrate -- Teil 4: Rahmenspezifikation für Steckverbinder für gedruckte SchaltungenConnecteurs sous assurance de la qualité, pour utilisation dans le cadre d'applications analogiques en courant continu et à basse fréquence et dans le cadre d'applications numériques utilisant des débits élevés pour le transfert des données -- Partie 4: Spécification intermédiaire - Connecteurs pour cartes impriméesConnectors with assessed quality, for use in d.c., low frequency analogue and in digital high-speed data applications -- Part 4: Sectional specification - Printed board connectors31.220.10Plug-and-socket devices. ConnectorsICS:Ta slovenski standard je istoveten z:EN 61076-4:1996SIST EN 61076-4:2002en01-september-2002SIST EN 61076-4:2002SLOVENSKI
STANDARD
IEC•NORMEINTERNATIONALEINTERNATIONALSTANDARDCEIIEC1076-4QC 480300Première éditionFirst edition1995-09Connecteurs sous assurance de la qualité,pour utilisation dans le cadre d'applicationsanalogiques en courant continu et à bassefréquence et dans le cadre d'applicationsnumériques utilisant des débits élevéspour le transfert des données -Partie 4:Spécification intermédiaire -Connecteurs pour cartes impriméesConnectors with assessed quality, for usein d.c., low-frequency analogue and in digitalhigh-speed data applications -Part 4:Sectional specification -Printed board connectors© CEI 1995 Droits de reproduction réservés — Copyright — all rights reservedAucune partie de cette publication ne peut être reproduite niutilisée sous quelque forme que ce soit et par aucun pro-cédé, électronique ou mécanique, y compris la photocopie etles microfilms, sans l'accord écrit de l'éditeur.No part of this publication may be reproduced or utilized inany form or by any means, electronic or mechanical,including photocopying and microfilm, without permissionin writing from the publisher.Bureau Central de la Commission Electrotechnique Internationale 3, rue de Varembé Genève, SuisseCommission Electrotechnique InternationaleInternational Electrotechnical CommissionMewiiyHapopHaR 3neisrpoTexHN4ecnaa KtMHCCHR•CODE PRIXPRICE CODEPour prix, voir catalogue en vigueurFor price, see current catalogueSSIST EN 61076-4:2002

1076-4 © I EC:1995– 3 –CONTENTSPageFOREWORD 5Clause1General 91.1 Scope91.2 Normative references 92Technical information 112.1 Terminology
112.2 Classification into climatic categories
112.3 Creepage and clearance distances
112.4 Current-carrying capacity 112.5 IEC type designation
132.6 Marking 153Quality assessment procedures
154Tests and test schedules 154.1 General 154.2 Test procedures and measuring methods 154.3 Pre-conditioning
174.4 Wiring and mounting of specimens 174.4.1 Wiring
174.4.2 Mounting
174.5 Test schedules
174.5.1 Basic (minimum) test schedule
194.5.2 Full test schedule 214.5.2.1Test group P – Preliminary 214.5.2.2 Test group AP – Dynamic/climatic
234.5.2.3 Test group BP – Mechanical endurance 274.5.2.4 Test group CP – Moisture 294.5.2.5Test group DP – Electrical load 294.5.2.6 Test group EP – Mechanical resistivity 314.5.2.7 Test group FP – Chemical resistivity
334.5.2.8 Test group GP – Connections 334.5.2.9 Test group HP – Additional
334.5.3 Qualification approval test schedule
354.5.4 Quality conformance inspection, lot-by-lot tests 374.5.5 Quality conformance inspection, periodic tests
395Blank detail specification – General 43SIST EN 61076-4:2002

1076-4 © I EC:1995– 5 –INTERNATIONAL ELECTROTECHNICAL COMMISSIONCONNECTORS WITH ASSESSED QUALITY,FOR USE IN DC, LOW-FREQUENCY ANALOGUE ANDIN DIGITAL HIGH-SPEED DATA APPLICATIONS -Part 4: Sectional specification -Printed board connectorsFOREWORD1)The IEC (International Electrotechnical Commission) is a worldwide organization for standardizationcomprising all national electrotechnical committees (IEC National Committees). The object of the IEC is topromote international cooperation on all questions concerning standardization in the electrical andelectronic fields. To this end and in addition to other activities, the IEC publishes International Standards.Their preparation is entrusted to technical committees; any IEC National Committee interested inthe subject dealt with may participate in this preparatory work. International, governmental andnon-governmental organizations liaising with the IEC also participate in this preparation. The IECcollaborates closely with the International Organization for Standardization (ISO) in accordance withconditions determined by agreement between the two organizations.2)The formal decisions or agreements of the IEC on technical matters, prepared by technical committees onwhich all the National Committees having a special interest therein are represented, express, as nearly aspossible, an international consensus of opinion on the subjects dealt with.3)They have the form of recommendations for international use published in the form of standards, technicalreports or guides and they are accepted by the National Committees in that sense.4)In order to promote international unification, IEC National Committees undertake to apply IEC InternationalStandards transparently to the maximum extent possible in their national and regional standards. Anydivergence between the IEC Standard and the corresponding national or regional standard shall be clearlyindicated in the latter.5)The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for anyequipment declared to be in conformity with one of its standards.International Standard IEC 1076-4 has been prepared by sub-committee 48B: Connectors,of IEC technical committee 48: Electromechanical components and mechanical structuresfor electronic equipment.The text of this standard is based on the following documents:DISReport on voting
48B/364/DIS48B/441 /RVDFull information on the voting for the approval of this standard can be found in the reporton voting indicated in the above table.This part 4 forms the sectional specification in the IEC quality assessment system forelectronic components (IECQ) for printed board connectors.SIST EN 61076-4:2002

1076-4 © I EC:1995— 7 —The other parts form the generic specification and the sectional specifications, some beingunder consideration or in preparation:IEC 1076-1: Generic specificationIEC 1076-2: Sectional specification for circular connectorsIEC 1076-3: Sectional specification for rectangular connectorsIEC 1076-5: Sectional specification for removable contactsIEC 1076-6: Under considerationThe QC number that appears on the cover of this publication is the specification number ofthe IEC Quality Assessment System for Electronic Components (IECQ).SIST EN 61076-4:2002

1076-4 © I EC:1995- 9 -CONNECTORS WITH ASSESSED QUALITY,FOR USE IN DC, LOW-FREQUENCY ANALOGUE ANDIN DIGITAL HIGH-SPEED DATA APPLICATIONS -Part 4: Sectional specification -Printed board connectors1 General1.1 ScopeThis part of IEC 1076 establishes uniform specifications, type testing requirementsand quality assessment procedures for a sub-family of connectors for printed boardapplications.It contains a choice of all test methods and sequences, severities and preferred values fordimensions and characteristics.It gives guidance on the rules for the preparation of detail specifications for printed boardconnectors of assessed quality, used in electronic and electrical equipment.It should be used in conjunction with the generic specification IEC 1076-1 and withrelevant detail specifications.in the event of conflict between the sectional specification and the detail specification, therequirements of the detail specification should prevail.NOTES1Connectors designed for use at radio frequencies are not covered in this standard.2 As this family of connectors is suitable to be used in mechanical structures in accordance withIEC 917, a guide will be provided in the blank detail specification, future IEC 1076-4-001.1.2 Normative referencesThe following normative documents contain provisions which, through reference in thistext, constitute provisions of this part of IEC 1076. At the time of publication, the editionsindicated were valid. All normative documents are subject to revision, and parties toagreements based on this part of IEC 1076 are encouraged to investigate the possibility ofapplying the most recent editions of the normative documents listed below. Members ofIEC and ISO maintain registers of currently valid International Standards.IEC 352-1: 1983, Solderless connections - Part 1: Solderless wrapped connections -General requirements, test methods and practical guidanceSIST EN 61076-4:2002

1076-4 ©IEC:1995- 11 -IEC 352-2: 1990, Solderless connections - Part 2: Solderless crimped connections -General requirements, test methods and practical guidanceIEC 352-3: 1993, Solderless connections - Part 3: Solderless accessible insulationdisplacement connections - General requirements, test methods and practical guidanceIEC 352-4: 1994, Solderless connections - Part 4: Solderless non-accessible insulationdisplacement connections - General requirements, test methods and practical guidanceIEC/DIS 352-5: 1995, Solderless connections - Part 5: Solderless press-in connections -General requirements, test methods and practical guidanceIEC 917: 1988, Modular order for the development of mechanical structures for electronicequipment practicesAmendment No. 1 (1993)IEC 917-2-2: 1994, Modular order for the development of mechanical structures forelectronic equipment practices - Part 2: Sectional specification - Interface co-ordinationdimensions for the 25 mm equipment practice - Section 2: Detail specification -Dimensions for subracks, chassis, backplanes, front panels and plug-in unitsIEC 1076-1: 1995, Connectors with assessed quality, for use in d.c. low frequencyanalogue and in digital high speed data applications - Part 1: Generic specification2 Technical information2.1 TerminologyThe terminology used in and applicable to this specification is stated in 2.1 of IEC 1076-1.2.2 Classification into climatic categoriesUnless otherwise impractical, the lower and upper temperatures and the duration of thedamp heat, steady state test should be selected from the preferred values stated in 2.2of IEC 1076-1.2.3 Creepage and clearance distancesThe detail specification shall specify creepage and clearance distances in accordance withthe requirements of 2.3 of IEC 1076-1.2.4 Current-carrying capacityThe detail specification shall specify the current-carrying capacity of connectors inaccordance with the requirements of 2.4 of IEC 1076-1.SIST EN 61076-4:2002

1076-4 © IEC:1995– 13 –2.5 IEC type designationConnectors to which this standard applies shall be designated by the following indicationsand in the order given:a)The letters "IEC".b)The number of the detail specification (without dashes), being eight characters(e.g. 10764100).c)A letter denoting the style of the connector (the system shall be specified in thedetail specification).d)The number of contacts of connectors or of contact cavities of connector bodies, thenumber of digits used shall be in accordance with the maximum possible number ofcontacts or cavities.e)A letter denoting the type of contact of two-part connectors or the number ofelectrically independent rows of edge-socket connectors. The following letters shall beused:–Two-part connectorFfemale contactHhermaphroditic contactMmale contact–Edge-socket connectorDdouble row (separated)Ssingle rowf) A number, being a combination of three digits describing the contact arrangement,which may include:pre-mating contact levels;–loaded contact rows;–loaded contact patterns.g)A letter denoting the basic type of the terminations, followed by a character definingthe variation.The following letters shall be used:AscrewSsolderCcrimpTtabinsulation displacement/piercingMsurface mountUplug-up plus wrapPpress-inWwrapRpress-in plus rear plug-upZno terminationsh)If prescribed in the detail specification, the type designation may optionally beextended to cover further information, such as climatic category, printed board dimensions,contact finish, etc.i)Where the detail specification provides for a variation of performance andassessment levels, a single digit and a letter shall be used to denote performance level(PL) and assessment level (AL) respectively. The digit and letter shall be prescribedin the detail specification and shall be included as the final characters of the typedesignation.SIST EN 61076-4:2002

1076-4 © IEC:1995– 15 –j) Grouping of informationThe indications (a-i) shall be grouped to clarify the type of entity:-basic description:a, b, c, d, and e;-contact arrangement:f;–terminations:g;performance:h, i.2.6 MarkingEach connector and its associated package shall be marked in accordance with therequirements specified in 2.6 of IEC 1076-1.3 Quality assessment proceduresSee clause 3 of IEC 1076-1.4 Tests and test schedules4.1 GeneralSee clause 4 of IEC 1076-1.The detail specification shall state the test sequence (in accordance with this standard),and the number of specimens for each test sequence (not less than four).Individual variants may be submitted to type tests for approval of those particular variants.It is permissible to limit the number of variants tested to a selection representative of thewhole range for which approval is required (which may be less than the range covered bythe detail specification), but each feature and characteristic shall be proved.The connectors shall have been processed in a careful and workmanlike manner, inaccordance with good current practice.4.2 Test procedures and measuring methodsThe test methods specified and given in the relevant standards are the preferred methodsbut not necessarily the only ones which can be used. In case of dispute, however, thespecified method shall be used as the referee method.Unless otherwise specified, all tests shall be carried out under standard atmosphericconditions for testing as specified in IEC 68-1.Where approval procedures are involved and alternative methods are employed, it is theresponsibility of the manufacturer to satisfy the authority granting approval that anyalternative methods which he may use give results equivalent to those obtained by themethods specified.SIST EN 61076-4:2002

1076-4 © IEC:1995– 17 –4.3 Pre-conditioningBefore the tests are made, the connectors shall be pre-conditioned under standardatmospheric conditions for testing as specified in IEC 68-1 for a period of 24 h unlessotherwise specified by the detail specification.4.4 Wiring and mounting of specimens4.4.1WiringWhere wiring of test specimens is required, the detail specification shall containinformation suitable to comply with the selected methods of test.4.4.2 MountingWhen mounting is required in a test, unless otherwise specified, the connectors shall berigidly mounted on a metal plate, a printed board or to specified accessories, whichever isapplicable, using the normal mounting method, fixing devices and panel cut-out as laiddown in the detail specification.4.5 Test schedulesTo provide for different applications of connectors, the extent of the test schedule may bedifferent in the various detail specifications.The basic (minimum) test schedule is given in 4.5.1.The detail specification shall state the tests to be carried out, and shall specify therequirements to be fulfilled.It is a requirement of this standard that in no case shall the tests required by the detailspecification be less than those listed in 4.5.1.A full test schedule is laid down in 4.5.2.For many connector types, an intermediate test schedule may be appropriate. Suchintermediate test schedule shall then be formed by using the full test schedule andomitting entire groups and/or those tests and/or conditionings that are not necessary.Test phase numbers shall not be modified but used as given in 4.5.2.The same is applicable when the sequence of the test phases in a test group is notentirely appro
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