SIST EN 61014:2004

SLOVENSKI SIST EN 61014:2004
STANDARD
september 2004
Programi za rast zanesljivosti (IEC 61014:2003)
Programmes for reliability growth (IEC 61014:2003)
ICS 03.100.40; 21.020 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 61014
NORME EUROPÉENNE
EUROPÄISCHE NORM September 2003

ICS 03.100.40; 03.120.01; 21.020

English version
Programmes for reliability growth
(IEC 61014:2003)
Programmes de croissance de fiabilité Programme für das
(CEI 61014:2003) Zuverlässigkeitswachstum
(IEC 61014:2003)
This European Standard was approved by CENELEC on 2003-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 61014:2003 E
Foreword
The text of document 56/859/FDIS, future edition 2 of IEC 61014, prepared by IEC TC 56,
Dependability, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as
EN 61014 on 2003-09-01.
The following dates were fixed:

– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-06-01

– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-09-01

Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61014:2003 was approved by CENELEC as a European
Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61703 NOTE Harmonized as EN 61703:2002 (not modified).
ISO 9000 NOTE Harmonized as EN ISO 9000:2000 (not modified).
ISO 9001 NOTE Harmonized as EN ISO 9001:2000 (not modified).
__________
- 3 - EN 61014:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60300-1 Dependability management EN 60300-1
- 2003
Part 1: Dependability management
systems
1) 2)
IEC 60300-2 - Part 2: Dependability programme EN 60300-2 1996
elements and tasks
1)
IEC 60300-3-1 - Part 3-1: Application guide - Analysis - -
techniques for dependability - Guide on
methodology
IEC 60300-3-5 2001 Part 3-5: Application guide - Reliability - -
test conditions and statistical test
principles
1)
IEC 60605-2 - Equipment reliability testing - - -
Part 2: Design of test cycles
IEC 60605-3 Series Equipment reliability testing - - -
Part 3: Preferred test conditions

1)
IEC 60605-4 - Part 4: Statistical procedures for - -
exponential distribution - Point
estimates, confidence intervals,
prediction intervals and tolerance
intervals
1) 2)
IEC 60812 - Analysis techniques for system HD 485 S1 1987
reliability - Procedure for failure mode
and effects analysis (FMEA)
1) 2)
IEC 61025 - Fault tree analysis (FTA) HD 617 S1 1992

1)
IEC 61160 - Formal design review - -

1)
Undated reference.
2)
Valid edition at date of issue.

Publication Year Title EN/HD Year
_ 1)
IEC 61164 Reliability growth - Statistical test and - -
estimation methods
NORME CEI
INTERNATIONALE IEC
INTERNATIONAL
Deuxième édition
STANDARD
Second edition
2003-07
Programmes de croissance de fiabilité
Programmes for reliability growth
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61014  IEC:2003 – 3 –
CONTENTS
FOREWORD . 7
INTRODUCTION .11
1 Scope .13
2 Normative references.13
3 Terms and definitions .15
4 Basic concepts .27
4.1 General .27
4.2 Origins of weaknesses and failures.27
4.2.1 General.27
4.2.2 Systematic weaknesses .29
4.2.3 Residual weaknesses .29
4.3 Basic concepts for reliability growth in product development process;
integrated reliability engineering concept .31
4.4 Basic concepts for reliability growth in the test phase .31
4.5 Planning of the reliability growth and estimation of achieved reliability during
the design phase .35
4.5.1 General.35
4.5.2 Reliability growth in the product development/design phase.35
4.5.3 Reliability growth with the test programmes .37
5 Management aspects.41
5.1 General .41
5.2 Procedures including processes in the design phase .43
5.3 Liaison.43
5.4 Manpower and costs for design phase .47
5.5 Cost benefit .47
6 Planning and execution of reliability growth programmes .49
6.1 Integrated reliability growth concepts and overview .49
6.2 Reliability growth activities in the design phase .51
6.2.1 Activities in concept and product requirements phase .51
6.2.2 Product definition and preliminary design.53
6.2.3 Project design phase .53
6.2.4 Tooling, first production runs (preproduction), production phase .57
6.2.5 Product fielded phase .57
6.3 Reliability growth activities in the validation test phase .57
6.4 Considerations for reliability growth testing.59
6.4.1 General.59
6.4.2 Test planning .59
6.4.3 Special considerations for non-repaired or one-shot (expendable)
items and components .63
6.4.4 Classification of failures.65
6.4.5 Classes of non-relevant failures.65
6.4.6 Classes of relevant failures.67
6.4.7 Categories of relevant failures that occur in test .67
6.4.8 Process of reliability improvement in reliability growth tests .69

61014  IEC:2003 – 5 –
6.4.9 Mathematical modelling of test reliability growth .73
6.4.10 Nature and objectives of modelling .73
6.4.11 Concepts of reliability measures in reliability growth testing as used
in modelling .75
6.4.12 Reporting on reliability growth testing and documentation.81
7 Reliability growth in the field .85
Bibliography.87
Figure 1 – Comparison between growth and repair processes in reliability growth testing .33
Figure 2 – Planned improvement (reduction) of the equivalent failure rate.37
Figure 3 – Planned reliability improvement expressed in terms of probability of survival.37
Figure 4 – Patterns of relevant test or field failures with time .39
Figure 5 – Overall structure of a reliability growth programme.43
Figure 6 – Chart showing liaison links and functions .47
Figure 7 – Integrated reliability engineering process .51
Figure 8 – Process of reliability growth in testing.71
Figure 9 – Characteristic curve showing instantaneous and extrapolated failure intensities .77
Figure 10 – Projected failure intensity estimated by modelling.79
Figure 11 – Examples of growth curves and “jumps” .81

61014  IEC:2003 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROGRAMMES FOR RELIABILITY GROWTH
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to
technical committees; any IEC National Committee interested in the subject dealt with may participate in this
preparatory work. International, governmental and non-governmental organizations liaising with the IEC also
participate in this preparation. IEC collaborates closely with the International Organization for Standardization
(ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61014 has been prepared by IEC technical committee 56:
Dependability.
The text of this standard is based on the following documents:
FDIS Report on voting
56/859/FDIS 56/863/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
This second edition of IEC 61014 cancels and replaces the first edition, published in 1989,
and constitutes a technical revision.

61014  IEC:2003 – 9 –
The main changes with respect to the previous edition are listed below.
• References to dependability management standards have been inserted.
• Terms and definitions related to the reliability growth during the product design have been
added.
• Flow diagrams for reliability growth in 4.4 and 6.4.8 (see Figures 1 and 8) have been
corrected.
• A subclause on planning reliability growth in the design phase has been added (see 4.5).
• A subclause on management aspects covering both reliability growth in design and the
test phase has been added (see Clause 5).
• Clause 6 has been extended to include reliability growth in the design phase with its
analytical and test aspects.
• The figure showing projected failure intensity estimated by modelling (see Figure 10) has
been corrected.
• A clause on reliability growth in the field (see Clause 7) has been added.
The committee has decided that the contents of this publication will remain unchanged until 2011.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
61014  IEC:2003 – 11 –
INTRODUCTION
Reliability improvement by a growth programme should be part of an overall reliability activity
in the development of a product. This is especially true for a design that uses novel or
unproven techniques, components, or a substantial content of software. In such a case the
programme may expose, over a period of time, many types of weaknesses having design-
related causes. It is essential to reduce the probability of failure due to these weaknesses to
the greatest extent possible to prevent their later appearance in formal tests or in the field.
At that late stage, design correction is often highly inconvenient, costly and time-consuming.
Life-cycle costs can be minimized if the necessary design changes are made at the earliest
possible stage.
IEC 60300-3-5, Clause 1 refers to a “reliability growth (or improvement) programme” employ-
ing equipment reliability design analysis and reliability testing, with the principal objective to
realize reliability growth. Reliability design analysis applies analytical methods and techniques
described in IEC 60300-3-1. Reliability design analysis is of a particular value, as it allows
early identification of potential design weakness, well before design completion. This allows
introduction of design modifications that are inexpensive and relatively easy to implement
without consequences such as major design changes, programme delays, modification of
tooling and manufacturing processes. The reliability growth testing and environmental
arrangements for the test part of this programme are essentially the same as those covered
by IEC 60300-3-5, IEC 60605-2 and IEC 60605-3.
The importance of the reliability growth programme, integrated into the design or product
development process, and known as integrated reliability engineering, is driven by limited
time to market, programme costs and striving for product cost reduction.
Although effective for disclosure of potential field problems, a reliability growth testing pro-
gramme alone is typically expensive, requiring extensive test time and resources, and the
corrective actions are considerably more costly than if they were found and corrected in the
early stages of design. Additionally, the duration of these tests, sometimes lasting for a very
long time, would seriously affect the marketing or deployment schedule of the system.
The cost-effective solution to these challenges is a reliability growth programme fully
integrated in both the design and evaluation phase as well as the testing phase. This effort is
enabled by strong project management, by design engineering and often by customer
participation and involvement. Over the past few years, leading industry organizations have
developed and applied analytical and test methods fully integrated with the design efforts for
increasing the reliability during the product design phase. This reduces reliance on formal and
lengthy reliability growth testing. This technology is the basis for the integrated reliability
growth strategy in this standard and will be discussed further in Clause 6. Some definitions
and concepts are given first in order to lay the groundwork for discussing the integrated
reliability growth methodologies.

61014  IEC:2003 – 13 –
PROGRAMMES FOR RELIABILITY GROWTH
1 Scope
This International Standard specifies requirements and gives guidelines for the exposure and
removal of weaknesses in hardware and software items for the purpose of reliability growth.
It applies when the product specification calls for a reliability growth programme of equipment
(electronic, electromechanical and mechanical hardware as well as software) or when it is
known that the design is unlikely to meet the requirements without improvement.
A statement of the basic concepts is followed by descriptions of the management, planning,
testing (laboratory or field), failure analysis and corrective techniques required. Mathematical
modelling, to estimate the level of reliability achieved, is outlined briefly.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60300-1, Dependability management – Part 1: Dependability management systems
IEC 60300-2, Dependability management – Part 2: Guidance for dependability programme
management
IEC 60300-3-1, Dependability management – Part 3-1: Application guide – Analysis tech-
niques for dependability – Guide on methodology
IEC 60300-3-5:2001, Dependability management – Part 3-5: Application guide – Reliability
test conditions and statistical test principles
IEC 60605-2, Equipment reliability testing – Part 2: Design of test cycles
IEC 60605-3 (all parts), Equipment reliability testing – Part 3: Preferred test conditions
IEC 60605-4, Equipment reliability testing – Part 4: Statistical procedures for exponential
distribution – Point estimates, confidence intervals, prediction intervals and tolerance intervals
IEC 60812, Analysis techniques for system reliability – Procedure for failure mode and effects
analysis (FMEA)
IEC 61025, Fault tree analysis (FTA)
IEC 61160, Formal design review
IEC 61164, Reliability growth – Statistical test and estimation methods
___________
Second edition to be published.
Second edition to be published.

61014  IEC:2003 – 15 –
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
NOTE 1 Certain terms come from IEC 60050(191) and, where this is the case, the concept from that publication is
referenced in square brackets after the definition. ISO 9000:2000 is used as referenced to quality vocabulary.
NOTE 2 For analysis of the reliability growth test data, it is important to distinguish between the terms “failure
intensity” (for repaired items) and “failure rate” or “instantaneous failure rate” (for non-repaired or one-shot items)
defined in IEC 60050(191).
3.1
item
entity
any part, component, device, subsystem, functional unit, equipment or system that can be
individually considered
NOTE An item may consist of hardware, software or both, and may also, in particular cases, include people.
[IEC 60050, 191-01-01]
3.2
reliability improvement
process undertaken with the deliberate intention of improving the reliability performance
by eliminating causes of systematic failures and/or by reducing the probability of occurrence
of other failures
[IEC 60050, 191-17-05]
NOTE 1 The method described in this standard is aimed at making corrective modifications aimed at reducing
systematic weaknesses or reducing their likelihood of occurrence.
NOTE 2 For any item, there are limits to practicable and economic improvement and to achievable growth.
3.3
reliability growth
condition characterized by a progressive improvement of a reliability performance measure
of an item with time
[IEC 60050, 191-17-04]
NOTE Modelling (projection) and analysis of reliability improvement during the design phase is based on the
standard estimation of the expected product reliability within a given time period.
3.4
integrated reliability engineering
engineering tool, consisting of a multitude of reliability/dependability methods integrated into
all engineering stages and activities regarding a product, from the conceptual phase through
its use in the field by a combination of contributions from all relevant stakeholders
3.5
product reliability goal
reliability goal for a product based on certain corporate targets, market requirements or
desired mission success probability that is reasonably achievable according to the past
history and technical evolution
NOTE For some projects, the reliability goal is set by the customer. The product specific goal is the target value
of the reliability growth process.
3.6
systematic weakness
weakness, which can be eliminated, or its effects reduced, only by a modification of the
design or manufacturing process, operational procedures, documentation or other relevant
factors, or by replacement of substandard components by components of proven superior
reliability
NOTE 1 A systematic weakness often results in a failure that is related to a weakness in the design or
a weakness of the manufacturing process or documentation.

61014  IEC:2003 – 17 –
NOTE 2 Repair or replacement (or re-run in case of software) without modification is likely to lead to recurrent
failures of a similar kind.
NOTE 3 Software weaknesses are always systematic.
3.7
residual weakness
weakness, which is not systematic
NOTE 1 In this case, risk of recurrent failure of a similar kind is small or even negligible, within the expected test
time scale.
NOTE 2 Software weaknesses cannot be residual.
3.8
failure
termination of the ability of an item to perform a required function
NOTE 1 After failure the item has a fault.
NOTE 2 “Failure” is an event, as distinguished from “fault”, which is a state.
[IEC 60050,191-04-01]
NOTE 3 The term “termination” implies that the product had the ability to perform a required function and then
lost it. Once the system design is capable of meeting the specified performance requirement, then reliability failure
is the termination of this capability.
3.9
failure mode
manner in which any system or component ceases to perform its respective designed
operation
NOTE 1 A failure mode may be characterized by its frequency of occurrence or by probability of its occurrence to
include into the system’s or component’s reliability.
NOTE 2 To address the reliability of a system, fundamentally its corresponding failure modes, the causes of these
failure modes, and the frequency or probability of occurrence of these modes under the system’s intended use
environment need to be addressed.
3.10
relevant failure
failure that should be included in interpreting test or operational results or in calculating the
value of a reliability performance measure
NOTE 1 The criteria for inclusion should be stated.
[IEC 60050, 191-04-13]
NOTE 2 The criteria for inclusion are stated in 6.4.6.
3.11
non-relevant failure
failure that should be excluded in interpreting test or operational results or in calculating
the value of a reliability performance measure
[IEC 60050, 191-04-14]
NOTE The criteria for classifying failures as not relevant are stated in 6.4.5.
3.12
systematic failure
failure that exhibits, after a physical, circumstantial or design analysis, a condition or pattern
of failure that may be expected to cause recurrence
NOTE 1 Corrective maintenance without modification does not usually eliminate the failure cause.
NOTE 2 A systematic failure can be induced at will by simulating the failure cause.
NOTE 3 In this standard, a systematic failure is interpreted as a failure resulting from a systematic weakness.
3.13
residual failure
failure resulting from a residual weakness

61014  IEC:2003 – 19 –
Categories of failures observed in a reliability growth test programme
3.14
failure category A
systematic failure experienced in test for which management decides not to attempt corrective
modification, due to cost, time, technological constraints or other reasons
3.15
failure category B
systematic failure experienced in test for which management decides to attempt corrective
modification
NOTE Failure categorization is not applicable for reliability growth in the product design phase as the view on
potential failure modes is entirely different. Here, all components could potentially fail in one mode or another, but
the likelihood and consequence of such an event may be very different. Failure modes and their potential causes
that may be highly likely to occur are addressed first, and, if resources and schedules allow, other failure modes,
less likely to occur, are addressed. A product with a high number of components where each of those might have
multiple failure modes, and each of the failure modes might have multiple causes, might require a great amount of
effort to classify and then re-classify each of the failure modes or causes, too cumbersome and costly to justify the
classification. As the failure classification does not add any value, it is not applied during the reliability growth
effort in the product design phase.
3.16
fault
state of an item characterized by inability to perform a required function, excluding the
inability during preventive maintenance or other planned actions, or due to lack of external
resources
NOTE A fault is often the result of a failure of the item itself but may exist without prior failure.
[IEC 60050, 191-05-01]
3.17
fault mode
one of the possible states of a faulty item, for a given required function
[IEC 60050, 191-05-22]
NOTE The use of the term “failure mode” in this sense is allowed for identification of a potential item or
component failure.
3.18
instantaneous reliability measure
reliability measure for an item at a given point (past or present) in a reliability growth
programme
NOTE 1 The reliability measure used in design analysis is the expected product reliability in a predetermined
time, or its equivalent failure intensity calculated from the assessed product reliability associated with a time period
of interest.
NOTE 2 Occasionally, the reliability measure can be expressed in terms of equivalent MTBF or MTTF also
calculated from the assessed product reliability associated with a time period of interest.
NOTE 3 Whenever time is used in this standard, it can be substituted by other counts such as cycles, distance
travelled (miles, kilometres), or copies.
NOTE 4 In this standard, the term failure intensity is used for a reliability measure of a repairable system, but
terms like failure rate, instantaneous failure rate, MTBF, or MTTF can be substituted as appropriate. Further, the
system is assumed repairable unless specifically stated otherwise.
NOTE 5 The reliability measures for a system commonly used in test are the (instantaneous) failure intensity
(IEV 191-12-04) or the mean operating time between failures (MTBF) (IEV 191-12-09) as well as the
(instantaneous) failure rate (IEV 191-12-02) or the mean time to failure (MTTF) (IEV 191-12-07).
NOTE 6 Values of reliability measures are estimated by reliability growth models determined for product
improvement in the design and the test phase separately.

61014  IEC:2003 – 21 –
3.19
extrapolated reliability measure
reliability measure for an item, predicted for a given future point in a reliability growth
test programme, where the corrective modifications are promptly introduced throughout
the programme
NOTE 1 The definition of the modifier “extrapolated” (IEV 191-18-03) applies here but is restricted to time.
NOTE 2 The previous test conditions and corrective modification procedures are assumed to continue unchanged.
NOTE 3 The value of the reliability measure is estimated by a reliability growth model applied to the previous data
and the same trend is assumed to apply also to the future period of the programme.
NOTE 4 The reliability measures commonly used are the (instantaneous) failure intensity (IEV 191-12-04) or the
mean operating time between failures (MTBF) (IEV 191-12-09) as well as the (instantaneous) failure rate
(IEV 191-12-02) or the mean time to failure (MTTF) (IEV 191-12-07).
NOTE 5 Extrapolated reliability measure is not applicable for use in a reliability growth programme during the
design phase.
3.20
projected reliability measure
reliability measure predicted for an item as a consequence of the simultaneous introduction of
a number of corrective modifications
NOTE 1 The modifications are often introduced between two successive phases in the programme.
NOTE 2 The reliability measures commonly used in the formal reliability growth test are the (instantaneous)
failure intensity (IEV 191-12-04) or the mean operating time between failures (MTBF) (IEV 191-12-09) as well as
the (instantaneous) failure rate (IEV 191-12-02) or the mean time to failure (MTTF) (IEV 191-12-07).
NOTE 3 Reliability measure during reliability growth in the design phase is the product reliability projected for the
time period of interest such as warranty period or mission duration.
NOTE 4 The values of these measures are estimated by a reliability growth model.
3.21
usage profile
detailed information on environmental and operational aspects, their levels and content,
duration, and sequence, expected to be encountered in a new product
3.22
field performance report
summary and analysis of the field data pertinent to the product to be designed
3.23
product specification for reliability
description of expected product performance for the specified time period under the expected
usage profile
3.24
reliability and life test
test (environmental or other stress) designed to prove or estimate probability of occurrence of
failure modes or their respective causes when those estimates are difficult to make solely
by analysis
NOTE Operational test (life testing) is carried out on a product to demonstrate reliability.
3.25
reliability growth planning
plan of reliability activities such as analyses, components and materials selection and testing
that would assure increase in product reliability
NOTE The same term can also refer to planning of the magnitude and the quantity of design improvements
necessary to attain the product reliability goal. This planning consists of an analytical representation of the course
of reliability growth in design and gives an estimate of the number and magnitude of design changes
(improvements) necessary to attain the reliability goal.

61014  IEC:2003 – 23 –
3.26
preliminary reliability estimates
estimates made for new product based on inherited design
3.27
preliminary reliability allocation
reliability apportioned to the parts of design where, because of the lack of information,
preliminary estimates cannot be made
3.28
design guidelines
document with design rules that point out known design criteria for reliability enhancement
3.29
continuous design reliability assessment
updating reliability assessment of the new product concurrently with the design evolution and
testing of components and subsystems
3.30
FMEA and failure mode mitigation
identification of critical and/or safety-related failure modes, their causes and effects and
estimation of likelihood of their occurrence regarding product usage profile, and life
NOTE Mitigation addresses causes and effects of failure modes with high severity and probability of occurrence.
A very useful tool in failure mode analysis of a design is found to be fault tree analysis, which is a logical
representation of hardware and associated failure modes.
3.31
key components
those components, which are determined to be essential for the intended product
performance and which are evaluated and selected on the basis of available and satisfactory
reliability and environmental information
3.32
final reliability report
compilation of methods, analyses, tests, results, lessons learned, mitigated consequences of
failure modes, critical components and findings on their reliability, achieved reliability growth
and the final reliability estimate and evaluation of the confidence in the reliability and integrity
of the product
NOTE The report archives the information to be used as a source of information, references, reports, and
a starting point for the next version or similar product.
3.33
reliability assessment of product changes
evaluation of changes of components, design or manufacturing process on product reliability
NOTE The changes may result from corrective actions, cost reductions on products or changes in the production
process.
3.34
continuing reliability testing
reliability testing on ongoing lot of production to verify that the product reliability has not been
compromised by the manufacturing processes or a lot of components of inferior quality
3.35
FRACAS
failure reporting analysis and corrective action system, closed loop system for tracking and
bringing design issues to closure
NOTE As a database, it is a source of information on test and field experienced failure modes on products related
to the new design. The analysis may then address potential of existence of those failure modes in the design being
analysed.
61014  IEC:2003 – 25 –
3.36
system
set of interrelated or interfacing elements
[ISO 9000:2000, definition 3.2.1]
NOTE 1 In the context of dependability, a system should have
a) a defined purpose expressed in terms of required functions; and
b) stated conditions of operation/use (see IEV 191-01-12).
NOTE 2 The structure of a system is hierarchical.
3.37
component
item on the lowest level considered in the analysis
3.38
allocation
procedure applied during the design of an item intended to apportion the requirements for
performance measures for an item to its sub-items according to given criteria
3.39
integrated reliability growth
reliability growth achieved through joint efforts of analysis, testing, design engineering and
other information and activities for identification and mitigation of potential item failure modes
3.40
intermittent failure
failure that may not be reproducible every time the item is tested for it and that appears
sporadically
3.41
recurrent failure
failure that appears repetitively
3.42
action list
list prepared to outline actions necessary to be taken for achievement of reliability growth
3.43
condition or pattern of failure
manner in which some failures occur
3.44
circumstantial analysis
analysis of the circumstances in which some failures occur
3.45
equivalent failure rate
failure rate of a component or an item calculated from its achieved reliability for the
corresponding time period with an assumption of a constant failure rate in the course of
that time period
NOTE The obtained value of the equivalent failure rate is valid for the particular time period only.

61014  IEC:2003 – 27 –
4 Basic concepts
4.1 General
The basic concepts for reliability growth of a product are similar, whether the product weak-
nesses are discovered through design, analysis, or test.
In a programme of reliability growth design analysis, the product design is analysed to
determine whether any of its components and their interactions constitute potential weak-
nesses when subjected to the expected operational and environmental stresses and their
potential extremes. Results of the design analysis may be compared with the product
reliability goals or requirements, and recommendations are made for the necessary
improvements. Here, the design stress and component weakness analysis regarding their
respective failure modes are instrumental for determination of potential failures,
improvements and the reliability growth.
Design analysis should not be limited to electronics, as mechanical components and software
are also subject to failure. For that reason, the appropriate reliability measure is the
probability of survival or probability of failure, rather than the failure rate or failure intensity,
as the mechanical components often cannot be related to a failure rate especially to a
constant failure rate, but rather to a failure probability (wear-out).
All reliability analytical methods can be applied, including testing specifically designed to
detect potential failure modes, especially those where the analysis would be too complex, or
would be likely to produce uncertain results. Failure modes, or their causes, found to have a
high probability of occurrence are addressed through design improvement, and the new
design reliability is reassessed. In that manner, reliability growth is monitored and the
progress is recorded. Design reliability analysis also includes imbedded software, as well as
the hardware-software interactions.
In a programme of reliability growth testing, laboratory or field testing is used to stimulate the
exposure of weaknesses and to improve the reliability of a system, module, sub-assembly
or component. When a failure occurs it shall be diagnosed, repair and/or replacement shall be
carried out and testing shall be continued. Concurrently with testing, past failures shall
be analysed to find their basic causes and, where appropriate, corrective modifications
shall be introduced into design or other procedures, resulting in progressive reliability growth.
This procedure applies equally to pure hardware and to embedded software.
A reliability growth programme on non-repairable, or one-shot, items or component only shall
provide for successively modified samples, each of a more reliable design than the one
before.
4.2 Origins of weaknesses and failures
4.2.1 General
Weaknesses are normally unknown in product use until they are revealed by failures.
However, a weakness may be created long before the occurrence of an observable failure by
an unconscious human error in some operation affecting an item such as excessive
operational or environmental stress, or inadequate component derating such that the
component strength is inadequate to withstand the expected stress or combination of
stresses. Alternatively, it may be inherent in a material or component due to a process not
being under complete control.
61014  IEC:2003 – 29 –
4.2.2 Systematic weaknesses
Systematic weaknesses are normally related to product design, components selection,
manufacturing process or similar procedures.
The number of types of weaknesses present is influenced by:
– accuracy of specification or estimation of environmental and operational stresses, or
conditions of use (product usage profile);
– novelty, complexity or criticality of design, manufacturing
...