IEC 60747-16-5:2013

IEC 60747-16-5 ®
Edition 1.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-5: Microwave integrated circuits – Oscillators

Dispositifs à semiconducteurs –
Partie 16-5: Circuits intégrés hyperfréquences – Oscillateurs

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IEC 60747-16-5 ®
Edition 1.0 2013-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-5: Microwave integrated circuits – Oscillators

Dispositifs à semiconducteurs –

Partie 16-5: Circuits intégrés hyperfréquences – Oscillateurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX X
ICS 31.080.99 ISBN 978-2-83220-827-4

– 2 – 60747-16-5  IEC:2013
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 Essential ratings and characteristics . 11
4.1 General requirements . 11
4.1.1 Circuit identification and types . 11
4.1.2 General function description . 11
4.1.3 Manufacturing technology . 11
4.1.4 Package identification . 11
4.2 Application description . 11
4.2.1 Conformance to system and/or interface information . 11
4.2.2 Overall block diagram . 11
4.2.3 Reference data . 11
4.2.4 Electrical compatibility . 12
4.2.5 Associated devices . 12
4.3 Specification of the function . 12
4.3.1 Detailed block diagram – Functional blocks . 12
4.3.2 Identification and function of terminals . 12
4.3.3 Function description . 13
4.4 Limiting values (absolute maximum rating system) . 13
4.4.1 Requirements . 13
4.4.2 Electrical limiting values . 14
4.4.3 Temperatures . 14
4.5 Operating conditions (within the specified operating temperature range) . 15
4.6 Electrical characteristics . 15
4.7 Mechanical and environmental ratings, characteristics and data . 16
4.8 Additional information . 16
5 Measuring methods . 16
5.1 General . 16
5.1.1 General precautions . 16
5.1.2 Characteristic impedance . 17
5.1.3 Handling precautions . 17
5.1.4 Types . 17
5.2 Oscillation frequency (f ) . 17
osc
5.2.1 Purpose . 17
5.2.2 Circuit diagram . 17
5.2.3 Principle of measurement . 17
5.2.4 Circuit description and requirements . 17
5.2.5 Precautions to be observed . 17
5.2.6 Measurement procedure . 18
5.2.7 Specified conditions . 18
5.3 Output power (P ) . 18
o,osc
5.3.1 Purpose . 18
5.3.2 Circuit diagram . 18
5.3.3 Principle of measurement . 18

60747-16-5  IEC:2013 – 3 –
5.3.4 Circuit description and requirements . 18
5.3.5 Precautions to be observed . 18
5.3.6 Measurement procedure . 18
5.3.7 Specified conditions . 18
5.4 Phase noise (L (f)) . 19
5.4.1 Purpose . 19
5.4.2 Measuring methods . 19
5.5 Tuning sensitivity (S ) . 24
f,v
5.5.1 Purpose . 24
5.5.2 Circuit diagram . 24
5.5.3 Principle of measurement . 24
5.5.4 Circuit description and requirements . 24
5.5.5 Precautions to be observed . 24
5.5.6 Measurement procedure . 24
5.5.7 Specified conditions . 24
5.6 Frequency pushing (f ) . 24
osc,push
5.6.1 Purpose . 24
5.6.2 Circuit diagram . 25
5.6.3 Principle of measurement . 25
5.6.4 Circuit description and requirements . 25
5.6.5 Precautions to be observed . 25
5.6.6 Measurement procedure . 25
5.6.7 Specified conditions . 25
5.7 Frequency pulling (f ) . 25
osc,pull
5.7.1 Purpose . 25
5.7.2 Circuit diagram . 25
5.7.3 Principle of measurement . 26
5.7.4 Circuit description and requirements . 26
5.7.5 Precautions to be observed . 26
5.7.6 Measurement procedure . 26
5.7.7 Specified conditions . 27
5.8 n-th order harmonic distortion ratio (P /P ) . 27
nth 1
5.8.1 Purpose . 27
5.8.2 Circuit diagram . 27
5.8.3 Principle of measurement . 27
5.8.4 Circuit description and requirements . 27
5.8.5 Measurement procedure . 27
5.8.6 Specified conditions . 27
5.9 Output power flatness (∆P ) . 28
o,osc
5.9.1 Purpose . 28
5.9.2 Circuit diagram . 28
5.9.3 Principle of measurement . 28
5.9.4 Circuit description and requirements . 28
5.9.5 Precautions to be observed . 28
5.9.6 Measurement procedure . 28
5.9.7 Specified conditions . 28
5.10 Tuning linearity . 28
5.10.1 Purpose . 28
5.10.2 Circuit diagram . 28

– 4 – 60747-16-5  IEC:2013
5.10.3 Principle of measurement . 29
5.10.4 Circuit description and requirements . 29
5.10.5 Precautions to be observed . 29
5.10.6 Measurement procedure . 29
5.10.7 Specified conditions . 30
5.11 Frequency temperature coefficient (α ) . 30
f,temp
5.11.1 Purpose . 30
5.11.2 Circuit diagram . 30
5.11.3 Principle of measurement . 30
5.11.4 Circuit description and requirements . 31
5.11.5 Precautions to be observed . 31
5.11.6 Measurement procedure . 31
5.11.7 Specified conditions . 31
5.12 Output power temperature coefficient (α ). 31
P,temp
5.12.1 Purpose . 31
5.12.2 Circuit diagram . 31
5.12.3 Principle of measurement . 31
5.12.4 Circuit description and requirements . 32
5.12.5 Precautions to be observed . 32
5.12.6 Measurement procedure . 32
5.12.7 Specified conditions . 32
5.13 Spurious distortion ratio (P /P ) . 32
s 1
5.13.1 Purpose . 32
5.13.2 Circuit diagram . 32
5.13.3 Principle of measurement . 32
5.13.4 Circuit description and requirements . 33
5.13.5 Measurement procedure . 33
5.13.6 Specified conditions . 33
5.14 Modulation bandwidth (B ). 33
mod
5.14.1 Purpose . 33
5.14.2 Circuit diagram . 33
5.14.3 Principle of measurement . 34
5.14.4 Circuit description and requirements . 34
5.14.5 Precautions to be observed . 34
5.14.6 Measurement procedure . 34
5.14.7 Specified conditions . 35
5.15 Sensitivity flatness . 35
5.15.1 Purpose . 35
5.15.2 Circuit diagram . 35
5.15.3 Principle of measurement . 35
5.15.4 Circuit description and requirements . 36
5.15.5 Precautions to be observed . 36
5.15.6 Measurement procedure . 36
5.15.7 Specified conditions . 36
6 Verifying methods . 36
6.1 Load mismatch tolerance (Ψ ) . 36
L
6.1.1 Purpose . 36
6.1.2 Verifying method 1 (spurious intensity) . 36

60747-16-5  IEC:2013 – 5 –
6.1.3 Verifying method 2 (no discontinuity of frequency tuning
characteristics of VCO) . 37
6.2 Load mismatch ruggedness (Ψ ) . 38
R
6.2.1 Purpose . 38
6.2.2 Circuit diagram . 38
6.2.3 Circuit description and requirements . 38
6.2.4 Precautions to be observed . 38
6.2.5 Test Procedure . 38
6.2.6 Specified conditions . 39
Bibliography . 40

Figure 1 – Circuit diagram for the measurement of the oscillation frequency f . 17
osc
Figure 2 – Circuit diagram for the measurement of the phase noise L (f) (method 1) . 20
Figure 3 – Circuit diagram for the measurement of the phase noise L (f) (method 2) . 21
Figure 4 – Circuit diagram for the measurement of the phase noise L (f) (method 3) . 22
Figure 5 – Circuit diagram for the measurement of the frequency pulling f . 26
osc,pull
Figure 6 – Tuning linearity . 29
Figure 7 – Circuit diagram for the measurement of the oscillation frequency
temperature coefficient α . 30
f,temp
Figure 8 – Circuit diagram for the measurement of the modulation bandwidth B . 34
mod
Figure 9 – Sensitivity flatness . 36

Table 1 – Comparison of phase noise measuring methods . 19

– 6 – 60747-16-5  IEC:2013
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-5: Microwave integrated circuits –
Oscillators
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-5 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/452/FDIS 47E/454/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.

60747-16-5  IEC:2013 – 7 –
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 8 – 60747-16-5  IEC:2013
SEMICONDUCTOR DEVICES –
Part 16-5: Microwave integrated circuits –
Oscillators
1 Scope
This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and
measuring methods of microwave integrated circuit oscillators.
This standard is applicable to the fixed and voltage-controlled semiconductor microwave
oscillator devices, except the oscillator modules such as synthesizers which require external
controllers.
NOTE This document is not applicable to the quartz crystal controlled oscillators. They are specified by
IEC 60679-1.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60617, Graphical symbols for diagrams (available from )
1)
IEC 60747-1:2006, Semiconductor devices – Part 1: General
Amendment 1:2010
IEC 60747-4:2007, Semiconductor devices – Discrete devices – Part 4: Microwave diodes and
transistors
IEC 60747-16-3:2002, Semiconductor devices – Part 16-3: Microwave integrated circuits –
)
Frequency converters
Amendment 1:2009
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
3 Terms and definitions
3.1
oscillation frequency
f
osc
frequency measured at the output port
___________
1)
A consolidated edition (2010) exists, including IEC 60747-1:2006 and its Amendment 1.
2)
A consolidated edition (2010) exists, including IEC 60747-16-3:2002 and its Amendment 1.

60747-16-5  IEC:2013 – 9 –
3.2
output power
P
o,osc
power measured at the output port
3.3
phase noise
L (f)
frequency-domain measure of the short-term frequency stability of an oscillator, normally
expressed as the power spectral density of the phase fluctuations, S (f), where the phase
φ
fluctuation function is φ(t) = 2π Ft-2πF t
Note 1 to entry: The spectral density of phase fluctuation can be directly related to the spectral density of
frequency fluctuation by
 F 
0 2
S ( f ) =   S ( f ) rad /Hz
φ y
 
f
 
where
F is the oscillator frequency;
F is the average oscillator frequency;
f is the Fourier frequency.
Note 2 to entry: L (f) is pronounced "script-ell of f".
[SOURCE: IEC 60679-1:2007, 3.2.25, modified – A symbol and two notes have been added.
The explanation of the spectral density of phase fluctuation has been moved to a note]
3.4
tuning sensitivity
S
f,v
ratio of the change of oscillation frequency to the variation of the control voltage
3.5
frequency pushing
f
osc,push
change of the oscillation frequency with the variation of the bias voltage
3.6
frequency pulling
f
osc,pull
change of the oscillation frequency with all phase angles for constant load reflection
coefficient
3.7
n-th order harmonic distortion ratio
P /P
nth 1
ratio of the power of the n-th order harmonic component at the output port to the output power
at the oscillation frequency
3.8
oscillation frequency range
difference between the oscillation frequencies at the maximum control voltage and at the
minimum control voltage
– 10 – 60747-16-5  IEC:2013
3.9
output power flatness
∆P
o,osc
difference between the maximum and the minimum output power within the control voltage
range
3.10
tuning linearity
ratio of the maximum departure of the oscillation frequency from an ideal straight line between
its values at the minimum and maximum control voltages to the oscillation frequency range
3.11
oscillation frequency temperature coefficient
α
f,temp
ratio of the change in oscillation frequency to the corresponding change in temperature
3.12
output power temperature coefficient
α
P,temp
ratio of the change in output power to the corresponding change in temperature
3.13
spurious distortion ratio
P /P
s 1
ratio of the power of the maximum spurious component at the output port to the output power
at the oscillation frequency
3.14
load mismatch tolerance
Ψ
L
maximum load VSWR (voltage standing-wave ratio) in the range where the device oscillates
with no unexpected spurious intensity and/or no discontinuity of frequency tuning
characteristics (in case of VCO) at all phase angles
3.15
load mismatch ruggedness
Ψ
R
maximum load VSWR in the range where the device withstand load mismatch with no
degradation at all phase angles with specified conditions
[SOURCE: IEC 60747-4:2007, 7.2.22]
3.16
modulation bandwidth
B
mod
modulating frequency at which the frequency deviation decreases by 3 dB from its dc value
3.17
sensitivity flatness
ratio of the maximum departure of the tuning sensitivity from an ideal straight line between its
values at the minimum and maximum control voltages to the oscillation frequency range

60747-16-5  IEC:2013 – 11 –
4 Essential ratings and characteristics
4.1 General requirements
4.1.1 Circuit identification and types
The identification of type (device name), the category of circuit and technology applied shall
be given.
Microwave oscillators are divided into two categories:
– type A: fixed oscillator;
– type B: voltage controlled oscillator.
4.1.2 General function description
A general description of the function performed by the integrated circuit microwave oscillators
and the features for the application shall be made.
4.1.3 Manufacturing technology
The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film
integrated circuit, micro-assembly, etc. shall be stated. This statement shall include details of
the semiconductor technologies such as Schottky barrier diode, MESFET, Si bipolar transistor,
etc.
IEC 60747-4 shall be referred to for terminology and letter symbols, essential ratings and
characteristics and measuring methods of such microwave devices.
4.1.4 Package identification
The following statements shall be made:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing, or drawing of non-standard
package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic.
4.2 Application description
4.2.1 Conformance to system and/or interface information
It should be stated whether the integrated circuit conforms to an application system and/or an
interface standard or a recommendation.
Detailed information concerning application systems, equipment and circuits such as very
small aperture terminal (VSAT) systems, broadcasting satellite (BS) receivers, microwave
landing systems, etc. should also be given.
4.2.2 Overall block diagram
A block diagram of the applied systems should be given if necessary.
4.2.3 Reference data
The most important properties that permit comparison between derivative types should be
given.
– 12 – 60747-16-5  IEC:2013
4.2.4 Electrical compatibility
It should be stated whether the integrated circuit is electrically compatible with other particular
integrated circuits, or families of integrated circuits, or whether special interfaces are required.
Details should be given concerning the type of output circuits, e.g. output impedances, d.c.
block, open-drain, etc. Interchangeability with other devices, if any, should also be given.
4.2.5 Associated devices
If applicable, the following should be stated:
– devices necessary for correct operation (list with type number, name and function);
– peripheral devices with direct interfacing (list with type number, name and function).
4.3 Specification of the function
4.3.1 Detailed block diagram – Functional blocks
A detail block diagram or equivalent circuit information of the integrated circuit microwave
oscillators shall be given. The block diagram shall be composed of the following:
a) functional blocks;
b) mutual interconnections among the functional blocks;
c) individual functional units within the functional blocks;
d) mutual interconnections among the individual functional blocks;
e) function of each external connection;
f) inter-dependence between the separate functional blocks.
The block diagram shall identify the function of each external connection and, where no
ambiguity can arise, also show the terminal symbols and/or numbers. If the encapsulation has
metallic parts, any connection to them from external terminals shall be indicated. The
connections with any associated external electrical elements shall be stated, where necessary.
As additional information, the complete electrical circuit diagram can be reproduced, but not
necessarily with indications of the values of the circuit components. The graphical symbol for
the function shall be given. Rules governing such diagrams may be obtained from IEC 60617.
4.3.2 Identification and function of terminals
All terminals shall be identified on the block diagram (supply terminals, output terminals).
The terminal functions 1) to 4) shall be indicated in a table as follows:
Function of terminal
Terminal Terminal 1) Terminal 2) Function
3) Output 4) Type of
number symbol designation identification output circuits

(1) Terminal designation
A terminal designation to indicate the function of the terminal shall be given. Supply
terminals, ground terminals, blank terminals (with abbreviation NC), non-usable terminals
(with abbreviation NU) shall be distinguished.
(2) Function
A brief indication of the terminal function shall be given:
– each function of multi-role terminals, i.e. terminals having multiple functions;

60747-16-5  IEC:2013 – 13 –
– each function of integrated circuit selected by mutual pin connections, programming
and/or application of function selection data to the function selection pin, such as
mode selection pin.
(3) Output identification
Output and multiplex output terminals shall be distinguished.
(4) Type of output circuits
The type of output circuit, e.g. output impedances, with or without d.c. block, etc., shall be
distinguished.
If the baseplate of the package is used as a ground terminal, the type of ground, e.g. analog
ground, digital ground, shall be stated in the column of 2) Function.
EXAMPLE
Bias voltage(s) Control voltage(s)
Integrated
NC NC
circuit
microwave
NU oscillator Output(s)
Ground IEC  1332/13
4.3.3 Function description
The function performed by the circuit shall be specified, including the following information:
– basic function;
– relation to external terminals;
– operation mode (e.g., set-up method, preference, etc.).
4.4 Limiting values (absolute maximum rating system)
4.4.1 Requirements
The table for these values shall contain the following:
– Any interdependence of limiting conditions shall be specified.
– If externally connected and/or attached elements, for example heatsinks, have an
influence on the values of the ratings, the ratings shall be prescribed for the integrated
circuit with the elements connected and/or attached.
– If limiting values are exceeded for transient overload, the permissible excess and their
durations shall be specified.
– Where minimum and maximum values differ during programming of the device, this shall
be stated.
– All voltages are referenced to a specified reference terminal (V , ground, etc.).
ss
– In satisfying the following clauses, if maximum and/or minimum values are quoted, the
manufacturer shall indicate whether he refers to the absolute magnitude or to the
algebraic value of the quantity.

– 14 – 60747-16-5  IEC:2013
– The ratings given shall cover the operation of the multi-function integrated circuit over the
specified range of operating temperatures. Where such ratings are temperature-dependent,
these dependence shall be indicated.
4.4.2 Electrical limiting values
Limiting values shall be specified as follows:
Parameters Min. Max.
Bias voltage(s) (where appropriate) +
Bias current(s) (where appropriate) +
+
Control voltage(s) (where appropriate)
Control current(s) (where appropriate) +
Terminal voltage(s) (where appropriate) + +
Terminal current(s) (where appropriate) +
Power dissipation
+
It is necessary to select either Bias voltage(s) or Bias current(s), either Control voltage(s) or
Control current(s), and either Terminal voltage(s) or Terminal current(s).

The detail specification may indicate those values within the table including footnotes a and b.

a, b
Parameters Symbols Min. Max. Unit

a
Where appropriate, in accordance with the type of circuit considered.
b
For power supply voltage range:
– limiting value(s) of the continuous voltage(s) at the supply terminal(s) with respect to a
special electrical reference point;
– where appropriate, limiting value between specified supply terminals;
– when more than one voltage supply is required, a statement shall be made as to whether
the sequence in which these supplies are applied is significant: if so, the sequence shall
be stated;
– when more than one supply is needed, it may be necessary to state the combinations of
ratings for these supply voltages and currents.

4.4.3 Temperatures
a) Operating temperature (ambient or reference-point temperature)
b) Storage temperature
c) Channel temperature
d) Lead temperature (for soldering)
The detail specification may indicate those values within the table including the note.

Parameters (Note) Symbols Min. Max. Unit

NOTE Where appropriate, in accordance with the type of circuit considered.

60747-16-5  IEC:2013 – 15 –
4.5 Operating conditions (within the specified operating temperature range)
Operating conditions are not to be inspected, but may be used for quality assessment
purpose.
a) Power supplies – Positive and/or negative values
b) Initialization sequences (where appropriate)
If special initialization sequences are necessary, power supply sequencing and initialization
procedure shall be specified.
c) Input voltage(s) (where appropriate)
d) Output current(s) (where appropriate)
e) Voltage and/or current of other terminal(s)
f) External elements (where appropriate)
g) Operating temperature range
4.6 Electrical characteristics
The characteristics shall apply over the full operating temperature range, unless otherwise
specified. Each characteristic shall be stated either:
a) over the specified range of operating temperatures, or
b) at a temperature of 25 °C, and at maximum and minimum operating temperatures.

Parameters Min. Typ. Max. Types
A B
Bias operating current + + + +
Control operating current + + +
Oscillation frequency, f
+ + + + +
osc
Output power, P + + + + +
o,osc
Phase noise, L (f) + + +
Tuning sensitivity, S
+ +  +
f,v
Frequency pushing, f  + + +
osc,push
Frequency pulling, f
+ + +
osc,pull
n-th order harmonic distortion ratio,  + + +
P /P
nth 1
Oscillation frequency range + + +
Output power flatness, ∆P + + +
o,osc
Tuning linearity + + +
Oscillation frequency temperature + + + +
coefficient, α
f,temp
Output power temperature + + + +
coefficient, α
P,
...

IEC 60747-16-5 ®
Edition 1.1 2020-07
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-5: Microwave integrated circuits – Oscillators

Dispositifs à semiconducteurs –
Partie 16-5: Circuits intégrés hyperfréquences – Oscillateurs

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IEC 60747-16-5 ®
Edition 1.1 2020-07
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-5: Microwave integrated circuits – Oscillators

Dispositifs à semiconducteurs –

Partie 16-5: Circuits intégrés hyperfréquences – Oscillateurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-8864-1

IEC 60747-16-5 ®
Edition 1.1 2020-07
CONSOLIDATED VERSION
REDLINE VERSION
VERSION REDLINE
colour
inside
Semiconductor devices –
Part 16-5: Microwave integrated circuits – Oscillators

Dispositifs à semiconducteurs –
Partie 16-5: Circuits intégrés hyperfréquences – Oscillateurs

– 2 – IEC 60747-16-5:2013+AMD1:2020 CSV
 IEC 2020
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 9
4 Essential ratings and characteristics . 11
4.1 General requirements . 11
4.1.1 Circuit identification and types . 11
4.1.2 General function description . 11
4.1.3 Manufacturing technology . 11
4.1.4 Package identification . 12
4.2 Application description . 12
4.2.1 Conformance to system and/or interface information . 12
4.2.2 Overall block diagram . 12
4.2.3 Reference data . 12
4.2.4 Electrical compatibility . 12
4.2.5 Associated devices . 12
4.3 Specification of the function . 12
4.3.1 Detailed block diagram – Functional blocks . 12
4.3.2 Identification and function of terminals . 13
4.3.3 Function description . 14
4.4 Limiting values (absolute maximum rating system) . 14
4.4.1 Requirements . 14
4.4.2 Electrical limiting values . 14
4.4.3 Temperatures . 15
4.5 Operating conditions (within the specified operating temperature range) . 15
4.6 Electrical characteristics . 16
4.7 Mechanical and environmental ratings, characteristics and data . 16
4.8 Additional information . 17
5 Measuring methods . 17
5.1 General . 17
5.1.1 General precautions . 17
5.1.2 Characteristic impedance . 17
5.1.3 Handling precautions . 17
5.1.4 Types . 17
5.2 Oscillation frequency (f ) . 17
osc
5.2.1 Purpose . 17
5.2.2 Circuit diagram . 18
5.2.3 Principle of measurement . 18
5.2.4 Circuit description and requirements . 18
5.2.5 Precautions to be observed . 18
5.2.6 Measurement procedure . 18
5.2.7 Specified conditions . 18
5.3 Output power (P ) . 18
o,osc
5.3.1 Purpose . 18
5.3.2 Circuit diagram . 19
5.3.3 Principle of measurement . 19

 IEC 2020
5.3.4 Circuit description and requirements . 19
5.3.5 Precautions to be observed . 19
5.3.6 Measurement procedure . 19
5.3.7 Specified conditions . 19
5.4 Phase noise (L (f)) . 19
5.4.1 Purpose . 19
5.4.2 Measuring methods . 19
5.5 Tuning sensitivity (S ) . 24
f,v
5.5.1 Purpose . 24
5.5.2 Circuit diagram . 24
5.5.3 Principle of measurement . 24
5.5.4 Circuit description and requirements . 25
5.5.5 Precautions to be observed . 25
5.5.6 Measurement procedure . 25
5.5.7 Specified conditions . 25
5.6 Frequency pushing (f ) . 25
osc,push
5.6.1 Purpose . 25
5.6.2 Circuit diagram . 25
5.6.3 Principle of measurement . 25
5.6.4 Circuit description and requirements . 25
5.6.5 Precautions to be observed . 25
5.6.6 Measurement procedure . 25
5.6.7 Specified conditions . 26
5.7 Frequency pulling (f ) . 26
osc,pull
5.7.1 Purpose . 26
5.7.2 Circuit diagram . 26
5.7.3 Principle of measurement . 26
5.7.4 Circuit description and requirements . 27
5.7.5 Precautions to be observed . 27
5.7.6 Measurement procedure . 27
5.7.7 Specified conditions . 27
5.8 n-th order harmonic distortion ratio (P /P ) . 27
nth 1
5.8.1 Purpose . 27
5.8.2 Circuit diagram . 27
5.8.3 Principle of measurement . 27
5.8.4 Circuit description and requirements . 28
5.8.5 Measurement procedure . 28
5.8.6 Specified conditions . 28
5.9 Output power flatness (∆P ) . 28
o,osc
5.9.1 Purpose . 28
5.9.2 Circuit diagram . 29
5.9.3 Principle of measurement . 29
5.9.4 Circuit description and requirements . 29
5.9.5 Precautions to be observed . 29
5.9.6 Measurement procedure . 29
5.9.7 Specified conditions . 29
5.10 Tuning linearity . 29
5.10.1 Purpose . 29
5.10.2 Circuit diagram . 29

– 4 – IEC 60747-16-5:2013+AMD1:2020 CSV
 IEC 2020
5.10.3 Principle of measurement . 29
5.10.4 Circuit description and requirements . 30
5.10.5 Precautions to be observed . 30
5.10.6 Measurement procedure . 30
5.10.7 Specified conditions . 31
5.11 Frequency temperature coefficient (α ) . 31
f,temp
5.11.1 Purpose . 31
5.11.2 Circuit diagram . 31
5.11.3 Principle of measurement . 31
5.11.4 Circuit description and requirements . 32
5.11.5 Precautions to be observed . 32
5.11.6 Measurement procedure . 32
5.11.7 Specified conditions . 32
5.12 Output power temperature coefficient (α ). 32
P,temp
5.12.1 Purpose . 32
5.12.2 Circuit diagram . 32
5.12.3 Principle of measurement . 32
5.12.4 Circuit description and requirements . 33
5.12.5 Precautions to be observed . 33
5.12.6 Measurement procedure . 33
5.12.7 Specified conditions . 33
5.13 Spurious distortion ratio (P /P ) . 33
s 1
5.13.1 Purpose . 33
5.13.2 Circuit diagram . 33
5.13.3 Principle of measurement . 33
5.13.4 Circuit description and requirements . 34
5.13.5 Measurement procedure . 34
5.13.6 Specified conditions . 34
5.14 Modulation bandwidth (B ). 34
mod
5.14.1 Purpose . 34
5.14.2 Circuit diagram . 34
5.14.3 Principle of measurement . 35
5.14.4 Circuit description and requirements . 35
5.14.5 Precautions to be observed . 36
5.14.6 Measurement procedure . 36
5.14.7 Specified conditions . 36
5.15 Sensitivity flatness . 36
5.15.1 Purpose . 36
5.15.2 Circuit diagram . 36
5.15.3 Principle of measurement . 36
5.15.4 Circuit description and requirements . 37
5.15.5 Precautions to be observed . 37
5.15.6 Measurement procedure . 37
5.15.7 Specified conditions . 38
6 Verifying methods . 38
6.1 Load mismatch tolerance (Ψ ) . 38
L
6.1.1 Purpose . 38
6.1.2 Verifying method 1 (spurious intensity) . 38

 IEC 2020
6.1.3 Verifying method 2 (no discontinuity of frequency tuning
characteristics of VCO) . 39
6.2 Load mismatch ruggedness (Ψ ) . 39
R
6.2.1 Purpose . 39
6.2.2 Circuit diagram . 39
6.2.3 Circuit description and requirements . 39
6.2.4 Precautions to be observed . 40
6.2.5 Test Procedure . 40
6.2.6 Specified conditions . 40
Bibliography . 41

Figure 1 – Circuit diagram for the measurement of the oscillation frequency f . 18
osc
Figure 2 – Circuit diagram for the measurement of the phase noise L (f) (method 1) . 20
Figure 3 – Circuit diagram for the measurement of the phase noise L (f) (method 2) . 22
Figure 4 – Circuit diagram for the measurement of the phase noise L (f) (method 3) . 23
Figure 5 – Circuit diagram for the measurement of the frequency pulling f . 26
osc,pull
Figure 6 – Tuning linearity . 30
Figure 7 – Circuit diagram for the measurement of the oscillation frequency
temperature coefficient α . 31
f,temp
Figure 8 – Circuit diagram for the measurement of the modulation bandwidth B . 35
mod
Figure 9 – Sensitivity flatness . 37

Table 1 – Comparison of phase noise measuring methods . 20

– 6 – IEC 60747-16-5:2013+AMD1:2020 CSV
 IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-5: Microwave integrated circuits –
Oscillators
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
This consolidated version of the official IEC Standard and its amendment has been
prepared for user convenience.
IEC 60747-16-5 edition 1.1 contains the first edition (2013-06) [documents 47E/452/FDIS
and 47E/454/RVD] and its amendment 1 (2020-07) [documents 47E/673/CDV and
47E/705/RVC] and its corrigendum (2020-09) (applying only to the English version).
In this Redline version, a vertical line in the margin shows where the technical content
is modified by amendment 1. Additions are in green text, deletions are in strikethrough
red text. A separate Final version with all changes accepted is available in this
publication.
 IEC 2020
International Standard IEC 60747-16-5 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
The committee has decided that the contents of the base publication and its amendment will
remain unchanged until the stability date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 8 – IEC 60747-16-5:2013+AMD1:2020 CSV
 IEC 2020
SEMICONDUCTOR DEVICES –
Part 16-5: Microwave integrated circuits –
Oscillators
1 Scope
This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and
measuring methods of microwave integrated circuit oscillators.
This standard is applicable to the fixed and voltage-controlled semiconductor microwave
oscillator devices, except the oscillator modules such as synthesizers which require external
controllers.
NOTE This document is not applicable to the quartz crystal controlled oscillators. They are specified by
IEC 60679-1.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60617, Graphical symbols for diagrams (available from )
1)
IEC 60747-1:2006, Semiconductor devices – Part 1: General
Amendment 1:2010
IEC 60747-4:2007, Semiconductor devices – Discrete devices – Part 4: Microwave diodes and
transistors
IEC 60747-4:2007/AMD 1:2017
IEC 60747-16-3:2002, Semiconductor devices – Part 16-3: Microwave integrated circuits –
Frequency converters
)
IEC 60747-16-3:2002/AMD 1:2009
IEC 60747-16-3:2002/AMD 2:2017
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide

___________
1)
A consolidated edition (2010) exists, including IEC 60747-1:2006 and its Amendment 1.
2)
A consolidated edition (2010) exists, including IEC 60747-16-3:2002 and its Amendment 1.

 IEC 2020
3 Terms and definitions
3.1
oscillation frequency
f
osc
frequency measured at the output port
3.2
output power
P
o,osc
power measured at the output port
3.3
phase noise
L (f)
frequency-domain measure of the short-term frequency stability of an oscillator, normally
expressed as the power spectral density of the phase fluctuations, S (f), where the phase
φ
fluctuation function is φ(t) = 2π Ft-2πF t
Note 1 to entry: The spectral density of phase fluctuation can be directly related to the spectral density of
frequency fluctuation by
 F 
0 2
( )   ( )
S f = S f rad /Hz
φ y
 
f
 
where
F is the oscillator frequency;
F is the average oscillator frequency;
f is the Fourier frequency.
Note 2 to entry: L (f) is pronounced "script-ell of f".
[SOURCE: IEC 60679-1:2007, 3.2.25, modified – A symbol and two notes have been added.
The explanation of the spectral density of phase fluctuation has been moved to a note]
L (f)
frequency-domain measure of the short-term frequency stability of an oscillator
Note 1 to entry: This phase noise is normally expressed as the power spectral density of the phase fluctuations,
S (f), where the phase fluctuation function is φ(t)=2πFt-2πF t. The spectral density of phase fluctuation can be
φ 0
directly related to the spectral density of frequency fluctuation by the following formula:
F
Sf = S f rad /Hz
( ) ( )
φ  y
f

where
F is the oscillator frequency;
F is the average oscillator frequency;
f is the Fourier frequency.
Note 2 to entry: L (f) is pronounced "script-ell of f".
[SOURCE: IEC 60050-561:2014, 561-03-22, modified – A symbol and Note 2 to entry have
been added.]
– 10 – IEC 60747-16-5:2013+AMD1:2020 CSV
 IEC 2020
3.4
tuning sensitivity
S
f,v
ratio of the change of oscillation frequency to the variation of the control voltage
3.5
frequency pushing
f
osc,push
change of the oscillation frequency with the variation of the bias voltage
3.6
frequency pulling
f
osc,pull
change of the oscillation frequency with all phase angles for constant load reflection
coefficient
3.7
n-th order harmonic distortion ratio
P /P
nth 1
ratio of the power of the n-th order harmonic component at the output port to the output power
at the oscillation frequency
3.8
oscillation frequency range
difference between the oscillation frequencies at the maximum control voltage and at the
minimum control voltage
3.9
output power flatness
∆P
o,osc
difference between the maximum and the minimum output power within the control voltage
range
3.10
tuning linearity
ratio of the maximum departure of the oscillation frequency from an ideal straight line between
its values at the minimum and maximum control voltages to the oscillation frequency range
3.11
oscillation frequency temperature coefficient
α
f,temp
ratio of the change in oscillation frequency to the corresponding change in temperature
3.12
output power temperature coefficient
α
P,temp
ratio of the change in output power to the corresponding change in temperature
3.13
spurious distortion ratio
P /P
s 1
ratio of the power of the maximum spurious component at the output port to the output power
at the oscillation frequency
 IEC 2020
3.14
load mismatch tolerance
Ψ
L
maximum load VSWR (voltage standing-wave ratio) in the range where the device oscillates
with no unexpected spurious intensity and/or no discontinuity of frequency tuning
characteristics (in case of VCO) at all phase angles
ψ
L
maximum load VSWR in the range where the device oscillates with no unexpected spurious
intensity and/or no discontinuity of frequency tuning characteristics (in case of VCO) at all
phase angles
Note 1 to entry: “VSWR” is an abbreviation of “voltage standing wave ratio”.
Note 2 to entry: “VCO” is an abbreviation of “voltage controlled oscillator”.
3.15
load mismatch ruggedness
Ψ
R
maximum load VSWR in the range where the device withstand load mismatch with no
degradation at all phase angles with specified conditions
[SOURCE: IEC 60747-4:2007, 7.2.22]
3.16
modulation bandwidth
B
mod
modulating frequency at which the frequency deviation decreases by 3 dB from its dc value
3.17
sensitivity flatness
ratio of the maximum departure of the tuning sensitivity from an ideal straight line between its
values at the minimum and maximum control voltages to the oscillation frequency range
4 Essential ratings and characteristics
4.1 General requirements
4.1.1 Circuit identification and types
The identification of type (device name), the category of circuit and technology applied shall
be given.
Microwave oscillators are divided into two categories:
– type A: fixed oscillator;
– type B: voltage controlled oscillator.
4.1.2 General function description
A general description of the function performed by the integrated circuit microwave oscillators
and the features for the application shall be made.
4.1.3 Manufacturing technology
The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film
integrated circuit, micro-assembly, etc. shall be stated. This statement shall include details of
the semiconductor technologies such as Schottky barrier diode, MESFET, Si bipolar transistor,
etc.
– 12 – IEC 60747-16-5:2013+AMD1:2020 CSV
 IEC 2020
IEC 60747-4 shall be referred to for terminology and letter symbols, essential ratings and
characteristics and measuring methods of such microwave devices.
4.1.4 Package identification
The following statements shall be made:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing, or drawing of non-standard
package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic.
4.2 Application description
4.2.1 Conformance to system and/or interface information
It should be stated whether the integrated circuit conforms to an application system and/or an
interface standard or a recommendation.
Detailed information concerning application systems, equipment and circuits such as very
small aperture terminal (VSAT) systems, broadcasting satellite (BS) receivers, microwave
landing systems, etc. should also be given.
4.2.2 Overall block diagram
A block diagram of the applied systems should be given if necessary.
4.2.3 Reference data
The most important properties that permit comparison between derivative types should be
given.
4.2.4 Electrical compatibility
It should be stated whether the integrated circuit is electrically compatible with other particular
integrated circuits, or families of integrated circuits, or whether special interfaces are required.
Details should be given concerning the type of output circuits, e.g. output impedances, d.c.
block, open-drain, etc. Interchangeability with other devices, if any, should also be given.
4.2.5 Associated devices
If applicable, the following should be stated:
– devices necessary for correct operation (list with type number, name and function);
– peripheral devices with direct interfacing (list with type number, name and function).
4.3 Specification of the function
4.3.1 Detailed block diagram – Functional blocks
A detail block diagram or equivalent circuit information of the integrated circuit microwave
oscillators shall be given. The block diagram shall be composed of the following:
a) functional blocks;
b) mutual interconnections among the functional blocks;
c) individual functional units within the functional blocks;
d) mutual interconnections among the individual functional blocks;

 IEC 2020
e) function of each external connection;
f) inter-dependence between the separate functional blocks.
The block diagram shall identify the function of each external connection and, where no
ambiguity can arise, also show the terminal symbols and/or numbers. If the encapsulation has
metallic parts, any connection to them from external terminals shall be indicated. The
connections with any associated external electrical elements shall be stated, where necessary.
As additional information, the complete electrical circuit diagram can be reproduced, but not
necessarily with indications of the values of the circuit components. The graphical symbol for
the function shall be given. Rules governing such diagrams may be obtained from IEC 60617.
4.3.2 Identification and function of terminals
All terminals shall be identified on the block diagram (supply terminals, output terminals).
The terminal functions 1) to 4) shall be indicated in a table as follows:
Function of terminal
Terminal Terminal 1) Terminal 2) Function
3) Output 4) Type of
number symbol designation
identification output circuits

(1) Terminal designation
A terminal designation to indicate the function of the terminal shall be given. Supply
terminals, ground terminals, blank terminals (with abbreviation NC), non-usable terminals
(with abbreviation NU) shall be distinguished.
(2) Function
A brief indication of the terminal function shall be given:
– each function of multi-role terminals, i.e. terminals having multiple functions;
– each function of integrated circuit selected by mutual pin connections, programming
and/or application of function selection data to the function selection pin, such as
mode selection pin.
(3) Output identification
Output and multiplex output terminals shall be distinguished.
(4) Type of output circuits
The type of output circuit, e.g. output impedances, with or without d.c. block, etc., shall be
distinguished.
If the baseplate of the package is used as a ground terminal, the type of ground, e.g. analog
ground, digital ground, shall be stated in the column of 2) Function.
EXAMPLE
– 14 – IEC 60747-16-5:2013+AMD1:2020 CSV
 IEC 2020
Bias voltage(s) Control voltage(s)
Integrated
NC NC
circuit
microwave
NU oscillator Output(s)
IEC  1332/13
Ground
4.3.3 Function description
The function performed by the circuit shall be specified, including the following information:
– basic function;
– relation to external terminals;
– operation mode (e.g., set-up method, preference, etc.).
4.4 Limiting values (absolute maximum rating system)
4.4.1 Requirements
The table for these values shall contain the following:
– Any interdependence of limiting conditions shall be specified.
– If externally connected and/or attached elements, for example heatsinks, have an
influence on the values of the ratings, the ratings shall be prescribed for the integrated
circuit with the elements connected and/or attached.
– If limiting values are exceeded for transient overload, the permissible excess and their
durations shall be specified.
– Where minimum and maximum values differ during programming of the device, this shall
be stated.
– All voltages are referenced to a specified reference terminal (V , ground, etc.).
ss
– In satisfying the following clauses, if maximum and/or minimum values are quoted, the
manufacturer shall indicate whether he refers to the absolute magnitude or to the
algebraic value of the quantity.
– The ratings given shall cover the operation of the multi-function integrated circuit over the
specified range of operating temperatures. Where such ratings are temperature-dependent,
these dependence shall be indicated.
4.4.2 Electrical limiting values
Limiting values shall be specified as follows:
Parameters Min. Max.
Bias voltage(s) (where appropriate) +
Bias current(s) (where appropriate) +
Control voltage(s) (
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