IEC 60917-1:1998
(Main)Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
Gives the definitions of a modular order for mechanical structures of electronic equipment and provides for dimensional compatibility at mechanical interfaces with related engineering applications.
Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques - Partie 1: Norme générique
Donne les définitions d'un ordre modulaire pour les structures mécaniques, pour les infrastructures électroniques et prévoit la compatibilité dimensionnelle des interfaces mécaniques avec les applications industrielles voisines.
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Standards Content (Sample)
NORME
CEI
INTERNATIONALE
IEC
60917-1
INTERNATIONAL
Première édition
STANDARD
First edition
1998-09
Ordre modulaire pour le développement
des structures mécaniques
pour les infrastructures électroniques –
Partie 1:
Norme générique
Modular order for the development
of mechanical structures for electronic
equipment practices –
Part 1:
Generic standard
Numéro de référence
Reference number
CEI / IEC 60917-1:1998
Numéros des publications Numbering
Depuis le 1er janvier 1997, les publications de la CEI As from 1 January 1997 all IEC publications are
sont numérotées à partir de 60 000. issued with a designation in the 60 000 series.
Publications consolidées Consolidated publications
Les versions consolidées de certaines publications de Consolidated versions of some IEC publications
la CEI incorporant les amendements sont disponibles. including amendments are available. For example,
Par exemple, les numéros d’édition 1.0, 1.1 et 1.2 edition numbers 1.0, 1.1 and 1.2 refer, respectively, to
indiquent respectivement la publication de base, la the base publication, the base publication incor-
publication de base incorporant l’amendement 1, et porating amendment 1 and the base publication
la publication de base incorporant les amendements 1 incorporating amendments 1 and 2.
et 2.
Validité de la présente publication Validity of this publication
Le contenu technique des publications de la CEI est The technical content of IEC publications is kept under
constamment revu par la CEI afin qu'il reflète l'état constant review by the IEC, thus ensuring that the
actuel de la technique. content reflects current technology.
Des renseignements relatifs à la date de re- Information relating to the date of the reconfirmation of
confirmation de la publication sont disponibles dans the publication is available in the IEC catalogue.
le Catalogue de la CEI.
Les renseignements relatifs à des questions à l’étude et Information on the subjects under consideration and
des travaux en cours entrepris par le comité technique work in progress undertaken by the technical com-
qui a établi cette publication, ainsi que la liste des mittee which has prepared this publication, as well as
publications établies, se trouvent dans les documents the list of publications issued, is to be found at the
ci-dessous: following IEC sources:
• «Site web» de la CEI* • IEC web site*
• Catalogue des publications de la CEI • Catalogue of IEC publications
Publié annuellement et mis à jour régulièrement Published yearly with regular updates
(Catalogue en ligne)* (On-line catalogue)*
• Bulletin de la CEI • IEC Bulletin
Disponible à la fois au «site web» de la CEI* Available both at the IEC web site* and
et comme périodique imprimé as a printed periodical
Terminologie, symboles graphiques Terminology, graphical and letter
et littéraux symbols
En ce qui concerne la terminologie générale, le lecteur For general terminology, readers are referred to
se reportera à la CEI 60050: Vocabulaire Electro- IEC 60 050: International Electrotechnical Vocabulary
technique International (VEI). (IEV).
Pour les symboles graphiques, les symboles littéraux For graphical symbols, and letter symbols and signs
et les signes d'usage général approuvés par la CEI, le approved by the IEC for general use, readers are
lecteur consultera la CEI 60027: Symboles littéraux à referred to publications IEC 60027: Letter symbols to
utiliser en électrotechnique, la CEI 60417: Symboles be used in electrical technology, IEC 60417: Graphical
graphiques utilisables sur le matériel. Index, relevé et symbols for use on equipment. Index, survey and
compilation des feuilles individuelles, et la CEI 60617: compilation of the single sheets and IEC 60617:
Symboles graphiques pour schémas. Graphical symbols for diagrams.
* Voir adresse «site web» sur la page de titre. * See web site address on title page.
NORME
CEI
INTERNATIONALE
IEC
60917-1
INTERNATIONAL
Première édition
STANDARD
First edition
1998-09
Ordre modulaire pour le développement
des structures mécaniques
pour les infrastructures électroniques –
Partie 1:
Norme générique
Modular order for the development
of mechanical structures for electronic
equipment practices –
Part 1:
Generic standard
IEC 1998 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in
utilisée sous quelque forme que ce soit et par aucun any form or by any means, electronic or mechanical,
procédé, électronique ou mécanique, y compris la photo- including photocopying and microfilm, without permission in
copie et les microfilms, sans l'accord écrit de l'éditeur. writing from the publisher.
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: +41 22 919 0300 e-mail: inmail@iec.ch IEC web site http: //www.iec.ch
CODE PRIX
Commission Electrotechnique Internationale
PRICE CODE R
International Electrotechnical Commission
Pour prix, voir catalogue en vigueur
For price, see current catalogue
– 2 – 60917-1 © CEI:1998
SOMMAIRE
Pages
AVANT-PROPOS . 4
INTRODUCTION . 6
Articles
1 Domaine d'application et objet . 8
2 Références normatives . 8
3 Termes, terminologie et définitions . 10
4 Principes fondamentaux et information de base . 26
4.1 Structures pour les infrastructures . 26
4.2 Coordination dimensionnelle avec des domaines voisins . 26
4.3 Elaboration de normes pour de nouvelles infrastructures . 30
5 Détails de l'ordre modulaire . 32
5.1 Grille modulaire . 32
5.2 Pas . 34
5.3 Dimensions de coordination . 36
5.4 Illustration de l'ordre modulaire . 38
60917-1 © IEC:1998 – 3 –
CONTENTS
Page
FOREWORD . 5
INTRODUCTION . 7
Clause
1 Scope and object . 9
2 Normative references.9
3 Terms, terminology and definitions . 11
4 Fundamentals and background information. 27
4.1 Structures of electronic equipment practices. 27
4.2 Dimensional co-ordination with adjacent technical fields . 27
4.3 Preparation of standards for new equipment practices . 31
5 Modular order details. 33
5.1 Modular grid.33
5.2 Pitches.35
5.3 Co-ordination dimensions.37
5.4 Illustration of the modular order. 39
– 4 – 60917-1 © CEI:1998
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
___________
ORDRE MODULAIRE POUR LE DÉVELOPPEMENT DES STRUCTURES
MÉCANIQUES POUR LES INFRASTRUCTURES ÉLECTRONIQUES –
Partie 1: Norme générique
AVANT-PROPOS
1) La CEI (Commission Electrotechnique Internationale) est une organisation mondiale de normalisation composée
de l'ensemble des comités électrotechniques nationaux (Comités nationaux de la CEI). La CEI a pour objet de
favoriser la coopération internationale pour toutes les questions de normalisation dans les domaines de
l'électricité et de l'électronique. A cet effet, la CEI, entre autres activités, publie des Normes internationales.
Leur élaboration est confiée à des comités d'études, aux travaux desquels tout Comité national intéressé par le
sujet traité peut participer. Les organisations internationales, gouvernementales et non gouvernementales, en
liaison avec la CEI, participent également aux travaux. La CEI collabore étroitement avec l'Organisation
Internationale de Normalisation (ISO), selon des conditions fixées par accord entre les deux organisations.
2) Les décisions ou accords officiels de la CEI concernant les questions techniques, représentent, dans la mesure
du possible un accord international sur les sujets étudiés, étant donné que les Comités nationaux intéressés
sont représentés dans chaque comité d’études.
3) Les documents produits se présentent sous la forme de recommandations internationales. Ils sont publiés
comme normes, rapports techniques ou guides et agréés comme tels par les Comités nationaux.
4) Dans le but d'encourager l'unification internationale, les Comités nationaux de la CEI s'engagent à appliquer de
façon transparente, dans toute la mesure possible, les Normes internationales de la CEI dans leurs normes
nationales et régionales. Toute divergence entre la norme de la CEI et la norme nationale correspondante doit
être indiquée en termes clairs dans cette dernière.
5) La CEI n’a fixé aucune procédure concernant le marquage comme indication d’approbation et sa responsabilité
n’est pas engagée quand un matériel est déclaré conforme à l’une de ses normes.
6) L’attention est attirée sur le fait que certains des éléments de la présente Norme internationale peuvent faire
l’objet de droits de propriété intellectuelle ou de droits analogues. La CEI ne saurait être tenue pour
responsable de ne pas avoir identifié de tels droits de propriété et de ne pas avoir signalé leur existence.
La Norme internationale CEI 60917-1 a été établie par le sous-comité 48D: Structures
mécaniques pour équipement électronique, du comité d'études 48 de la CEI: Composants
électromécaniques et structures mécaniques pour équipements électroniques.
Cette norme annule et remplace la CEI 60916 (1988), la CEI 60917 (1988), son amendement 1
(1993) et la CEI 60917-0 (1989).
Le texte de cette norme est issu des documents suivants:
FDIS Rapport de vote
48D/159/FDIS 48D/177/RVD
Le rapport de vote indiqué dans le tableau ci-dessus donne toute information sur le vote ayant
abouti à l'approbation de cette norme.
60917-1 © IEC:1998 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL
STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES –
Part 1: Generic standard
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization
for Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical reports or guides and they are accepted by the National Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60917-1 has been prepared by subcommittee 48D: Mechanical
structures for electronic equipment, of IEC technical committee 48: Electromechanical
components and mechanical structures for electronic equipment.
This standard cancels and replaces IEC 60916 (1988), IEC 60917 (1988), its amendment 1
(1993) and IEC 60917-0 (1989).
The text of this standard is based on the following documents:
FDIS Report on voting
48D/159/FDIS 48D/177/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
– 6 – 60917-1 © CEI:1998
INTRODUCTION
La tendance, pour les composants électroniques et les circuits intégrés, vers une intégration
croissante et plus fonctionnelle, des exigences d'espace et de volume toujours plus serrées,
comme l'arrivée de nouvelles méthodes de fabrication, d'équipements automatiques de
fabrication, d'essai, de l'utilisation de systèmes d'ingénierie assistée par ordinateur (IAO),
offrent aux utilisateurs des avantages économiques et techniques considérables.
Afin de faire en sorte que, lorsqu'on utilise des composants récemment développés, de
nouvelles méthodes de fabrication et des systèmes d'IAO, ces avantages puissent être
totalement exploités, durant la planification, la conception, la fabrication et les essais, il est
nécessaire que les infrastructures répondent aux exigences suivantes (voir Guide 103 de la
CEI):
– arrangement des produits avec le minimum de perte d'espace et de place;
– interchangeabilité dimensionnelle des produits en tenant compte par exemple des
dimensions hors-tout, des dimensions de montage (trous de fixation, découpes, etc.);
– compatibilité dimensionnelle et détermination des interfaces des produits qui:
• sont combinés à d'autres produits, par exemple instruments de mesure, armoires,
panneaux, bâtis, etc.;
• sont utilisés dans des immeubles construits selon un ordre modulaire, par exemple pour
l'espacement des colonnes, la hauteur des pièces, des portes, etc.
L'obstacle principal provient de la nécessité fréquemment rencontrée de se servir de deux
systèmes de référence pour les dimensions (pouce-mètre) qui ne sont pas compatibles.
L'utilisation d'une interface entre les deux systèmes représente une solution qui, en fait, n'est
pas satisfaisante. La solution qui s'impose est:
– l'utilisation d'un seul système de référence pour les dimensions, et du système d'unités SI.
Les dimensions indiquées en 5.3 de cette norme ont été extraites du système I du Guide 103
de la CEI, en considération d'autres documents sur les dimensions de coordination.
60917-1 © IEC:1998 – 7 –
INTRODUCTION
The trend towards constantly increasing functional integration and ever smaller volume and
space requirements for electronic components and integrated circuits, as well as the advent of
new manufacturing methods, automatic manufacturing and testing equipment and the use of
Computer Aided Engineering (CAE) systems offer users considerable technical and economic
advantages.
In order to ensure that, when using newly developed components, manufacturing methods and
CAE systems, the advantages can be fully exploited during planning, design, manufacture and
testing, it is necessary for equipment practices to meet the following requirements (see IEC
Guide 103):
– arrangement of products with a minimum loss of area and space;
– dimensional interchangeability of products, e.g. regarding overall dimensions, mounting
dimensions (fixing holes, cut-outs, etc.);
– dimensional compatibility and determination of interface dimensions of products which:
• are combined with other products, e.g. instruments, racks, panels and cabinets, etc.;
• are used in buildings that have been built in accordance with a modular system, e.g.
column spacing, room height, door height, etc.
An obstacle arises from the use of two systems of dimensioning (inch – metre) that are not
compatible with each other. The use of an interface between both dimensioning systems
represents one way around this obstacle. The recommendation is:
– to use only one dimensioning system and to use SI units.
The dimensions given in 5.3 of this standard have been taken from system I of IEC Guide 103
in consideration with other documents on dimensional coordination.
– 8 – 60917-1 © CEI:1998
ORDRE MODULAIRE POUR LE DÉVELOPPEMENT DES STRUCTURES
MÉCANIQUES POUR LES INFRASTRUCTURES ÉLECTRONIQUES –
Partie 1: Norme générique
1 Domaine d'application et objet
Cette Norme internationale s'applique aux infrastructures électroniques. L'ordre modulaire
s'applique aux principales dimensions structurelles d'équipements électroniques dans diffé-
rentes installations où des interfaces dimensionnelles doivent être envisagées.
Elle pose les paramètres de base d'implantation et elle n'a pas pour objet d'indiquer des
tolérances ou des jeux.
Elle comprend l'addition d'informations sur les interfaces avec d'autres domaines techniques,
et sur des aspects de technologie et de conception avancées.
Elle comprend aussi les termes normalisés désignant les pièces et les ensembles de
structures mécaniques pour les équipements électroniques.
Cette norme générique donne les définitions d'un ordre modulaire pour les structures
mécaniques, pour les infrastructures électroniques et prévoit la compatibilité dimensionnelle
des interfaces mécaniques avec les applications industrielles voisines telles que circuits
imprimés, composants, instruments, mobiliers, salles, immeubles, etc.
De plus, elle soutient l'introduction et l'application des règles de l'ordre modulaire en
considérant que:
– la compatibilité des dimensions d'interface s'applique dans l'électronique sur la base du
mètre comme unité SI;
– des avantages techniques et économiques peuvent résulter de l'observation des règles.
Il convient que les termes de cette norme soient utilisés dans toutes les normes concernant les
structures mécaniques pour les équipements électroniques et tous les documents techniques
qui s'y rapportent.
2 Références normatives
Les documents normatifs suivants contiennent des dispositions qui, par suite de la référence
qui y est faite, constituent des dispositions valables pour la présente Norme internationale. Au
moment de sa publication, les éditions indiquées étaient en vigueur. Tout document normatif
est sujet à révision et les parties prenantes aux accords fondés sur la présente Norme
internationale sont invitées à rechercher la possibilité d'appliquer les éditions les plus récentes
des documents normatifs indiqués ci-après. Les membres de la CEI et de l'ISO possèdent le
registre des Normes internationales en vigueur.
CEI 60050(581):1978, Vocabulaire Electrotechnique International (VEI) – Chapitre 581:
Composants électromécaniques pour les équipements électroniques
CEI 60297-1:1986, Dimensions des structures mécaniques de la série 482,6 mm (19 in) –
Première partie: Panneaux et bâtis
CEI 60297-2:1982, Dimensions des structures mécaniques de la série 482,6 mm (19 in) –
Deuxième partie: Armoires et pas des structures
CEI 60297-3:1984, Dimensions des structures mécaniques de la série 482,6 mm (19 in) –
Troisième partie: Bacs et blocs enfichables associés
60917-1 © IEC:1998 – 9 –
MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL
STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES –
Part 1: Generic standard
1 Scope and object
This International Standard relates to equipment practices. The modular order is applicable to
the main structural dimensions of electronic equipment mounted in various installations where
dimensional interfaces have to be considered.
It refers to basic design parameters and is not intended to be used for manufacturing
tolerances or clearances.
In addition, information on interfaces to other technical fields, on technology and advanced
design aspects is included.
This standard also covers standard terms for parts and assemblies of mechanical structures
for electronic equipment.
This generic standard gives the definitions of a modular order for mechanical structures of
electronic equipment and provides for dimensional compatibility at mechanical interfaces with
related engineering applications, e.g. printed boards, components, instrumentation, furniture,
rooms, buildings, etc.
Furthermore, it supports the introduction and application of the modular order rules considering
that:
– compatibility of interface dimensions is aimed at the electronic field on the basis of the SI
unit metre;
– technical and economic advantages can be achieved when using the rules.
The terms in this standard should be used in all standards for mechanical structures of
electronic equipment and in related technical documents.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this International Standard. At the time of publication, the editions
indicated were valid. All normative documents are subject to revision, and parties to
agreements based on this International Standard are encouraged to investigate the possibility
of applying the most recent editions of the normative documents indicated below. Members of
IEC and ISO maintain registers of currently valid International Standards.
IEC 60050(581):1978, International Electrotechnical Vocabulary (IEV) – Chapter 581: Electro-
mechanical components for electronic equipment
IEC 60297-1:1986, Dimensions of mechanical structures of the 482,6 mm (19 in) series –
Part 1: Panels and racks
IEC 60297-2:1982, Dimensions of mechanical structures of the 482,6 mm (19 in) series –
Part 2: Cabinets and pitches of rack structures
IEC 60297-3:1984, Dimensions of mechanical structures of the 482,6 mm (19 in) series – Part 3:
Subracks and associated plug-in units
– 10 – 60917-1 © CEI:1998
CEI 60297-4:1995, Dimensions des structures mécaniques de la série 482,6 mm (19 in) –
Partie 4: Bacs et blocs enfichables associés – Dimensions supplémentaires
CEI 60473:1974, Dimensions pour appareils de mesure électriques indicateurs et enregistreurs
de tableau
CEI 60629:1978, Feuilles de normes pour un système modulaire (pour appareils d'installation
pour utilisation dans les installations domestiques et similaires
CEI 60668:1980, Dimensions des surfaces et des ajourages à prévoir pour les appareils de
mesure ou de commande montés en tableaux ou en tiroirs dans les processus industriels
CEI 60917-2:1992, Ordre modulaire pour le développement des structures mécaniques pour
les infrastructures électroniques – Partie 2: Spécification intermédiaire – Dimensions de
coordination pour les interfaces des infrastructures au pas de 25 mm
CEI 60917-2-1:1993, Ordre modulaire pour le développement des structures mécaniques pour
les infrastructures électroniques – Partie 2: Spécification intermédiaire – Dimensions de
coordination pour les interfaces des infrastructures au pas de 25 mm – Section 1: Spécification
particulière – Dimensions pour baies et bâtis
CEI 60917-2-2:1994, Ordre modulaire pour le développement des structures mécaniques pour
les infrastructures électroniques – Partie 2: Spécification intermédiaire – Dimensions de coordi-
nation pour les interfaces des infrastructures au pas de 25 mm – Section 2: Spécification parti-
culière – Dimensions pour bacs, châssis, fonds de paniers, faces avant et unités enfichables
CEI Guide 103:1980, Guide pour la coordination dimensionnelle
ISO 31:1992, Grandeurs et unités
ISO 1000:1992, Unités SI et recommandations pour l'emploi de leurs multiples et de certaines
autres unités
ISO 1006: 1983, Construction immobilière – Coordination modulaire – Module de base
ISO 1040:1983, Construction immobilière – Coordination modulaire – Multimodules pour
dimensions de coordination horizontale
ISO 3827-1:1977, Construction navale – Coordination dimensionnelle pour l'ameublement des
navires – Partie 1: Principes de la coordination dimensionnelle
3 Termes, terminologie et définitions
Pour les besoins de la présente Norme internationale, la terminologie de la CEI 60050(581)
ainsi que les termes et définitions suivants s'appliquent.
3.1
infrastructure
structure mécanique utilisée pour loger et monter des systèmes électriques et électroniques.
Elle assure la compatibilité entre les pièces mécaniques, les raccordements électriques et les
composants électroniques.
3.2
ordre modulaire
ensemble de règles qui établit une relation entre des dimensions de coordination et le pas de
base, les pas multiples et les pas de montage utilisés dans les infrastructures
3.3
dimension de coordination
dimension de référence utilisée pour coordonner les interfaces mécaniques. Ce n'est pas une
dimension de fabrication assortie de tolérances.
NOTE – Une dimension extérieure réelle d'une structure mécanique correspondant à une dimension de coordination
peut seulement être diminuée.
60917-1 © IEC:1998 – 11 –
IEC 60297-4:1995, Dimensions of mechanical structures of the 482,6 mm (19 in) series – Part 4:
Subracks and associated plug-in units – Additional dimensions
IEC 60473:1974, Dimensions for panel-mounted indicating and recording electrical measuring
instruments
IEC 60629:1978, Standard sheets for a modular system (for installation accessories for use in
domestic and similar installations)
IEC 60668:1980, Dimensions of panel areas and cut-outs for panel and rack-mounted
industrial-process measurement and control instruments
IEC 60917-2:1992, Modular order for the development of mechanical structures for electronic
equipment practices – Part 2: Sectional specification – Interface co-ordination dimensions for
the 25 mm equipment practice
IEC 60917-2-1:1993, Modular order for the development of mechanical structures for electronic
equipment practices – Part 2: Sectional specification – Interface co-ordination dimensions
for the 25 mm equipment practice – Section 1: Detail specification – Dimensions for cabinets
and racks
IEC 60917-2-2:1994, Modular order for the development of mechanical structures for electronic
equipment practices – Part 2: Sectional specification – Interface co-ordination dimensions for
the 25 mm equipment practice – Section 2: Detail specification – Dimensions for subracks,
chassis, backplanes, front panels and plug-in units
IEC Guide 103:1980, Guide on dimensional co-ordination
ISO 31:1992, Quantities and units
ISO 1000:1992, SI units and recommendations for the use of their multiples and of certain
other units
ISO 1006:1983, Building construction – Modular coordination – Basic module
ISO 1040:1983, Building construction – Modular coordination – Multimodules for horizontal
coordinating dimensions
ISO 3827-1:1977, Shipbuilding – Coordination of dimensions in ships' accommodation – Part 1:
Principles of dimensional coordination
3 Terms, terminology and definitions
For the purpose of this International Standard, the terminology used is in accordance with the
terminology in IEC 60050(581) and the following additional terms and definitions apply.
3.1
equipment practice
mechanical structure
...
IEC 60917-1 ®
Edition 1.1 2009-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Modular order for the development of mechanical structures for electronic
equipment practices –
Part 1: Generic standard
Ordre modulaire pour le développement des structures mécaniques pour les
infrastructures électroniques –
Partie 1: Norme générique
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IEC 60917-1 ®
Edition 1.1 2009-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Modular order for the development of mechanical structures for electronic
equipment practices –
Part 1: Generic standard
Ordre modulaire pour le développement des structures mécaniques pour les
infrastructures électroniques –
Partie 1: Norme générique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CF
CODE PRIX
ICS 31.240 ISBN 978-2-88910-329-4
– 2 – 60917-1 © IEC:1998+A1:2000
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope and object .7
2 Normative references.7
3 Terms, terminology and definitions.8
4 Fundamentals and background information .17
4.1 Structures of electronic equipment practices .17
4.2 Dimensional co-ordination with adjacent technical fields.18
4.3 Preparation of standards for new equipment practices.20
5 Modular order details .21
5.1 Modular grid .21
5.2 Pitches .22
5.3 Co-ordination dimensions .23
5.4 Illustration of the modular order .24
Figure 1 .10
Figure 2 .10
Figure 3 .11
Figure 4 .11
Figure 5 .12
Figure 6 .12
Figure 7 .12
Figure 8 .13
Figure 9 .13
Figure 10 .14
Figure 11 .14
Figure 17 .15
Figure 18 .15
Figure 19 .15
Figure 20 .15
Figure 21 .16
Figure 22 .16
Figure 23 .16
Figure 24 .17
Figure 25 .17
Figure 12 – Structure levels of electronic equipment practice.18
Figure 13 – Structure of equipment practice standards .20
Figure 14 – Modular grid .21
Figure 15 – Partitioning of co-ordination dimension C with the same mounting pitch mp .23
60917-1 © IEC:1998+A1:2000 – 3 –
Figure 16 – Examples of the application of the modular order. Pitches "p" are presented in the
frames , see 5.2.1 .24
Table 1 – Publications containing standardized modular dimensions and/or related documents
......................................................................................................................................19
Table 2 – Co-ordination dimensions C .23
i
– 4 – 60917-1 © IEC:1998+A1:2000
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL
STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES –
Part 1: Generic standard
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60917-1 has been prepared by subcommittee 48D: Mechanical
structures for electronic equipment, of IEC technical committee 48: Electromechanical
components and mechanical structures for electronic equipment.
This consolidated version of IEC 60917-1 consists of the first edition (1998) [documents
48D/159/FDIS and 48D/177/RVD] and its amendment 1 (2000) [documents 48D/222/FDIS and
48D/232/RVD].
The technical content is therefore identical to the base edition and its amendment and has
been prepared for user convenience.
It bears the edition number 1.1.
A vertical line in the margin shows where the base publication has been modified by
amendment 1.
60917-1 © IEC:1998+A1:2000 – 5 –
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date,
the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – 60917-1 © IEC:1998+A1:2000
INTRODUCTION
The trend towards constantly increasing functional integration and ever smaller volume and
space requirements for electronic components and integrated circuits, as well as the advent of
new manufacturing methods, automatic manufacturing and testing equipment and the use of
Computer Aided Engineering (CAE) systems offer users considerable technical and economic
advantages.
In order to ensure that, when using newly developed components, manufacturing methods and
CAE systems, the advantages can be fully exploited during planning, design, manufacture and
testing, it is necessary for equipment practices to meet the following requirements (see IEC
Guide 103):
– arrangement of products with a minimum loss of area and space;
– dimensional interchangeability of products, e.g. regarding overall dimensions, mounting
dimensions (fixing holes, cut-outs, etc.);
– dimensional compatibility and determination of interface dimensions of products which:
• are combined with other products, e.g. instruments, racks, panels and cabinets, etc.;
• are used in buildings that have been built in accordance with a modular system, e.g.
column spacing, room height, door height, etc.
An obstacle arises from the use of two systems of dimensioning (inch – metre) that are not
compatible with each other. The use of an interface between both dimensioning systems
represents one way around this obstacle. The recommendation is:
– to use only one dimensioning system and to use SI units.
The dimensions given in 5.3 of this standard have been taken from system I of IEC Guide 103
in consideration with other documents on dimensional coordination.
60917-1 © IEC:1998+A1:2000 – 7 –
MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL
STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES –
Part 1: Generic standard
1 Scope and object
This International Standard relates to equipment practices. The modular order is applicable to
the main structural dimensions of electronic equipment mounted in various installations where
dimensional interfaces have to be considered.
It refers to basic design parameters and is not intended to be used for manufacturing
tolerances or clearances.
In addition, information on interfaces to other technical fields, on technology and advanced
design aspects is included.
This standard also covers standard terms for parts and assemblies of mechanical structures
for electronic equipment.
This generic standard gives the definitions of a modular order for mechanical structures of
electronic equipment and provides for dimensional compatibility at mechanical interfaces with
related engineering applications, e.g. printed boards, components, instrumentation, furniture,
rooms, buildings, etc.
Furthermore, it supports the introduction and application of the modular order rules considering
that:
– compatibility of interface dimensions is aimed at the electronic field on the basis of the SI
unit metre;
– technical and economic advantages can be achieved when using the rules.
The terms in this standard should be used in all standards for mechanical structures of
electronic equipment and in related technical documents.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60050(581):1978, International Electrotechnical Vocabulary (IEV) – Chapter 581: Electro-
mechanical components for electronic equipment
IEC 60297-1:1986, Dimensions of mechanical structures of the 482,6 mm (19 in) series –
Part 1: Panels and racks
IEC 60297-2:1982, Dimensions of mechanical structures of the 482,6 mm (19 in) series –
Part 2: Cabinets and pitches of rack structures
IEC 60297-3:1984, Dimensions of mechanical structures of the 482,6 mm (19 in) series – Part 3:
Subracks and associated plug-in units
– 8 – 60917-1 © IEC:1998+A1:2000
IEC 60297-4:1995, Dimensions of mechanical structures of the 482,6 mm (19 in) series – Part 4:
Subracks and associated plug-in units – Additional dimensions
IEC 60473:1974, Dimensions for panel-mounted indicating and recording electrical measuring
instruments
IEC 60629:1978, Standard sheets for a modular system (for installation accessories for use in
domestic and similar installations)
IEC 60668:1980, Dimensions of panel areas and cut-outs for panel and rack-mounted
industrial-process measurement and control instruments
IEC 60917-2:1992, Modular order for the development of mechanical structures for electronic
equipment practices – Part 2: Sectional specification – Interface co-ordination dimensions for
the 25 mm equipment practice
IEC 60917-2-1:1993, Modular order for the development of mechanical structures for electronic
equipment practices – Part 2: Sectional specification – Interface co-ordination dimensions
for the 25 mm equipment practice – Section 1: Detail specification – Dimensions for cabinets
and racks
IEC 60917-2-2:1994, Modular order for the development of mechanical structures for electronic
equipment practices – Part 2: Sectional specification – Interface co-ordination dimensions for
the 25 mm equipment practice – Section 2: Detail specification – Dimensions for subracks,
chassis, backplanes, front panels and plug-in units
IEC Guide 103:1980, Guide on dimensional co-ordination
ISO 31:1992, Quantities and units
ISO 1000:1992, SI units and recommendations for the use of their multiples and of certain
other units
ISO 1006:1983, Building construction – Modular coordination – Basic module
ISO 1040:1983, Building construction – Modular coordination – Multimodules for horizontal
coordinating dimensions
ISO 3827-1:1977, Shipbuilding – Coordination of dimensions in ships' accommodation – Part 1:
Principles of dimensional coordination
3 Terms, terminology and definitions
For the purpose of this International Standard, the terminology used is in accordance with the
terminology in IEC 60050(581) and the following additional terms and definitions apply.
3.1
equipment practice
mechanical structure involved in housing and mounting of electronic and electromechanical
systems. It provides for compatibility between mechanical parts, electrical interconnections and
electronic components.
3.2
modular order
set of rules which establishes a relationship between co-ordination dimensions and the base
pitch, multiple pitches and mounting pitches to be used in equipment practice
3.3
co-ordination dimension
reference dimension used to co-ordinate mechanical interfaces. This is not a manufacturing
dimension with a tolerance.
NOTE An actual outside dimension of a mechanical structure related to a co-ordination dimension can only
decrease.
60917-1 © IEC:1998+A1:2000 – 9 –
3.4
aperture dimension
special co-ordination dimension for a usable space between features (structural parts)
NOTE An actual inside dimension of an aperture can only increase.
3.5
n
multiplier having integer values of range continuing 1, 2, 3, .
3.6
base pitch (p)
smallest distance between adjacent grid lines used in the equipment practices
3.7
multiple pitch (Mp)
integer multiple of the base pitch
3.8
mounting pitch (mp)
pitch used to arrange parts or assemblies in a given space
The nominal value of a mounting pitch is achieved by using a base or multiple pitch multiplied
by a factor F from table 2.
Actual dimensions used in an equipment practice are created from the nominal mounting pitch
and they include manufacturing tolerances.
3.9
reference plane
a theoretical plane without thickness or tolerances, used to define spaces
3.10
grid
two- or three-dimensional arrangement of pitches used to co-ordinate position, complying with
the modular order
3.11
module
three-dimensional structure where all sides are multiples of whole numbers of the pitch. It
could also be used in a two-dimensional grid.
NOTE One-dimensional module is often called unit (U) in some documentation.
3.12
suite of racks or cabinets
row of racks or cabinets placed side by side
– 10 – 60917-1 © IEC:1998+A1:2000
rack
free-standing or fixed structure for housing electrical or electronic equipment
IEC 1 377/98
Figure 1
cabinet
free-standing and self-supporting enclosure for housing electrical and/or electronic equipment
It is usually fitted with doors and/or side panels which may or may not be removable.
IEC 1 378/98
Figure 2
60917-1 © IEC:1998+A1:2000 – 11 –
case
table, bench or wall mounting enclosure in which electrical and/or electronic equipment can be
housed
IEC 1 379/98
Figure 3
swing frame
hinged frame for holding electrical and/or electronic equipment
The frame swings to permit access to the reverse side.
IEC 1 380/98
Figure 4
– 12 – 60917-1 © IEC:1998+A1:2000
subrack
structural unit for housing printed boards with components inserted, and plug-in units
IEC 1 381/98
Figure 5
chassis
mechanical structure designed specifically to support associated electrical and electronic
components
IEC 1 382/98
Figure 6
plug-in unit
unit which plugs into a subrack and is supported by guides. These units can be of various
types, ranging from a printed board with components inserted to a frame or box-type unit
designed with a plug-in connection.
IEC 1 383/98
Figure 7
60917-1 © IEC:1998+A1:2000 – 13 –
console
table-mounted or floorstanding enclosure having horizontal, vertical and/or sloping faces to
accommodate control, information and monitoring equipment
IEC 1 384/98
Figure 8
plug-in unit guide
device to guide, locate and support plug-in units and printed boards, with components inserted,
in subracks
IEC 1 385/98
Figure 9
– 14 – 60917-1 © IEC:1998+A1:2000
slides
angle-bars on which subracks and chassis may slide and be supported within a rack, cabinet or
case
IEC 1 386/98
Figure 10
telescopic slides
devices to support withdrawable subracks and chassis in the extended position
IEC 1 387/98
Figure 11
60917-1 © IEC:1998+A1:2000 – 15 –
Mounting
frame
Electronic/
mounting frame
electrical
in general a frame design of profiles for the devices
mounting of electronic/electrical devices.
Fixed or movable location within cabinets
IEC 533/2000
Figure 17
Mounting
mounting plate
plate
plate for the mounting of electronic/electrical devices,
Electronic/
located within e.g. cabinets
electrical
devices
IEC 534/2000
Figure 18
front panel
in general allocated to the vertical mounting
Front
area of racks and cabinets
panel
IEC 535/2000
Figure 19
backplane Backplane
mounting plane of connectors and printed
board for the electrical interconnection
Connector
IEC 536/2000
Figure 20
– 16 – 60917-1 © IEC:1998+A1:2000
cabinet panel
design part of a cabinet as protection
Cabinet
against incident touch and environmental
influences
Cabinet
panel
IEC 537/2000
Figure 21
door
hinged cabinet panel, typically incorporating
latching and/or locking devices Cabinet
Door
IEC 538/2000
Figure 22
Enclosure
mounting section
compartment of an enclosure for the
assembly of interior parts
Mounting
section
IEC 539/2000
Figure 23
60917-1 © IEC:1998+A1:2000 – 17 –
pitch
one division step of a regular subdivided
coordinate
IEC 540/2000
Figure 24
grid
right angular arrangement of theoretical
lines of equal dimensions
IEC 541/2000
Figure 25
4 Fundamentals and background information
The basis of the modular order is the basic SI unit of length, the metre according to ISO 1000
and to ISO 31-1.
For compatibility with other modular orders see IEC 60473, IEC 60629 and IEC 60668 and
ISO 1006, ISO 1040 and ISO 3827-1.
4.1 Structures of electronic equipment practices
In Figure 12, the four structure levels of presently known electronic equipment practices are
outlined.
It should be understood that the modular order not only covers this kind of structure, but also
any other structure of new electronic equipment practice designs where a modular grid with
metric pitches and co-ordination dimensions can be allocated.
– 18 – 60917-1 © IEC:1998+A1:2000
IEC 1 388/98
Figure 12 – Structure levels of electronic equipment practice
4.2 Dimensional co-ordination with adjacent technical fields
Developing a new electronic practice requires the consideration of external and internal
interfaces.
The most important interfaces to electronic equipment practice are:
External interfaces
– buildings with their room facilities, for example doors, elevators, tiles on floor and ceiling,
etc.;
– packaging and transport, for example pallets and containers for lorries, ships and aircraft;
– joint installation of various equipment, for example switching and transmission, power
supply, industrial process equipment, etc.
Internal interfaces
– printed circuits, connectors, electromechanical components;
– semiconductor components;
– wiring and cables;
– functional units such as a.c./d.c. converter, measure and control instruments, fuses, etc.
Many of these interfaces have to be considered when specifying the requirements of any
equipment practice for electronic systems. For such interfaces co-ordination dimensions should
be used as means to reach dimensional compatibility with adjacent technical fields.
Table 1 gives an overview of ISO and IEC publications that should be considered when
relevant co-ordination dimensions for common interfaces have to be determined.
60917-1 © IEC:1998+A1:2000 – 19 –
Table 1 – Publications containing standardized modular dimensions
and/or related documents
Co-ordination
Publication Title dimensions
mm
ISO 2848 Building construction – Modular co-ordination – Principles and rules ----
(1984)
ISO 1791 Building construction – Modular co-ordination – Vocabulary (1983) -----
ISO 1006 Building construction – Modular co-ordination – Basic module (1983) 100
ISO 6514 Building construction – Modular co-ordination – Sub-modular 20; 25; 50
increments (1982)
ISO 1040 Building construction – Modular co-ordination – Multimodules for 300; 600; 1 200;
horizontal co-ordinating dimensions (1983) 1 500; 3 000; 6 000
ISO 3394 Dimensions for rigid rectangular packages – Transport packages 600 × 400 .
(1984)
1 200 × 800 .
ISO 3676 Packaging – Unit load sizes – Dimensions (1983) 1 200 × 800 .
ISO 3827-1 Shipbuilding – Co-ordination of dimensions in ships' accommodation – 50; 100; 300
Part 1: Principles of dimensional co-ordination (1977)
IEC Guide 103 Guide on dimensional co-ordination (1980) 0,5; 1; 2,5
(system I)
IEC 60097 Grid systems for printed circuits (1991) 0,05; 0,5
IEC 60255-18 Electrical relays – Part 18: Dimensions for general purpose 2,5 and 5
all-or-nothing relays (1982)
IEC 60629 Standard sheets for a modular system (for installation accessories 12,5
for use in domestic and similar installations) (1978)
IEC 60473 Dimensions for panel-mounted indicating and recording electrical 12,5
measuring instruments (1974)
IEC 60668 Dimensions of panel areas and cut-outs for panel and rack-mounted 12,5
industrial-process measurement and control instruments (1980)
IEC 60297-2 Dimensions of mechanical structures of the 482,6 mm (19 in) series – 100
Part 2: Cabinets and pitches of rack structures (1982)
– 20 – 60917-1 © IEC:1998+A1:2000
4.3 Preparation of standards for new equipment practices
IEC standards for equipment practices to be prepared in accordance with this standard should
be based on the following structure (see Figure 13).
Generic standard
All new equipment practices should comply with this standard.
Sectional standards
They describe particular equipment practices within the scope of the generic standard. In a
sectional standard, co-ordination dimensions (selected from the generic standard) shall be
specified as standard dimensions, for example for height, width, depth, and so on. There may
be more than one sectional standard based on different multiple pitches.
Detail standards
They standardize a unit or a subunit of equipment practice described in a sectional standard.
These units could be such as cabinets, racks, subracks, chassis, backplanes, front panels and
plug-in units, etc., and the details can be dimensions, tolerances, requirements, etc. under the
condition that mechanical compatibility is maintained.
IEC 60917-1
Generic standard
Modular order for
the development of
mechanical structures
IEC 60917-2 IEC 60917-Y IEC 6XXXX-1
Sectional standard Sectional standard Sectional standard
Interface co-ordination Further sectional standards Environmental properties
dimensions for 25 mm as necessary for equipment practices
equipment practice
IEC 60917-2-1 IEC 60917-Y-1 Detail IEC 60297-1
Detail standard standard Detail standard
Dimensions for cabinets Further detail standards 482,6 mm (19 in) series
and racks as necessary Panels and racks
IEC 60917-2-2 IEC 60297-2
Detail standard Detail standard
Dimensions for subracks, 482,6 mm (19 in) series
chassis, etc., and Cabinets and pitches
plug-in units of rack structures
IEC 60917-2-Z IEC 60297-3
Detail standard Detail standard
Further detail standards 482,6 mm (19 in) series
as necessary Subracks and associated
plug-in units
IEC 60297-4
Detail standard
482,6 mm (19 in) series
Subracks and associated
plug-in units – Additional
dimensions
IEC 60297-Y
Detail standard
Further detail standards
as necessary
IEC 1 389/98
Figure 13 – Structure of equipment practice standards
60917-1 © IEC:1998+A1:2000 – 21 –
5 Modular order details
5.1 Modular grid
The correlation between the base pitch and the multiple pitches is explained in Figure 14 which
shows the three-dimensional modular grid for equipment practices. Sometimes only a two-
dimensional grid or a pitch in one axis is needed. The values of the pitches are specified in 5.2.
The choice of pitch is dependent on the size of the mechanical structure as outlined in the
following subclauses.
IEC 1 390/98
Figure 14 – Modular grid
– 22 – 60917-1 © IEC:1998+A1:2000
5.2 Pitches
5.2.1 Base and multiple pitches for equipment practice
Base pitch: a value of 0,5 mm shall be used. It shall not be further subdivided.
Multiple pitches: the values 2,5 mm and 25 mm have been used in Figure 14 to create the
coordination dimensions in table 1. According to the rules of the modular order other values for
Mp are allowed, for example 2,0 mm and 20 mm.
NOTE In IEC 60097, a value of 0,05 mm has been used.
5.2.2 Mounting pitches example
The relations between mounting pitches mp , the pitches p (base or multiple) and co-ordination
i
dimensions C are shown in Figure 15. Mounting pitches shall fulfil the following conditions:
i
= F × p
mp
i
where
mp is the nominal value of mounting pitch;
i
p is the pitch (base or multiple as applicable);
F is the factor from table 2.
C
i
mp =
i
n
i
where
n is an integer;
i
C is the co-ordination dimension from table 2.
i
C = n × mp
i i i
C = C + C + C + .
0 1 2 3
where
C is the overall co-ordination dimension.
In the example of Figure 15, the overall co-ordination dimension C contains four co-ordination
dimensions C , C , C and C and only one mp with the conditions (all dimensions in
1 2 3 4
millimetres).
mp = F × p = 2 × 25 = 50
C = C + C + C + C
0 1 2 3 4
= n × mp + n × mp + n × mp + n × mp
1 2 3 4
= 2 × 50 + 3 × 50 + 5 × 50 + 6 × 50
= 100 + 150 + 250 + 300
= 800
The mounting pitch mp as well as the co-ordination dimensions C shall coincide with the
i i
values in table 2. Dimensions C may have equal or different values.
i
60917-1 © IEC:1998+A1:2000 – 23 –
IEC 1 391/98
Dimensions in millimetres
Figure 15 – Partitioning of co-ordination dimension C with the same mounting pitch mp
5.3 Co-ordination dimensions
Preferred co-ordination dimensions C for mechanical structures of equipment practices are
i
listed in table 2. The dimensions are mainly taken from table I.1 of IEC Guide 103.
Table 2 – Co-ordination dimensions C
i
Co-ordination dimensions C
i
mm
C = p × F
i
Base pitch Multiple pitches Factor F
p = 0,5 mm p = 2,5 mm p = 25 mm
40,0 200 2 000 80
36,0 180 1 800 72
32,0 160 1 600 64
30,0 150 1 500 60
25,0 125 ----- 50
24,0 120 1 200 48
20,0 100 1 000 40
16,0 80,0 800 32
15,0 75,0 ----- 30
12,5 ----- ----- 25
12,0 60,0 600 24
10,0 50,0 500 20
8,0 40,0 400 16
7,5 ----- ----- 15
6,0 30,0 300 12
5,0 25,0 250 10
4,0 20,0 200 8
3,0 15,0 150 6
2,5 12,5 125 5
2,0 10,0 100 4
1,5 7,5 75 3
1,0 5,0 50 2
0,5 2,5 25 1
NOTE The series C = 25 × F could be extended to cover greater values,
i
e.g. 2 200 mm, 2 400 mm if necessary.
– 24 – 60917-1 © IEC:1998+A1:2000
Examples of the application of co-ordination dimensions:
– outside dimensions of racks, cabinets, cases, etc.;
– mounting spaces for assemblies, sub-assemblies and piece parts, wiring, cabling, etc.;
– mounting pitches of piece parts and assemblies.
5.4 Illustration of the modular order
Figure 16 illustrates the application of the modular order for electronic equipment practices.
IEC 1 392/98
Figure 16 – Examples of the application of the modular order.
Pitches "p" are presented in the frames , see 5.2.1
___________
– 26 – 60917-1 © CEI:1998+A1:2000
SOMMAIRE
AVANT-PROPOS .28
INTRODUCTION.30
1 Domaine d'application et objet .31
2 Références normatives .31
3 Termes, terminologie et définitions.32
4 Principes fondamentaux et information de base .41
4.1 Structures pour les infrastructures .41
4.2 Coordination dimensionnelle avec des domaines voisins .42
4.3 Elaboration de normes pour de nouvelles infrastructures.44
5 Détails de l'ordre modulaire .45
5.1 Grille modulaire .45
5.2 Pas .46
5.3 Dimensions de coordination .47
5.4 Illustration de l'ordre modulaire .48
Figure 1 .34
Figure 2 .34
Figure 3 .35
Figure 4 .35
Figure 5 .36
Figure 6 .36
Figure 7 .36
Figure 8 .37
Figure 9 .37
Figure 10 .38
Figure 11 .38
Figure 17 .39
Figure 18 .39
Figure 19 .39
Figure 20 .39
Figure 21 .40
Figure 22 .40
Figure 23 .40
Figure 24 .41
Figure 25 .41
Figure 12 – Niveaux de structure des infrastructures .42
Figure 13 – Architecture des normes des infrastructures.44
Figure 14 – Grille modulaire .45
Figure 15 – Partition d'une dimension hors-tout de coordination à l'aide d'un pas de
montage constant mp.47
60917-1 © CEI:1998+A1:2000 – 27 –
Figure 16 – Exemples de l'application de l'ordre modulaire. Les pas «p»
sont encadrés , voir
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