IEC 62137:2004/COR1:2005

IEC 62137
(First edition – 2004)
ENVIRONMENTAL AND ENDURANCE TESTING – TEST METHODS FOR SURFACE-MOUNT BOARDS OF

AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN

CORRIGENDUM 1
Page 5
2 Normative references
Delete:
IEC 61190-1-1, Attachment materials for electronic assemblies – Part 1-1: Requirements
for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2, Attachment materials for electronic assemblies – Part 1-2: Requirements
for solder pastes for high-quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assemblies – Part 1-3: Requirements
for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic
soldering applications
Page 16
A.2.4.4 Post-treatment (flux removal)
First sentence
Instead of:
“(propanol)”
read:
“(isopropanol)”.
Page 17
A.3.4.1 Soldering process, a) Pre-treatment
...