IEC 60917-1:2019
(Main)Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard
Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard
IEC 60917-1:2019 specifies the relationships between equipment practices and the modular order which are applicable to the main structural dimensions of electronic and electrical equipment mounted in various installations where dimensional interfaces have to be considered for mechanical compatibility. This document also established terms for parts and assemblies of mechanical structures for electrical and electronic equipment, to clarify the specific relations between equipment practices and modular order. This second edition cancels and replaces the first edition published in 1998 and its Amendment 1:2000. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) added information on newly developed detail specification standards of mechanical structures for the electrical and electronic equipment practices;
b) added information on newly developed performance test standards for the verifications of environmental performances and safety aspects and issues of the thermal performance and thermal management for the electrical and electronic equipment practices;
c) introduced the relations between the mechanical structure for electrical and electronic system, the verification of environmental performance and safety aspects and issues of the thermal performance and thermal management for the electrical and electronic equipment practices.
Key words: IT Cabinets, Mechanical Structures
Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électriques et électroniques - Partie 1: Norme générique
L'IEC 60917-1:2019 spécifie les relations entre les infrastructures et l’ordre modulaire qui sont applicables aux dimensions structurelles principales de l’équipement électronique et électrique monté au sein de diverses installations où des interfaces dimensionnelles doivent être considérées pour une compatibilité mécanique. Le présent document établit également les termes pour les composants et les ensembles des structures mécaniques pour l’équipement électrique et électronique, afin de clarifier les relations spécifiques entre les infrastructures et l’ordre modulaire. Cette deuxième édition annule et remplace la première édition publiée en 1998, ainsi que son Amendement 1:2000. Cette édition constitue une révision technique. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) informations ajoutées sur les nouvelles normes de spécification particulière de structures mécaniques pour les infrastructures électroniques et électriques;
b) informations ajoutées sur les nouvelles normes d’essai de performances destinées à la vérification des performances environnementales, les aspects de la sécurité et le sujet des performances thermiques et de la gestion thermique pour les infrastructures électroniques et électriques;
c) introduction des relations entre la structure mécanique pour les systèmes électriques et électroniques, la vérification des performances environnementales, les aspects de la sécurité et le sujet des performances thermiques et de la gestion thermique pour les infrastructures électroniques et électriques.
Mots-clés: Baies, Structures mécaniques
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IEC 60917-1 ®
Edition 2.0 2019-09
REDLINE VERSION
INTERNATIONAL
STANDARD
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inside
Modular order for the development of mechanical structures for electrical and
electronic equipment practices –
Part 1: Generic standard
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
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IEC 60917-1 ®
Edition 2.0 2019-09
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Modular order for the development of mechanical structures for electrical and
electronic equipment practices –
Part 1: Generic standard
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.240 ISBN 978-2-8322-7416-3
– 2 – IEC 60917-1:2019 RLV © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope and object . 8
2 Normative references . 8
3 Terms, terminology and definitions . 11
4 Fundamentals and background information . 22
4.1 General . 22
4.2 Structures of electrical and electronic equipment practices . 22
4.3 Dimensional co-ordination with adjacent technical fields . 23
4.4 Preparation of standards for new equipment practices . 25
5 Modular order details . 28
5.1 Modular grid . 28
5.2 Pitches . 28
5.2.1 Base and multiple pitches for equipment practice . 28
5.2.2 Mounting pitches example . 29
5.3 Co-ordination dimensions . 30
5.4 Illustration of the modular order . 31
Figure 1 – Pitch . 12
Figure 2 – Grid. 13
Figure 3 – Rack . 14
Figure 4 – Cabinet . 14
Figure 5 – Case . 15
Figure 6 – Swing frame . 15
Figure 7 – Subrack . 16
Figure 8 – Chassis . 16
Figure 9 – Plug-in unit. 17
Figure 10 – Console. 17
Figure 11 – Plug-in unit guide . 18
Figure 12 – Slides . 18
Figure 13 – Telescopic slides . 19
Figure 14 – Mounting frame . 19
Figure 15 – Mounting plate . 20
Figure 16 – Front panel . 20
Figure 17 – Backplane . 20
Figure 18 – Cabinet panel . 21
Figure 19 – Door . 21
Figure 20 – Mounting section . 22
Figure 21 – Structures levels of electrical and electronic equipment practices. 23
Figure 22 – Structure of equipment practice standards . 27
Figure 23 – Modular grid . 28
Figure 24 – Partitioning of co-ordination dimensions C with the same mounting pitch mp . 30
Figure 25 – Examples of the application of the modular order . 32
Table 1 – Publications containing standardized modular dimensions and/or related
documents . 24
Table 2 – Co-ordination dimensions C . 30
i
– 4 – IEC 60917-1:2019 RLV © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MODULAR ORDER FOR THE DEVELOPMENT
OF MECHANICAL STRUCTURES FOR ELECTRICAL
AND ELECTRONIC EQUIPMENT PRACTICES –
Part 1: Generic standard
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
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indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition. A vertical bar appears in the margin wherever a change has
been made. Additions are in green text, deletions are in strikethrough red text.
International Standard IEC 60917-1 has been prepared by subcommittee 48D: Mechanical
structures for electrical and electronic equipment, of IEC technical committee 48: Electrical
connectors and mechanical structures for electrical and electronic equipment.
This second edition cancels and replaces the first edition published in 1998 and its Amendment
1:2000. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) added information on newly developed detail specification standards of mechanical
structures for the electrical and electronic equipment practices;
b) added information on newly developed performance test standards for the verifications of
environmental performances and safety aspects and issues of the thermal performance and
thermal management for the electrical and electronic equipment practices;
c) introduced the relations between the mechanical structure for electrical and electronic
system, the verification of environmental performance and safety aspects and issues of the
thermal performance and thermal management for the electrical and electronic equipment
practices.
The text of this standard is based on the following documents:
FDIS Report on voting
48D/703/FDIS 48D/708/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
A list of all parts in the IEC 60917 series, published under the general title Modular order for
...
IEC 60917-1 ®
Edition 2.0 2019-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Modular order for the development of mechanical structures for electrical and
electronic equipment practices –
Part 1: Generic standard
Ordre modulaire pour le développement des structures mécaniques pour les
infrastructures électriques et électroniques –
Partie 1: Norme générique
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et
les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
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les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.
IEC Central Office Tel.: +41 22 919 02 11
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CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and once 67 000 electrotechnical terminology entries in English and
a month by email. French extracted from the Terms and Definitions clause of IEC
publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or need CISPR.
further assistance, please contact the Customer Service
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IEC 60917-1 ®
Edition 2.0 2019-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Modular order for the development of mechanical structures for electrical and
electronic equipment practices –
Part 1: Generic standard
Ordre modulaire pour le développement des structures mécaniques pour les
infrastructures électriques et électroniques –
Partie 1: Norme générique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.240 ISBN 978-2-8322-7164-3
– 2 – IEC 60917-1:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 9
4 Fundamentals and background information . 19
4.1 General . 19
4.2 Structures of electrical and electronic equipment practices . 20
4.3 Dimensional co-ordination with adjacent technical fields . 20
4.4 Preparation of standards for new equipment practices . 21
5 Modular order details . 24
5.1 Modular grid . 24
5.2 Pitches . 24
5.2.1 Base and multiple pitches for equipment practice . 24
5.2.2 Mounting pitches example . 25
5.3 Co-ordination dimensions . 26
5.4 Illustration of the modular order . 27
Figure 1 – Pitch . 10
Figure 2 – Grid. 11
Figure 3 – Rack . 12
Figure 4 – Cabinet . 12
Figure 5 – Case . 13
Figure 6 – Swing frame . 13
Figure 7 – Subrack . 14
Figure 8 – Chassis . 14
Figure 9 – Plug-in unit. 15
Figure 10 – Console. 15
Figure 11 – Plug-in unit guide . 15
Figure 12 – Slides . 16
Figure 13 – Telescopic slides . 16
Figure 14 – Mounting frame . 17
Figure 15 – Mounting plate . 17
Figure 16 – Front panel . 17
Figure 17 – Backplane . 18
Figure 18 – Cabinet panel . 18
Figure 19 – Door . 19
Figure 20 – Mounting section . 19
Figure 21 – Structures of electrical and electronic equipment practices . 20
Figure 22 – Structure of equipment practice standards . 23
Figure 23 – Modular grid . 24
Figure 24 – Partitioning of co-ordination dimensions C with the same mounting pitch mp . 26
Figure 25 – Examples of the application of the modular order . 28
Table 1 – Publications containing standardized modular dimensions and/or related
documents . 21
Table 2 – Co-ordination dimensions C . 26
i
– 4 – IEC 60917-1:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MODULAR ORDER FOR THE DEVELOPMENT
OF MECHANICAL STRUCTURES FOR ELECTRICAL
AND ELECTRONIC EQUIPMENT PRACTICES –
Part 1: Generic standard
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees fo
...
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