SIST EN 61076-4-114:2004

STANDARDKonektorji za elektronsko opremo - 4-114. del: Konektorji za tiskane plošče - Podrobna specifikacija za dvodelne konektorje z integrirano zaslonsko funkcijo in rastrom 1 mm x 1,5 mm (IEC 61076-4-114:2003)Connectors for electronic equipment - Part 4-114: Printed board connectors - Detail specification for two-part connectors with integrated shielding function having a grid of 1 mm x 1,5 mm (IEC 61076-4-114:2003)©
Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljenoReferenčna številkaSIST EN 61076-4-114:2004(en)ICS31.220.10

EUROPEAN STANDARD
EN 61076-4-114 NORME EUROPÉENNE EUROPÄISCHE NORM
May 2003 CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61076-4-114:2003 E
ICS 31.220.10
English version
Connectors for electronic equipment Part 4-114: Printed board connectors -
Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1,5 mm (IEC 61076-4-114:2003)
Connecteurs pour équipements électroniques Partie 4-114: Connecteurs pour cartes imprimées -
Spécification particulière pour connecteurs en deux parties avec fonction de blindage intégré ayant un pas de 1 mm x 1,5 mm (CEI 61076-4-114:2003)
Steckverbinder für elektronische Einrichtungen Teil 4-114: Steckverbinder für gedruckte Schaltungen -
Bauartspezifikation für indirekte Steckverbinder mit integrierter Schirmung im Raster 1 mm x 1,5 mm (IEC 61076-4-114:2003)
This European Standard was approved by CENELEC on 2003-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2004-02-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2006-05-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annexes A and ZA are normative. Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 61076-4-114:2003 was approved by CENELEC as a European Standard without any modification. __________

- 3 - EN 61076-4-114:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references the latest edition of the publication referred to applies (including amendments). NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60068-1 + corr. October 1988 1988 Environmental testing Part 1: General and guidance
+ A1 1992
EN 60068-1 1994 IEC 60352-5 2001 Solderless connections Part 5: Press-in connections - General requirements, test methods and practical guidance
EN 60352-5 2001 IEC 60512 Series Connectors for electronic equipment - Tests and measurements
EN 60512 Series IEC 60512-1-100 2001 Connectors for electronic equipment - Tests and measurements Part 1-100: General - Applicable publications
EN 60512-1-100 2001 IEC 60664-1 1992 Insulation coordination for equipment within low-voltage systems Part 1: Principles, requirements and tests EN 60664-1 2003 + A2 2002
EN 60664-1 2003 IEC 60917 Series Modular order for the development of mechanical structures for electronic equipment practices
EN 60917 Series IEC 60917-1 1998 Modular order for the development of mechanical structures for electronic equipment practices Part 1: Generic standard
EN 60917-1 1998 IEC 60917-2-2 1994 Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice
Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
EN 60917-2-2 1996
EN 61076-1 1995 IEC 61076-4 1995 Part 4: Sectional specification - Printed board connectors
EN 61076-4 1996 ISO 1302 2002 Geometrical Product Specifications (GPS) - Indication of surface texture in technical product documentation
EN ISO 1302 2002
INTERNATIONALSTANDARDIEC61076-4-114First edition2003-02Connectors for electronic equipment –Part 4-114:Printed board connectors –Detail specification for two-part connectorwith integrated shielding function havinga grid of 1 mm ×××× 1,5 mm IEC 2003

Copyright - all rights reservedNo part of this publication may be reproduced or utilized in any form or by any means, electronic ormechanical, including photocopying and microfilm, without permission in writing from the publisher.International Electrotechnical Commission,
3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11
Telefax: +41 22 919 03 00
E-mail: inmail@iec.ch
Web: www.iec.chXFor price, see current cataloguePRICE CODECommission Electrotechnique InternationaleInternational Electrotechnical Commission

– 2 –61076-4-114  IEC:2003(E)CONTENTSFOREWORD.41General data.61.1Recommended method of mounting.61.2Ratings and characteristics.61.3Normative references.71.4Marking.71.5IEC Type designation.81.6Ordering information.82Technical information.92.1Abbreviations.92.2Survey of styles and variants.92.3Information on application.102.4Contact arrangements.113Dimensional information.123.1General.123.2Isometric view and common features.133.3Engagement (mating) information.173.4Fixed board connectors.193.5Free board connectors.223.6Accessories.253.7Mounting information for fixed board connectors.253.8Mounting information for free board connectors.263.9Gauges.274Characteristics.284.1Climatic category.284.2Electrical.284.3Mechanical.305Test schedule.315.1General.315.2Arrangement for dynamic stress tests.325.3Test schedule tables.35Annex A (normative)
Requirements for application to mechanical structures.42A.1Scope.42A.2Requirements for use of connectors.42Figure 1 – Free and fixed board connectors for modular arrangement.10Figure 2 – Contact arrangements.11Figure 3 – Contact arrangements.12Figure 4 – Isometric view.13Figure 5 – Height dimensions.14Figure 6 – Width dimensions.15Figure 7 – Depth dimensions.16Figure 8 – Mating conditions.17Figure 8a – First contact point.18

61076-4-114  IEC:2003(E)– 3 –Figure 9 – Style A.19Figure 10 – Style B.20Figure 11 – Terminations.21Figure 12 – Style A.22Figure 13 – Details X, Y, Z.23Figure 14 – Style B.24Figure 15 – Hole pattern on backplane.25Figure 16 – Hole pattern on printed boards.26Figure 17 – Gauge dimensions.27Figure 18 – Current carrying capacity.29Figure 19 – Measuring points.29Figure 20 – Arrangement for dynamic stress tests.32Figure 21 – Wiring of specimen.32Figure 22 – Arrangement for flammability test.33Figure 23 – Test board for fixed and free board connectors.34Figure A.1 – Plug-in unit dimension.43Table 1 – Rated voltage.6Table 2 – Contact arrangement and number of contacts.9Table 3 – Styles of termination.9Table 4 – Complete connectors.11Table 5 – Isometric view and common features.14Table 6 – Height dimensions.14Table 7 – Width dimensions.15Table 8 – Depth dimensions.16Table 9 – Ranges of safe contact performance.17Table 10 – Dimensions of terminations and printed board thickness.21Table 11 – Hole pattern on backplane.26Table 12 – Hole pattern on printed boards.26Table 13 – Gauges.27Table 14 – Climatic Category.28Table 15 – Minimum creepage and clearance distances.28Table 16 – Voltage proof.28Table 17 – Number of mechanical operations.30Table 18 – Insertion and withdrawal forces.30Table 19 –Vibration severity.30Table 20 – Number of specimens.31Table 21 – Dynamic stress tests.32Table 22 – Test board for fixed and free board connectors.34Table A.1 – Dimensions required in accordance with IEC 60917-2-2.42

– 4 –61076-4-114  IEC:2003(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION____________CONNECTORS FOR ELECTRONIC EQUIPMENT –Part 4-114: Printed board connectors – Detail specification for two-part connector with integratedshielding function having a grid of 1 mm ×××× 1,5 mmFOREWORD1)The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprisingall national electrotechnical committees (IEC National Committees). The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields. Tothis end and in addition to other activities, the IEC publishes International Standards. Their preparation isentrusted to technical committees; any IEC National Committee interested in the subject dealt with mayparticipate in this preparatory work. International, governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation. The IEC collaborates closely with the InternationalOrganization for Standardization (ISO) in accordance with conditions determined by agreement between thetwo organizations.2)The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, aninternational consensus of opinion on the relevant subjects since each technical committee has representationfrom all interested National Committees.3)The documents produced have the form of recommendations for international use and are published in the formof standards, technical specifications, technical reports or guides and they are accepted by the NationalCommittees in that sense.4)In order to promote international unification, IEC National Committees undertake to apply IEC InternationalStandards transparently to the maximum extent possible in their national and regional standards. Anydivergence between the IEC Standard and the corresponding national or regional standard shall be clearlyindicated in the latter.5)The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for anyequipment declared to be in conformity with one of its standards.6)
Attention is drawn to the possibility that some of the elements of this International Standard may be the subjectof patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.International Standard IEC 61076-4-114 has been prepared by subcommittee 48B: Con-nectors, of IEC Technical Committee 48: Electromechanical components and mechanicalstructures for electronic equipment.The text of this standard is based on the following documents:FDISReport on voting48B/1287/FDIS48B/1307/RVDFull information on the voting for the approval of this standard can be found in the report onvoting indicated in the above table.This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.Future standards in this series will carry the new general title as cited above. Titles of existingstandards in this series will be updated when new editions will be published.The committee has decided that the contents of this publication will remain unchanged until 2005.At this date, the publication will be•reconfirmed;•withdrawn;•replaced by a revised edition, or•amended.

61076-4-114  IEC:2003(E)– 5 –CONNECTORS FOR ELECTRONIC EQUIPMENT –Part 4-114: Printed board connectors – Detail specification for two-part connector with integratedshielding function having a grid of 1 mm ×××× 1,5 mmDraft IEC 61076-4-114IEC SC 48B: LF ConnectorsSpecification available from:IEC Central Office or from the addresses shown on theinside cover.ELECTRONIC COMPONENTS OF ASSESSED QUALITYIN ACCORDANCE WITH:-GENERIC SPECIFICATION IEC 61076-1:1995Blank detail specificationnumber 61076-4-001Two-part connector for printed boards and backplanes,grid of 1 mm × 1,5 mm in accordance withIEC 60917-1.See Clause 3 for dimensions.Information on the availability of components qualified to this detail specification is given in the qualified product list.IEC
658/03
– 6 –61076-4-114  IEC:2003(E)1 General dataThis detailed specification contains modular two-part connectors with integrated shieldedfunction having a grid of 1 mm × 1,5 mm in accordance with IEC 60917-1.1.1 Recommended method of mountingThe free board connectors are provided with contacts for surface mounting technique.Guiding pivots support positioning of the free board connector. The terminations of the freeboard connectors shall fit on solder pads on printed boards having a grid of 1 mm × 4 mm.The fixed board connectors are provided with contacts, either with press-in or surface mountterminations.The connector is fixed by the press-in terminations or by surface mounted terminations.Provided holes in the printed board (diameter 1,4 mm and 1,8 mm) are used for correctpositioning and polarisation and are not necessary for secure connector mounting.1.2 Ratings and characteristicsRated voltage: Contact/contact for fully loaded connectorTable 1 – Rated voltageMaterial groupPollution degreeRated voltageVI, II, IIIa/b1200II, IIIa/b220NOTE
Reference is made to Table 15: Minimum creepage andclearance distances, of this specification, and Table 4 of IEC 60664-1listing the relation between creepage distances, pollution degree andmaterial groups versus voltages r.m.s.Current rating:1 A at 50 °C for fully loaded connectorInsulation resistance:104 MΩ min.Climatic category:PL1: 55/125/56PL2: 55/125/21Printed board thickness:see Table 10Contact spacing:1 mm × 1,5 mm

61076-4-114  IEC:2003(E)– 7 –1.3 Normative referencesThe following referenced documents are indispensable for the application of this document.For dated references, only the edition cited applies. For undated references, the latest editionof the referenced document (including any amendments) applies.IEC 60068-1:1988, Environmental testing – Part 1: General and guidanceAmendment 1 (1992)IEC 60352-5:2001, Solderless connections – Part 5: Solderless press-in connections –General requirements, test methods and practical guidanceIEC 60512 (all parts), Connectors for electronic equipment – Tests and measurementsIEC 60512-1-100:2001, Connectors for electronic equipment – Tests and measurements –Part 1-100: General – Applicable publicationsIEC 60664-1:2002, Insulation coordination for equipment within low-voltage systems – Part 1:Principles, requirements and testsIEC 60917 (all parts), Modular order for the development of mechanical structures forelectronic equipment practicesIEC 60917-1:1998, Modular order for the development of mechanical structures for electronicequipment practices – Part 1: Generic standardIEC 60917-2-2:1994, Modular order for the development of mechanical structures forelectronic equipment practices – Part 2: Sectional specification – Interface co-ordinationdimensions for the 25 mm equipment practice – Section 2: Detail specification – Dimensionsfor subracks, chassis, backplanes, front panels and plug-in unitsIEC 61076-1:1995, Connectors with assessed quality, for use in d.c., low frequency analogueand in digital high speed data applications – Part 1: Generic specificationIEC 61076-4:1995, Connectors with assessed quality, for use in d.c., low-frequency analogueand in digital high-speed data applications – Part 4: Sectional specification – Printed boardconnectorsISO 1302:2002, Geometrical product specifications (GPS) – Indication of surface texture intechnical product documentation1.4 MarkingMarking of the connector and the package shall be in accordance with 2.6 of IEC 61076-4.

– 8 –61076-4-114  IEC:2003(E)1.5 IEC Type designationConnectors, connector bodies and contacts according to this standard shall be designated bythe following system:press-inPLetter denoting the basic type oftermination according to Table 3surface mountM1.6 Ordering informationFor ordering connectors according to this detail specification the type designation describedin 1.5 shall be used.---IEC 61076-4-114LNNNLLNNNumber denoting theperformance levelPerformance level PL1Performance level PL212Number denoting the contact finishGold alloyPalladium alloy with gold flash12NOTE “L” stands for letter“N” stands for numberEXAMPLE
Connector style B, having 80 male contacts with press-in terminations, with goldalloy contact finish and with performance level 2:
IEC 61076 – 4 – 114 – B 080 MP – 1 – 2Letter denoting thetype of contactMaleFemaleMFAccording to Table 2040080160Number of contacts or contact cavitiesLetter denoting the style accordingto Table 2ABCDReference to thisdetail specification

61076-4-114  IEC:2003(E)– 9 –2 Technical information2.1 AbbreviationsSMT:Surface Mount TechnologyFMLB contact:First Make Last Break contact2.2 Survey of styles and variantsFully loaded 2-row connectors and 4-row connectors are each available in two length (from 40to 160 mated lines), for details see Table 2.Table 2 – Contact arrangement and number of contactsStyleABCDHeight of styles
mm27472747Number of row2244Number of contacts408080160Table 3 – Styles of terminationIdentificationletter for styleof terminationConnectorstyleFree board connectorFixed board connectorMA, BTermination for surface mountingto a printed and solder pads,according to 3.8MC, DTermination for surface mounting toa printed board with a thickness of1,6 mm to 2,4 mm and solder pads,according to 3.8Termination for surface mountingon a fixed and solder pads,according to 3.7Pall stylesTermination for press-in with solid pin onfixed board connector to a printed boardwith a thickness of 1,6 mm min. andplated through holes diameter.0,6 mm according to IEC 60352-5

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