SIST EN IEC 62769-103-1:2020

SLOVENSKI STANDARD
SIST EN IEC 62769-103-1:2020
01-oktober-2020
Nadomešča:
SIST EN 62769-103-1:2015
Vključitev procesne naprave (FDI) - 103-1. del: Profili - PROFIBUS (IEC 62769-103-
1:2020)
Field Device Integration (FDI) - Part 103-1: Profiles - PROFIBUS (IEC 62769-103-
1:2020)
Feldgeräteintegration (FDI) Teil 103-1: Profile - PROFIBUS (IEC 62769-103-1:2020)
Intégration des appareils de terrain (FDI) - Partie 103-1: Profils - PROFIBUS (IEC 62769-
103-1:2020)
Ta slovenski standard je istoveten z: EN IEC 62769-103-1:2020
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
SIST EN IEC 62769-103-1:2020 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 62769-103-1:2020

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SIST EN IEC 62769-103-1:2020


EUROPEAN STANDARD EN IEC 62769-103-1

NORME EUROPÉENNE

EUROPÄISCHE NORM
June 2020
ICS 25.040.40; 35.100.05 Supersedes EN 62769-103-1:2015 and all of its
amendments and corrigenda (if any)
English Version
Field device integration (FDI) - Part 103-1: Profiles - PROFIBUS
(IEC 62769-103-1:2020)
Intégration des appareils de terrain (FDI) - Partie 103-1: Feldgeräteintegration (FDI) Teil 103-1: Profile - PROFIBUS
Profils - PROFIBUS (IEC 62769-103-1:2020)
(IEC 62769-103-1:2020)
This European Standard was approved by CENELEC on 2020-06-02. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 62769-103-1:2020 E

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SIST EN IEC 62769-103-1:2020
EN IEC 62769-103-1:2020 (E)
European foreword
The text of document 65E/622/CDV, future edition 2 of IEC 62769-103-1, prepared by SC 65E
"Devices and integration in enterprise systems" of IEC/TC 65 "Industrial-process measurement,
control and automation" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62769-103-1:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-03-02
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-06-02
document have to be withdrawn

This document supersedes EN 62769-103-1:2015 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 62769-103-1:2020 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61784-1 NOTE Harmonized as EN IEC 61784-1


2

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SIST EN IEC 62769-103-1:2020
EN IEC 62769-103-1:2020 (E)
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61804 series Function blocks (FB) for process control EN IEC 61804 series
and electronic device description
language (EDDL)
IEC 62541-100 2015 OPC Unified Architecture - Part 100: EN 62541-100 2015
Device Interface
1
IEC 62769-2 - Field Device Integration (FDI) - Part 2: - -
FDI Client
2
IEC 62769-4 - Field Device Integration (FDI) - Part 4: - -
FDI Packages
3
IEC 62769-5 - Field Device Integration (FDI) - Part 5: - -
FDI Information Model
4
IEC 62769-7 - Field Device Integration (FDI) - Part 7: - -
FDI Communication Devices
PI Order No. 2008 Specification for PROFIBUS - Device - -
2.122 Description and Device Integration -
Volume 1: GSD, V5.1, July 2008: GSD



1
Under preparation. Stage at the time of publication: IEC/RFDIS 62769-2:2020.
2
Under preparation. Stage at the time of publication: IEC/RFDIS 62769-4:2020.
3
Under preparation. Stage at the time of publication: IEC/RFDIS 62769-5:2020.
4
Under preparation. Stage at the time of publication: IEC/RFDIS 62769-7:2020.
3

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SIST EN IEC 62769-103-1:2020

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SIST EN IEC 62769-103-1:2020




IEC 62769-103-1

®


Edition 2.0 2020-04




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Field device integration (FDI) –

Part 103-1: Profiles – PROFIBUS




Intégration des appareils de terrain (FDI) –

Partie 103-1: Profils – PROFIBUS
















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 25.040.40; 35.100.05 ISBN 978-2-8322-8114-7




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN IEC 62769-103-1:2020
– 2 – IEC 62769-103-1:2020 © IEC 2020
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions, abbreviated terms and conventions . 6
3.1 Terms and definitions . 6
3.2 Abbreviated terms and acronyms . 7
3.3 Conventions . 7
3.3.1 EDDL syntax. 7
3.3.2 XML syntax . 7
3.3.3 Capitalizations . 7
4 Profile for PROFIBUS . 8
4.1 General . 8
4.2 Catalog profile . 8
4.2.1 Protocol support file . 8
4.2.2 CommunicationProfile definition . 8
4.2.3 Profile device . 9
4.2.4 Protocol version information . 9
4.3 Associating a Package with a device . 10
4.3.1 Device type identification mapping . 10
4.3.2 Device type revision mapping . 11
4.4 Information Model mapping . 12
4.4.1 ProtocolType definition . 12
4.4.2 DeviceType mapping . 13
4.4.3 FunctionalGroup identification definition . 13
4.5 Topology elements . 13
4.5.1 ConnectionPoint definition . 13
4.5.2 Communication Device definition . 15
4.5.3 Communication service provider definition . 16
4.5.4 Network definition . 17
4.6 Methods . 17
4.6.1 Methods for FDI Communication Servers . 17
4.6.2 Methods for Gateways . 20
Annex A (normative) Topology Scan result schema . 26
A.1 General . 26
A.2 Network . 26
A.3 ProfibusNetworkT . 26
A.4 ProfibusConnectionPointT . 26
A.5 ProfibusIdentificationT . 27
A.6 ProfibusAddressT . 28
Annex B (normative) Transfer service parameters . 29
B.1 General . 29
B.2 sendData . 29
B.3 xsreceiveData . 29
B.4 xsTransferSendDataT . 29
B.5 TransferResultDataT . 30
B.6 OperationT . 30

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IEC 62769-103-1:2020 © IEC 2020 – 3 –
Bibliography . 31

Figure 1 – Version mapping problem . 11

Table 1 – ProtocolSupportFile for FDI Device Packages . 8
Table 2 – ProtocolSupportFile for FDI Communication Packages . 8
Table 3 – PROFIBUS CommunicationProfile definition schema . 9
Table 4 – Catalog values for profile devices . 9
Table 5 – Version mapping examples . 9
Table 6 – Device identification information mapping . 11
Table 7 – Protocol type Profibus_DP . 12
Table 8 – Protocol type Profibus_PA . 12
Table 9 – DeviceType property mapping . 13
Table 10 – PROFIBUS Device Types identification attributes . 13
Table 11 – ConnectionPoint type for Profibus_DP . 14
Table 12 – ConnectionPoint type for Profibus_PA . 15
Table 13 – Method Connect arguments . 18
Table 14 – Method Disconnect arguments . 18
Table 15 – Method Transfer arguments . 19
Table 16 – Method SetAddress arguments . 20
Table 17 – Connect service arguments . 21
Table 18 – Method Transfer arguments . 22
Table 19 – Method SetAddress arguments . 24
Table A.1 – Elements of ProfibusNetworkT . 26
Table A.2 – Attributes of ProfibusConnectionPointT . 27
Table A.3 – Elements of ProfibusConnectionPointT . 27
Table A.4 – Attributes of ProfibusIdentificationT . 28
Table B.1 – Attributes of TransferSendDataT . 30
Table B.2 – Attributes of TransferResultDataT . 30

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

FIELD DEVICE INTEGRATION (FDI) –

Part 103-1: Profiles – PROFIBUS

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62769-103-1 has been prepared by subcommittee 65E: Devices
and integration in enterprise systems, of IEC technical committee 65: Industrial-process
measurement, control and automation.
This second edition cancels and replaces the first edition published in 2015. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) support for generic protocol extension for faster adoption of other technologies;
b) support for Package Developers to build EDDs targeted for today’s EDD bases system
under a single development tool.

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SIST EN IEC 62769-103-1:2020
IEC 62769-103-1:2020 © IEC 2020 – 5 –
The text of this International Standard is based on the following documents:
CDV Report on voting
65E/685A/RVC
65E/622/CDV
65E/685/RVC

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62769 series, published under the general title Field Device
Integration (FDI), can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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FIELD DEVICE INTEGRATION (FDI) –

Part 103-1: Profiles – PROFIBUS



1 Scope
This part of IEC 62769 specifies an FDI profile of IEC 62769 for IEC 61784-1_CP 3/1
1
1
(PROFIBUS DP) and IEC 61784-1_CP3/2 (PROFIBUS PA) .
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 61804 (all parts), Function blocks (FB) for process control and Electronic Device
Description Language (EDDL)
IEC 62541-100:2015, OPC Unified Architecture - Part 100: Device Interface
2
IEC 62769-2 , Field Device Integration (FDI) - Part 2: FDI Client
3
IEC 62769-4 , Field Device Integration (FDI) – Part 4: FDI Packages
4
IEC 62769-5 , Field Device Integration (FDI) – Part 5: FDI Information Model
5
IEC 62769-7 , Field Device Integration (FDI) – Part 7: FDI Communication Devices
PI Order No.: 2.122:2008, Specification for PROFIBUS – Device Description and Device
Integration – Volume 1: GSD, V5.1, July 2008: GSD; available at
[viewed 2018-11-23]
3 Terms, definitions, abbreviated terms and conventions
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 61784-1, IEC 61804
(all parts), IEC 62541-100, IEC 62769-4, IEC 62769-5, IEC 62769-7 and PI Order No.:
2.122:2008 apply.
___________
1
 PROFIBUS is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This
information is given for the convenience of users of this document and does not constitute an endorsement by
IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of
the trade name requires permission of the trade name holder.
2
 Under preparation. Stage at the time of publication: IEC/RFDIS 62769-2:2020.
3
 Under preparation. Stage at the time of publication: IEC/RFDIS 62769-4:2020.
4
 Under preparation. Stage at the time of publication: IEC/RFDIS 62769-5:2020.
5
 Under preparation. Stage at the time of publication: IEC/RFDIS 62769-7:2020.

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SIST EN IEC 62769-103-1:2020
IEC 62769-103-1:2020 © IEC 2020 – 7 –
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.2 Abbreviated terms and acronyms
For the purposes of this document, the following abbreviations apply:
EDD Electronic Device Description
EDDL Electronic Device Description Language (see IEC 61804)
GSD General station description (see PI Order No.: 2.122:2008)
I&M Identification and maintenance function
UUID Universally unique identifier (see ISO/IEC 11578)
XML Extensible markup language (see REC-xml-20081126)
3.3 Conventions
3.3.1 EDDL syntax
This document specifies content for the EDD component that is part of FDI Communication
Packages. The specification content using EDDL syntax uses the font Courier New. The
EDDL syntax is used for method signature, variable, data structure and component
declarations.
3.3.2 XML syntax
XML syntax examples use font Courier New. The XML syntax is used to describe XML
document schema.
Example:
3.3.3 Capitalizations
IEC 62769 (all parts) use capitalized terms to emphasize that these terms have a FDI specific
meaning.
Some of these terms using an acronym as a prefix, for example:
• FDI Client, or
• FDI Server.
Some of these terms are compound terms such as:
• Communication Servers, or
• Profile Package.
Parameter names or attributes are concatenated to a single term, where the original terms
start in this term with a capital letter such as:
• ProtocolSupportFile, or
• ProtocolType.
Parameter names or attributes can also be constructed by using an underscore character to
concatenate two or more terms such as:
• PROFILE_ID, or

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• Profibus_PA_Network.
4 Profile for PROFIBUS
4.1 General
This profile document to the FDI specification in IEC 62769 specifies the protocol specifics
needed for FDI Packages describing Communication Servers, Gateways and Devices.
For Communication Servers, this document defines also protocol specifics as these need to
be considered in the Communication Servers hosted Information Model.
4.2 Catalog profile
4.2.1 Protocol support file
4.2.1.1 FDI Device Package
Protocol specific attachments are mentioned in the Package Catalog as defined in
IEC 62769-5. A communication feature list (GSD) file according to PI Order No.: 2.122:2008 is
a mandatory attachment for FDI Device Packages representing PROFIBUS DP and
PROFIBUS PA devices. Table 1 specifies the parameters of the ProtocolSupportFile in the
FDI Device Package.
Table 1 – ProtocolSupportFile for FDI Device Packages
Parameter Description
Content Type text/plain
Root Namespace empty
Source Relationship http://fdi-cooperation.com/2010/relationship/attachment-protocol
Filename According to PI Order No.: 2.122:2008

4.2.1.2 FDI Communication Packages
A GSD file as specified in PI Order No.: 2.122:2008 is an optional attachment for FDI
Communication Packages representing PROFIBUS DP and PROFIBUS PA devices. Table 2
specifies the parameters of ProtocolSupportFile for FDI Communication Packages.
Table 2 – ProtocolSupportFile for FDI Communication Packages
Parameter Description
Content Type: text/plain
Root Namespace: empty
Source Relationship: http://fdi-cooperation.com/2010/relationship/attachment-protocol
Filename: According to PI Order No.: 2.122:2008

4.2.2 CommunicationProfile definition
IEC 62769-4 defines a CommunicationProfileT string for the Catalog XML schema. Table 3
defines the PROFIBUS specific values for this string.

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Table 3 – PROFIBUS CommunicationProfile definition schema
Profile Identifier Protocol
"profibus_dp" PROFIBUS DP/V0; PROFIBUS DP/V1; PROFIBUS DP/V2
“profibus_pa” PROFIBUS PA

4.2.3 Profile device
A Profile Package shall provide the catalog values for profile devices, enabling the FDI Server
to leverage a generic device description, if a specific one is not available. The definitions in
Table 4 focus on catalog content that is vendor independent.
Table 4 – Catalog values for profile devices
Element Attribute Content
PackageType — Profile
Manufacturer — Empty
The allowed profile identifier values (PROFILE_ID) are provided by
DeviceModel —
PROFIBUS & PROFINET International (PI). PI provides and maintains an
XML file (Profile_ID_Table) containing the assignment of PROFILE_ID to
profiles.
It is available at
The file can be downloaded by any engineering or service tool whenever it
is connected to the Internet.
NOTE More information is provided in PI Order No.: 3.502 (I&M Profile)
and related profile definitions are referred therein.
The string format shall be hexadecimal starting with 0x, e.g. ‘0x3D00’.

4.2.4 Protocol version information
IEC 62769-4 defines an element type named InterfaceT for the Catalog XML schema. The
element type InterfaceT contains an element named Version which is supposed to provide
version information about the applied communication protocol profile. The value has to follow
the IEC 62769-4 defined version information schema defined in the element type VersionT.
Table 5 describes how to apply the currently known protocol versions defined by the non-profit
consortium PROFIBUS & PROFINE
...