IEC 62137:2004

INTERNATIONAL IEC
STANDARD 62137
First edition
2004-07
Environmental and endurance testing –
Test methods for surface-mount boards
of area array type packages FBGA, BGA,
FLGA, LGA, SON and QFN
Reference number
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INTERNATIONAL IEC
STANDARD 62137
First edition
2004-07
Environmental and endurance testing –
Test methods for surface-mount boards
of area array type packages FBGA, BGA,
FLGA, LGA, SON and QFN
© IEC 2004 ⎯ Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
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– 2 – 62137 © IEC:2004(E)
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms and definitions .6
4 Abbreviations .6
5 Solder joint quality test methods.6
5.1 Reflow solderability test for solder joint .6
5.2 Reserved for future use.9
6 Mechanical test methods .9
6.1 Bending test for solder joint.9
6.2 Drop test for solder joint .9
7 Environment test methods .9
7.1 Temperature cycling test for solder joint .9
7.2 Reserved for future use.12
Annex A (informative) Informative test methods for test board – Guidance.13
Annex B (informative) Standard mounting process for area array type packages and
peripheral terminal type packages (QFN and SON).23
Bibliography.26
Figure 1 – Temperature measurement of the specimen using thermocouples.8
Figure 2 – Moistening/reflow process cycle proposed .8
Figure 3 – Reflow profile.8
Figure 4 – Configuration of one cycle period .11
Figure A.1 – Temperature measurement of the specimen using thermocouples .14
Figure A.2 – Temperature measurement of the specimen using thermocouples .16
Figure A.3 – Measuring method for peel strength.18
Figure A.4 – Standard land shape of the mount reliability test board .21
Figure A.5 – Design standard for land shape of packages of peripheral terminal type
SON and QFN.22
Table 1 – Temperature cycling test conditions .11
Table A.1 – Types of mount reliability test board.20
Table A.2 – Standard mount reliability test board layer configuration .21
Table A.3 – Design guideline for land size of packages of area array ball/land type
BGA, FBGA, LGA, and FLGA.21
Table B.1 – Stencil design standard for area array terminal type packages.24
Table B.2 – Stencil design standard for peripheral terminal type packages .24

62137 © IEC:2004(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL AND ENDURANCE TESTING –
TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY
TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62137 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/444/FDIS 91/451/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
___________
FBGA fine-pitch ball grid array
BGA ball grid array
FLGA fine-pitch land grid array
LGA land grid array
SON small outline non-leaded package
QFN quad flat-pack non-leaded package

– 4 – 62137 © IEC:2004(E)
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
 reconfirmed;
 withdrawn;
 replaced by a revised edition, or
 amended.
A bilingual version may be issued at a later date.

62137 © IEC:2004(E) – 5 –
ENVIRONMENTAL AND ENDURANCE TESTING –
TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY
TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
1 Scope
This International Standard specifies the test method and guidelines for evaluating the quality
and reliability of boards, solder lands, solder process and solder joints of reflow solder
mounted area array type packages and peripheral terminal type packages.
This standard tests for durability against mechanical and thermal stress received during or
after the mounting process of discrete semiconductor devices and of integrated circuits
(hereinafter both referred to as semiconductor devices) used mainly for industrial and
consumer use equipment.
The test method specified in this standard is an integrated one by including the evaluation
method of mounting methods, mounting conditions, printed circuit boards, soldering materials,
and so on. It does not specify the evaluation method of the individual semiconductor devices.
Mounting conditions, printed wiring boards, soldering materials, and so on significantly affect
the result of the test specified in this standard. Therefore, the test specified in this standard
shall not be regarded as the one to be used to guarantee the mounting reliability of the
semiconductor devices.
The test method is not necessary if there is no stress (mechanical or others) from any of the
tests covered in this standard.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
IEC 60191-6-2:2001, Mechanical standardization of semiconductor devices – Part 6-2:
General rules for the preparation of outline drawings of surface mounted semiconductor
device packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column
terminal packages
IEC 60191-6-5:2001, Mechanical standardization of semiconductor devices – Part 6-5:
General rules for the preparation of outline drawings of surface mounted semiconductor
device packages – Design guide for fine-pitch ball grid array (FBGA)
IEC 61190-1-1, Attachment materials for electronic assemblies – Part 1-1: Requirements for
soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2, Attachment materials for electronic assemblies – Part 1-2: Requirements for
solder pastes for high-quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assemblies – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
JEITA ETR-7001:1998, Terms and definitions for surface mount technology
___________
Japan Electronics and Information Technology Industries Association.

– 6 – 62137 © IEC:2004(E)
3 Terms and definitions
For the purposes of this document, the terms and definitions for BG
...