IEC TS 62686-1:2020

IEC TS 62686-1 ®
Edition 3.0 2020-04
REDLINE VERSION
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –
Part 1: General requirements for high reliability integrated circuits and discrete
semiconductors
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IEC TS 62686-1 ®
Edition 3.0 2020-04
REDLINE VERSION
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Electronic components for aerospace,

defence and high performance (ADHP) applications –

Part 1: General requirements for high reliability integrated circuits and discrete

semiconductors
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-8246-5

– 2 – IEC TS 62686-1:2020 RLV © IEC 2020
CONTENTS
FOREWORD . 6
INTRODUCTION . 8
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 10
3.1 Terms and definitions . 10
3.2 Abbreviated terms . 12
4 Technical requirements . 15
4.1 General . 15
4.1.1 Overview . 15
4.1.2 Automotive components . 15
4.2 Procedures . 15
4.2.1 General . 15
4.2.2 Product discontinuance . 16
4.2.3 ESD protection during manufacture . 16
4.2.4 Specification control . 16
4.2.5 Traceability including anti-counterfeit measures . 16
4.3 Product or process change notification (PCN) . 16
4.3.1 General . 16
4.3.2 Notification . 17
4.3.3 Notification details . 17
4.3.4 Notifiable changes . 17
4.4 Shipment controls . 17
4.4.1 General . 17
4.4.2 Shipping container and date code marking . 18
4.4.3 Date code remarking . 18
4.4.4 Inner container formation . 18
4.4.5 Date code age on delivery . 18
4.4.6 ESD marking . 18
4.4.7 MSL . 18
4.4.8 Lead-free marking . 18
4.4.9 Labels . 18
4.5 Electrical . 19
4.5.1 General . 19
4.5.2 Electrical test . 19
4.5.3 Electrical parameter assessment . 20
4.5.4 SDRAM memories . 20
4.5.5 Logic families . 20
4.5.6 Power MOSFETs . 20
4.5.7 Silicon rectifier diodes . 20
4.6 Mechanical . 20
4.6.1 General . 20
4.6.2 Device marking . 20
4.6.3 Small packages . 20
4.6.4 Moisture sensitivity . 21
4.6.5 Robustness of hermetic seals . 21

4.6.6 Termination finishes . 21
4.7 Audit capability . 21
4.7.1 General . 21
4.7.2 Internal quality audits . 21
4.7.3 Subcontract manufacturing . 22
4.8 Quality assurance . 22
4.8.1 General . 22
4.8.2 Quality system . 22
4.8.3 Sampling plans . 22
4.8.4 Failure analysis support . 23
4.8.5 Outgoing quality . 23
4.9 Supplier performance monitoring by the user .
4.9.1 General .
4.9.2 Lot acceptance .
4.9.3 Suspension of deliveries .
4.9.4 Loss of approval .
4.9.5 AQL figures .
4.9.6 100 % screening .
4.9.7 Termination determination .
4.9 Qualification . 25
4.9.1 General . 25
4.9.2 Methodology . 25
4.9.3 Test samples . 27
4.9.4 Qualification categories . 27
4.9.5 Maintenance of qualification standards . 27
4.9.6 In-process test results . 27
4.9.7 Product monitor results . 32
4.9.8 References . 32
4.9.9 Qualification report . 32
4.9.10 Archiving . 32
4.9.11 Qualification by similarity . 32
4.9.12 Similarity assessment . 32
4.10 Reliability . 33
4.10.1 General . 33
4.10.2 Operating reliability. 33
4.10.3 Failure criteria . 33
4.10.4 Corrective action . 34
4.10.5 Warranty . 34
Suspension of certification .
4.10.6 Single event effects (SEEs) . 34
4.11 Product monitor . 34
4.11.1 General . 34
4.11.2 Monitor programme . 34
4.11.3 Problem notification . 35
4.11.4 Data reporting. 35
4.11.5 Samples . 35
4.11.6 Corrective acti
...