SIST EN IEC 61189-2-630:2019
(Main)Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards - Moisture Absorption after pressure vessel conditioning
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards - Moisture Absorption after pressure vessel conditioning
IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-630: Prüfverfahren für Materialien für Verbindungsstrukturen - Feuchteaufnahme nach Druckbehälterbeanspruchung
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-630: Méthodes d'essai des matériaux pour structures d’interconnexion - Absorption d'humidité après conditionnement dans un récipient sous pression
L'IEC 61189-2-630:2018 spécifie une méthode d'essai pour déterminer la quantité d'eau absorbée par les stratifiés plaqués métal après conditionnement dans un récipient sous pression pendant 1 h, 2 h, 3 h, 4 h ou 5 h.
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-630. del: Preskusne metode za osnovne materiale za toga tiskana vezja - Absorpcija vlage po kondicioniranju tlačne posode
Ta dokument določa preskusno metodo za ugotavljanje količine vode, ki jo vpijejo s kovino prevlečeni
laminati po obdelavi v tlačni posodi za 1 h, 2 h, 3 h, 4 h ali 5 h.
General Information
- Status
- Published
- Publication Date
- 18-Mar-2019
- Technical Committee
- ITIV - Electronics assembly technology and Environmental standardization
- Current Stage
- 6060 - National Implementation/Publication (Adopted Project)
- Start Date
- 20-Feb-2019
- Due Date
- 27-Apr-2019
- Completion Date
- 19-Mar-2019
Overview
The SIST EN IEC 61189-2-630:2019 standard defines a precise and reliable test method for measuring moisture absorption in metal-clad laminates used in interconnection structures, specifically after conditioning in a pressure vessel. Published by the European Committee for Electrotechnical Standardization (CLC) and aligned with IEC 61189-2-630:2018, this standard ensures uniformity and repeatability in evaluating electrical materials used in printed circuit boards (PCBs) and other interconnection assemblies.
Moisture absorption is a critical parameter affecting the durability, performance, and reliability of rigid printed boards. By quantifying water uptake after exposure to elevated temperature and pressure conditions, manufacturers and testing laboratories can assess material quality and predict long-term behavior in electronic applications.
Key Topics
- Scope: Measures the percent of water absorbed by metal-clad laminates after 1 to 5 hours of pressure vessel conditioning.
- Test Specimens: Copper-clad laminates cut to standardized sizes (50 mm x 50 mm) and prepared by etching and sanding.
- Test Conditions:
- Drying specimens in circulating air oven at 105 °C to 110 °C.
- Conditioning in a pressure vessel at 103.4 kPa (gauge pressure) over boiling water for predefined durations (1-5 hours).
- Test Apparatus:
- Circulating air oven.
- Pressure vessel (laboratory autoclave) with calibrated pressure gauge.
- Analytical balance with ±0.1 mg resolution.
- Desiccator for cooling and stabilizing specimens.
- Test Procedure:
- Cleaning and drying specimens.
- Pre-conditioning weight measurement.
- Pressure vessel immersion with careful suspension to avoid contact.
- Conditioning under controlled temperature and pressure.
- Post-conditioning drying and immediate weighing.
- Calculation:
- Moisture absorption percentage calculated by weight difference before and after conditioning.
- Average moisture absorption computed from four test specimens to ensure accuracy.
- Reporting Requirements:
- Detailed documentation including material description, test conditions, recorded data, any surface degradation observed, deviations from the method, and tester information.
Applications
The SIST EN IEC 61189-2-630:2019 standard is essential in fields where high-performance printed circuit boards and interconnection materials are used, including:
- Electronics Manufacturing: Ensuring PCB laminates meet moisture resistance criteria to prevent failure in service.
- Quality Assurance: Establishing baseline moisture absorption values for material batches, facilitating material selection and supplier qualification.
- Reliability Testing: Predicting long-term performance of rigid printed boards under varying environmental stresses.
- Materials Development: Guiding the design and formulation of new laminate materials with enhanced moisture resistance.
- Compliance and Certification: Supporting compliance with industry and regulatory standards requiring moisture absorption testing aligned with international norms.
Related Standards
This standard aligns closely with and complements the following:
- IEC 60194: Defines terms and definitions relevant to printed board design, manufacture, and assembly, supporting accurate interpretation of test results.
- IEC 61189 Series: A collection of test methods for electrical materials and interconnection assemblies, addressing diverse aspects such as thermal resistance, electrical performance, and mechanical durability.
- ISO/IEC Directives: Provides guidance on the preparation and maintenance of international standards to ensure consistency and clarity.
By strictly adhering to SIST EN IEC 61189-2-630:2019, manufacturers and testing entities can achieve consistent, repeatable evaluation of moisture absorption in metal-clad laminates, a vital factor impacting the reliability and longevity of electronic interconnection structures. This standard supports the electronics industry's drive for quality, safety, and innovation in printed circuit board materials.
Frequently Asked Questions
SIST EN IEC 61189-2-630:2019 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards - Moisture Absorption after pressure vessel conditioning". This standard covers: IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.
IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4 h or 5 h.
SIST EN IEC 61189-2-630:2019 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards; 31.190 - Electronic component assemblies. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN IEC 61189-2-630:2019 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 61189-2-630:2019
01-april-2019
3UHVNXVQHPHWRGH]DHOHNWULþQHPDWHULDOHWLVNDQDYH]MDLQGUXJHSRYH]RYDOQH
VWUXNWXUHLQVHVWDYHGHO 3UHVNXVQHPHWRGH]DRVQRYQHPDWHULDOH]DWRJD
WLVNDQDYH]MD$EVRUSFLMDYODJHSRNRQGLFLRQLUDQMXWODþQHSRVRGH
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-630: Test methods for base materials for rigid printed boards -
Moisture Absorption after pressure vessel conditioning
Ta slovenski standard je istoveten z: EN IEC 61189-2-630:2018
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-2-630:2019 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
SIST EN 61189-2-630:2019
SIST EN 61189-2-630:2019
EUROPEAN STANDARD EN IEC 61189-2-630
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2018
ICS 31.180
English Version
Test methods for electrical materials, printed board and other
interconnection structures and assemblies - Part 2-630: Test
methods for materials for interconnection structures - Moisture
absorption after pressure vessel conditioning
(IEC 61189-2-630:2018)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-630: Méthodes d'essai des matériaux 630: Prüfverfahren für Materialien für
pour structures d'interconnexion - Absorption d'humidité Verbindungsstrukturen - Feuchteaufnahme nach
après conditionnement dans un récipient sous pression Druckbehälterbeanspruchung
(IEC 61189-2-630:2018) (IEC 61189-2-630:2018)
This European Standard was approved by CENELEC on 2018-07-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-630:2018 E
SIST EN 61189-2-630:2019
European foreword
The text of document 91/1471/CDV, future edition 1 of IEC 61189-2-630, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-630:2018.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2019-04-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2021-07-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61189-2-630:2018 was approved by CENELEC as a
European Standard without any modification.
SIST EN 61189-2-630:2019
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194 - Printed board design, manufacture and - -
assembly - Terms and definitions
SIST EN 61189-2-630:2019
SIST EN 61189-2-630:2019
IEC 61189-2-630 ®
Edition 1.0 2018-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed board and other interconnection
structures and assemblies –
Part 2-630: Test methods for materials for interconnection structures – Moisture
absorption after pressure vessel conditioning
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-630: Méthodes d'essai des matériaux pour structures d’interconnexion –
Absorption d'humidité après conditionnement dans un récipient sous pression
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-5741-8
SIST EN 61189-2-630:2019
– 2 – IEC 61189-2-630:2018 © IEC 2018
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Preparation of test specimens . 5
5 Test specimens . 5
6 Test apparatus . 6
7 Test procedure . 6
8 Calculation . 7
9 Report . 7
SIST EN 61189-2-630:2019
IEC 61189-2-630:2018 © IEC 2018 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-630: Test methods for materials for interconnection structures –
Moisture absorption after pressure vessel conditioning
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all
...
SLOVENSKI STANDARD
01-april-2019
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-630. del: Preskusne metode za osnovne materiale za toga
tiskana vezja - Absorpcija vlage po kondicioniranju tlačne posode
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-630: Test methods for base materials for rigid printed boards -
Moisture Absorption after pressure vessel conditioning
Ta slovenski standard je istoveten z: EN IEC 61189-2-630:2018
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61189-2-630
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2018
ICS 31.180
English Version
Test methods for electrical materials, printed board and other
interconnection structures and assemblies - Part 2-630: Test
methods for materials for interconnection structures - Moisture
absorption after pressure vessel conditioning
(IEC 61189-2-630:2018)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-630: Méthodes d'essai des matériaux 630: Prüfverfahren für Materialien für
pour structures d'interconnexion - Absorption d'humidité Verbindungsstrukturen - Feuchteaufnahme nach
après conditionnement dans un récipient sous pression Druckbehälterbeanspruchung
(IEC 61189-2-630:2018) (IEC 61189-2-630:2018)
This European Standard was approved by CENELEC on 2018-07-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-630:2018 E
European foreword
The text of document 91/1471/CDV, future edition 1 of IEC 61189-2-630, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-630:2018.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2019-04-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2021-07-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61189-2-630:2018 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194 - Printed board design, manufacture and - -
assembly - Terms and definitions
IEC 61189-2-630 ®
Edition 1.0 2018-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed board and other interconnection
structures and assemblies –
Part 2-630: Test methods for materials for interconnection structures – Moisture
absorption after pressure vessel conditioning
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-630: Méthodes d'essai des matériaux pour structures d’interconnexion –
Absorption d'humidité après conditionnement dans un récipient sous pression
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-5741-8
– 2 – IEC 61189-2-630:2018 © IEC 2018
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Preparation of test specimens . 5
5 Test specimens . 5
6 Test apparatus . 6
7 Test procedure . 6
8 Calculation . 7
9 Report . 7
IEC 61189-2-630:2018 © IEC 2018 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-630: Test methods for materials for interconnection structures –
Moisture absorption after pressure vessel conditioning
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operati
...
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