SIST EN IEC 61189-2-809:2025
(Main)Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA
IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA).
This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-809: Prüfung des X/Y-Wärmeausdehnungskoeffizienten (CTE) für dicke Grundwerkstoffe mittels TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-809: Essai du coefficient de dilatation thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)
L’IEC 61189-2-809:2024 définit la méthode à suivre en vue de déterminer le coefficient de dilatation thermique (CTE, coefficient of thermal expansion) X/Y des matériaux isolants électriques à l'aide d'un analyseur thermomécanique (TMA, thermomechanical analyser).
La présente méthode est applicable aux matériaux qui sont solides dans toute la plage de températures utilisée, et qui conservent une dureté et une rigidité suffisantes sur la plage de températures, de telle sorte qu'une indentation irréversible de l'éprouvette par la sonde de détection ne se produise pas.
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-809. del: Preskus X/Y CTE s termomehansko analizo (TMA) za tanke podložne materiale
Ta del standarda IEC 61189 opredeljuje metodo za določanje koeficienta toplotnega raztezka vzdolž osi X/Y električnih izolacijskih materialov s termomehansko analizo (TMA).
Ta metoda se uporablja za materiale, ki ostanejo v trdnem stanju ter ohranijo zadostno trdoto in togost pri vseh uporabljenih temperaturah, da ne prihaja do nepopravljivih zarez v preskušancu zaradi zaznavne sonde.
General Information
- Status
- Published
- Public Enquiry End Date
- 31-Oct-2022
- Publication Date
- 18-Feb-2025
- Technical Committee
- ITIV - Electronics assembly technology and Environmental standardization
- Current Stage
- 6060 - National Implementation/Publication (Adopted Project)
- Start Date
- 05-Feb-2025
- Due Date
- 12-Apr-2025
- Completion Date
- 19-Feb-2025
Relations
- Effective Date
- 03-Feb-2026
Overview
SIST EN IEC 61189-2-809:2025 establishes a standardized test method for determining the X/Y coefficient of thermal expansion (CTE) of electrical insulating materials. This procedure uses a thermomechanical analyser (TMA) to assess dimensional changes of thick base materials under varying temperatures. Developed by CLC and aligned with IEC 61189-2-809:2024, the standard is integral for evaluating the thermal stability of electrical materials, printed circuit boards (PCBs), and interconnection assemblies.
The CTE test is critical for materials that remain solid and retain sufficient hardness and rigidity across the temperature range specified, ensuring the specimen is not permanently indented by the TMA probe. The method is designed to provide reliable, reproducible CTE data to support quality assessment and manufacturing consistency in electronics and related sectors.
Key Topics
- CTE Measurement in X and Y Directions: Focuses on assessing thermal expansion along both principal axes of the material, crucial for multilayer and composite structures common in PCBs.
- Thermomechanical Analysis (TMA): Utilizes TMA as the preferred instrumentation for precise dimensional change monitoring in response to thermal cycling.
- Specimen Preparation: Details requirements regarding thickness, size, and orientation (warp and weft), and stresses on conditioning and surface cleaning prior to analysis.
- Test Conditions and Repeatability: Emphasizes controllable parameters such as temperature range, heating rate, sample orientation, and environmental conditioning, all of which affect repeatability and accuracy.
- Reporting Requirements: Specifies the documentation of all relevant testing conditions, results for both X and Y axes, deviations, and operator identification to ensure traceability of results.
Applications
SIST EN IEC 61189-2-809:2025 is valuable for:
- Material Qualification: Verifying that electrical insulating materials meet thermal expansion requirements for specific applications.
- PCB Manufacturing: Assessing the dimensional stability of base materials used in multilayer printed circuit boards, driving better product reliability.
- Quality Assurance: Providing a standardized means of comparing CTE data across suppliers and manufacturing batches.
- Research & Development: Supporting the optimization of materials for high-reliability electronics by enabling data-driven design improvements.
- Failure Analysis: Aiding in understanding the root causes of mechanical failures related to thermal stress and expansion mismatches in assemblies.
This standard serves industries manufacturing electronic components, assemblies, and interconnection structures requiring rigorous performance under thermal cycling, such as telecommunications, automotive electronics, aerospace, and industrial automation.
Related Standards
For more comprehensive understanding and compatibility across processes, the following standards are closely associated with SIST EN IEC 61189-2-809:2025:
- IEC 60194-1: Terminology and vocabulary for printed board and electronic assembly technologies.
- IEC 60194-2: Further vocabulary in electronic technologies and PCB assembly.
- ASTM E831: Standard test method for linear thermal expansion of solid materials by thermomechanical analysis.
- IPC-TM-650 Method 2.4.41: CTE measurement method for electrical insulating materials in electronics.
These references ensure alignment in terminology, methodology, and reporting, establishing a coherent framework for testing and documentation of materials for electrical and electronic assemblies.
Adopting SIST EN IEC 61189-2-809:2025 facilitates consistent, reproducible measurement of material thermal expansion, supporting higher reliability and performance of electronic products in the global market. For stakeholders in the electronics supply chain, using this standard helps manage risks associated with thermal expansion, improves product quality, and streamlines compliance with international best practices.
Frequently Asked Questions
SIST EN IEC 61189-2-809:2025 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA". This standard covers: IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
SIST EN IEC 61189-2-809:2025 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN IEC 61189-2-809:2025 has the following relationships with other standards: It is inter standard links to SIST EN IEC 61249-2-53:2026. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
SIST EN IEC 61189-2-809:2025 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-marec-2025
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-809. del: Preskus X/Y CTE s termomehansko analizo (TMA)
za tanke podložne materiale
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick
Base Materials by TMA
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-809: Prüfung des X/Y-Wärmeausdehnungskoeffizienten (CTE)
für dicke Grundwerkstoffe mittels TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-809: Essai du coefficient de dilatation
thermique (CTE) X/Y pour matériaux de base épais à l'aide d'un analyseur
thermomécanique (TMA)
Ta slovenski standard je istoveten z: EN IEC 61189-2-809:2025
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61189-2-809
NORME EUROPÉENNE
EUROPÄISCHE NORM January 2025
ICS 31.180
English Version
Test methods for electrical materials, circuit boards and other
interconnection structures and assemblies - Part 2-809: X/Y
coefficient of thermal expansion (CTE) test for thick base
materials by TMA
(IEC 61189-2-809:2024)
Méthodes d'essai pour les matériaux électriques, les Prüfverfahren für Elektromaterialien, Leiterplatten und
circuits imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-809: Essai du coefficient de dilatation 809: Prüfung des X/Y-Wärmeausdehnungskoeffizienten
thermique (CTE) X/Y pour matériaux de base épais à l'aide (CTE) für dicke Grundwerkstoffe mittels TMA
d'un analyseur thermomécanique (TMA) (IEC 61189-2-809:2024)
(IEC 61189-2-809:2024)
This European Standard was approved by CENELEC on 2025-01-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2025 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-809:2025 E
European foreword
The text of document 91/1983/FDIS, future edition 1 of IEC 61189-2-809, prepared by TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-809:2025.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2026-01-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2028-01-31
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-809:2024 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2: Common
usage in electronic technologies as well as
printed board and electronic assembly
technologies
IEC 61189-2-809 ®
Edition 1.0 2024-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, circuit boards and other interconnection
structures and assemblies –
Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base
materials by TMA
Méthodes d'essai pour les matériaux électriques, les circuits imprimées et
autres structures d'interconnexion et ensembles –
Partie 2-809: Essai du coefficient de dilatation thermique (CTE) X/Y pour
matériaux de base épais à l'aide d'un analyseur thermomécanique (TMA)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8327-0054-9
– 2 – IEC 61189-2-809:2024-© IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
5 Test apparatus . 6
6 Test procedure . 6
7 Calculations . 7
8 Report . 8
Bibliography . 9
Figure 1 – Diagram of sample direction . 6
Figure 2 – Specimen size versus temperature . 8
IEC 61189-2-809:2024-© IEC 2024 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, CIRCUIT BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-809: X/Y coefficient of thermal expansion (CTE) test
for thick base materials by TMA
FOREWORD
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all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
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preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
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