Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology

EN following parallel vote

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 1: Allgemeine Prüfverfahren und -methodik

Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 1: Méthodes d'essai générales et méthodologie

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

General Information

Status
Published
Publication Date
31-Mar-2003
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-Apr-2003
Due Date
01-Apr-2003
Completion Date
01-Apr-2003

Relations

Effective Date
01-Apr-2003

Overview

SIST EN 61189-1:2001/A1:2003 is a critical European standard developed by CLC that specifies test methods for electrical materials, printed boards, and other interconnection structures and assemblies. Part 1 of this standard defines general test methods and methodology to ensure reliability, quality, and performance consistency in the testing of electrical components used in printed circuit boards (PCBs) and related assemblies. This standard aligns with the IEC 61189-1:1997/A1:2001 international framework and has been approved by CENELEC, guaranteeing harmonization across European member countries.

This amendment A1 (published in 2001) updates and refines test procedures, including accelerated ageing and conditioning techniques, improving accuracy and efficiency in test execution. It supports manufacturers, testers, and quality engineers by providing clear, standardized testing processes for durability and solderability evaluation of electrical materials.

Key Topics

  • General Testing Methodology
    The standard outlines protocols to prepare, condition, and test electrical materials and interconnection assemblies, ensuring uniformity across testing labs.

  • Accelerated Ageing Tests
    Two primary accelerated ageing test methods are detailed for assessing printed boards’ solderability after environmental stress:

    • Test 1P03 (Method A): Steam/oxygen atmosphere conditioning simulating 10-day damp heat exposure, useful for quick ageing analysis.
    • Test 1P04 (Method B): Steam atmosphere conditioning with an 8-hour exposure suitable particularly for tin or tin-lead surface finishes.
  • Test Apparatus and Procedures
    Descriptions include the use of steam generators, rotating specimen holders, nitrogen purge, and condensing units. The methods emphasize controlling atmosphere composition, temperature, and exposure time to replicate real-world ageing effects.

  • Specimen Preparation and Conditioning
    Specimens are prepared depending on surface protection type - including degreasing, acid immersion, or no cleaning for organic coatings - which directly impact test accuracy.

  • Solderability Assessment
    Post-conditioning solderability tests determine the impact of ageing on material solderability, a critical factor for manufacturing reliability.

  • Documentation and Reporting
    Standard mandates detailed test reporting including test method reference, specimen identification, deviations, results, and personnel responsible, ensuring traceability and compliance.

Applications

  • Printed Circuit Board Manufacturing
    SIST EN 61189-1:2001/A1:2003 is essential for PCB fabricators who must validate the thermal and environmental resilience of their boards before assembly.

  • Quality Control in Electronics Assembly
    Electronic manufacturers use these test methods to verify the solderability and long-term reliability of components and interconnected assemblies under damp heat and accelerated ageing conditions.

  • Materials Development and Testing
    Developers of electrical materials harness these standardized tests to evaluate new substrate materials, protective coatings, and surface finishes with respect to durability and solderability.

  • Compliance and Certification
    Conformance to this standard supports regulatory requirements and quality assurance frameworks in the electronics industry, particularly in Europe.

Related Standards

  • IEC 60068-2-3:1969 – Environmental testing procedures covering steady state damp heat conditions (Test Ca), referenced for accelerated ageing comparisons.
  • IEC 60068-2-30:1980 – Environmental testing detailing cyclic damp heat testing (Test Db), providing guidance for ageing procedure validation.
  • IEC 60326-2:1990 – Previous test protocol for printed board ageing, from which parts of EN 61189-1 test methods were derived.
  • Other parts of IEC 61189 series covering specific material or assembly test details beyond the general methods outlined here.

Keywords: EN 61189-1, electrical materials testing, printed board test methods, interconnection assembly testing, accelerated ageing, solderability testing, IEC 61189-1 amendment, CLC standards, damp heat conditioning, printed circuit board reliability, electronic component assembly testing.

Amendment

SIST EN 61189-1:2001/A1:2003

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Frequently Asked Questions

SIST EN 61189-1:2001/A1:2003 is a amendment published by the Slovenian Institute for Standardization (SIST). Its full title is "Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology". This standard covers: EN following parallel vote

EN following parallel vote

SIST EN 61189-1:2001/A1:2003 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards; 31.190 - Electronic component assemblies. The ICS classification helps identify the subject area and facilitates finding related standards.

SIST EN 61189-1:2001/A1:2003 has the following relationships with other standards: It is inter standard links to SIST EN 61189-1:2001. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

SIST EN 61189-1:2001/A1:2003 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


SLOVENSKI STANDARD
01-april-2003
Test methods for electrical materials, interconnection structures and assemblies -
Part 1: General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies - Part 1: General test methods and methodology
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen - Teil 1: Allgemeine Prüfverfahren und -methodik
Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 1: Méthodes d'essai générales et
méthodologie
Ta slovenski standard je istoveten z: EN 61189-1:1997/A1:2001
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61189-1/A1
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2001
ICS 31.180
English version
Test methods for electrical materials, printed boards and
other interconnection structures and assemblies
Part 1: General test methods and methodology
(IEC 61189-1:1997/A1:2001)
Méthodes d'essais pour les matériaux Prüfverfahren für Elektromaterialien,
électriques, les cartes imprimées et autres Leiterplatten und andere
structures d'interconnexion et ensembles Verbindungsstrukturen und Baugruppen
Partie 1: Méthodes d'essai générales et Teil 1: Allgemeine Prüfverfahren und
méthodologie Methodik
(CEI 61189-1:1997/A1:2001) (IEC 61189-1:1997/A1:2001)
This amendment A1 modifies the European Standard EN 61189-1:1997; it was approved by CENELEC
on 2001-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations
which stipulate the conditions for giving this amendment the status of a national standard without any
alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This amendment exists in three official versions (English, French, German). A version in any other language
made by translation under the responsibility of a CENELEC member into its own language and notified to the
Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,
Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61189-1:1997/A1:2001 E

Foreword
The text of document 52/887/FDIS, future amendment 1 to IEC 61189-1:1997, prepared by
IEC TC 52, Printed circuits, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as amendment A1 to EN 61189-1:1997 on 2001-10-01.
The following dates were fixed:
– latest date by which the amendment has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2002-07-01
– latest date by which the national standards conflicting
with the amendment have to be withdrawn (dow) 2004-10-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of amendment 1:2001 to the International Standard IEC 61189-1:1997 was approved by
CENELEC as an amendment to the European Standard without any modification.
__________
- 3 - EN 61189-1:1997/A1:2001
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
Add:
Publication Year Title EN/HD Year
1)
IEC 60068-2-3 1969 Basic environmental testing procedures HD 323.2.3 S2 1987
Part 2: Tests - Test Ca: Damp heat,
steady state
2)
IEC 60068-2-30 1980 Part 2: Tests - Test Db and guidance: EN 60068-2-30 1999
Damp heat, cyclic (12 + 12 hour cycle)

1)
HD 323.2.3 S2 includes A1:1984 to IEC 60068-2-3.
2)
EN 60068-2-30 includes A1:1985 to IEC 60068-2-30.

NORME
CEI
INTERNATIONALE IEC
61189-1
INTERNATIONAL
STANDARD
AMENDEMENT 1
AMENDMENT 1
2001-08
Amendement 1
Méthodes d'essais pour les matériaux électriques,
les structures d'interconnexion et les ensembles –
Partie 1:
Méthodes d'essai générales et méthodologie
Amendment 1
Test methods for electrical materials,
interconnection structures and assemblies –
Part 1:
General test methods and methodology
© IEC 2001 Droits de reproduction réservés ⎯ Copyright - all rights reserved
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: +41 22 919 0300 e-mail: inmail@iec.ch IEC web site http://www.iec.ch
CODE PRIX
Commission Electrotechnique Internationale
H
PRICE CODE
International Electrotechnical Commission
Pour prix, voir catalogue en vigueur
For price, see current catalogue

61189-1 Amend. 1 © IEC:2001 – 3 –
FOREWORD
This amendment has been prepared by IEC technical committee 52: Printed circuits.
The text of this amendment is based on the following documents:
FDIS Report on voting
52/887/FDIS 52/889/RVD
Full information on the voting for the approval of this amendment can be found in the report on
voting indicated in the above table.
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until 2005. At this date, the publication will be
 reconfirmed;
 withdrawn;
 replaced by a revised edition, or
 amended.
_____________
Page 9
2 Normative references
Add the following new references:
IEC 60068-2-3:1969, Environmental testing – Part 2: Tests – Test Ca: Damp heat, steady state
IEC 60068-2-30:1980, Environmental testing – Part 2: Tests – Test Db and guidance: Damp
heat, cyclic (12 + 12-hour cycle)
Page 19
5 P: Preparation/conditioning test methods
Add, on page 21, after “5.2.6 Additional information”, the following new subclauses:
5.3 Test 1P03: Accelerated ageing, conditioning of printed boards – Method A

61189-1 Amend. 1 © IEC:2001 – 5 –
5.3.1 Object
The object of this procedure is to condition printed boards in a steam/oxygen atmosphere as an
accelerated ageing procedure where a short overall test duration of the procedure is desirable.
The accelerated ageing conditions described in this test method have been demonstrated
to be equivalent to a 10-day damp heat conditioning as detailed in IEC 60068-2-3: Test Ca, or
IEC 60068-2-30: Test Db.
The test is intended to give information about the effect of storage duration on the solderability
of printed boards.
An alternative acceptable conditioning technique is detailed in 5.4 as test method 1P04.
In case of dispute between the two alternative techniques, the referee method shall consist of
exposure to the climatic conditions described in IEC 60068-2-3: Test Ca, or IEC 60068-2-30:
Test Db, for a duration of 10 days.
5.3.2 Test specimen
The test specimen shall be as described in the appropriate sectional specification (SS) or
customer detail specification (CDS) procurement documentation. The physical size of the
conditioning and test apparatus is also a limiting factor.
5.3.3 Test apparatus and materials
The following test apparatus and materials shall be used:
• steam/oxygen ageing test apparatus (see figure 1);
• test c
...

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