IEC 61190-1-3:2007
(Main)Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.
Matériaux de fixation pour les assemblages électroniques - Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et non fluxées pour les applications de brasage électronique
La CEI 61190-1-3:2007 prescrit les exigences et méthodes d'essai pour les alliages à braser de catégorie électronique, les brasures en baguette, en ruban et en poudre fluxées et non fluxées, et les pâtes à braser, pour les applications de brasage électronique et pour les brasures de catégorie électronique "spéciales". Pour les spécifications génériques relatives aux alliages et aux flux à braser, voir l'ISO 9453, l'ISO 9454-1 et l'ISO 9454-2. La présente norme est un document de contrôle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication. Les modifications principales par rapport à la première édition concernent une définition de l'alliage à braser sans plomb et un amendement au Tableau B.1 concernant les alliages à braser sans plomb.
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INTERNATIONAL IEC
STANDARD 61190-1-3
Second edition
2007-04
Attachment materials for electronic assembly –
Part 1-3:
Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications
Reference number
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.
IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: inmail@iec.ch
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: www.iec.ch/online_news/justpub
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INTERNATIONAL IEC
STANDARD 61190-1-3
Second edition
2007-04
Attachment materials for electronic assembly –
Part 1-3:
Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications
PRICE CODE
Commission Electrotechnique Internationale V
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – 61190-1-3 © IEC:2007(E)
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references.6
3 Terms and definitions .6
4 Classification .8
4.1 Alloy composition.8
4.2 Solder form .8
4.3 Flux type .9
4.4 Flux percentage and metal content .10
4.5 Other characteristics.11
5 Requirements .11
5.1 Materials .11
5.2 Alloys .11
5.3 Solder forms.12
5.4 Flux type and form.13
5.5 Flux residue dryness.14
5.6 Spitting.14
5.7 Solder pool .14
5.8 Labelling for product identification.14
5.9 Workmanship .14
6 Quality assurance provisions.15
6.1 Responsibility for inspection and compliance.15
6.2 Classification of inspections.15
6.3 Materials inspection.20
6.4 Qualification inspections .20
6.5 Quality conformance.21
6.6 Preparation of solder alloy for test.21
7 Preparation for delivery – Preservation, packing and packaging.21
Annex A (informative) Selection of various alloys and fluxes for use in electronic
soldering – General information concerning IEC 61190-1-3.22
Annex B (normative) Lead-free solder alloys.26
Figure 1 – Report form for solder alloy tests .16
Figure 2 – Report form for solder powder tests .17
Figure 3 – Report form for non-fluxed solder tests .18
Figure 4 – Report form for fluxed wire/ribbon solder tests .19
Table 1 – Solder materials.8
Table 2 – Flux types and designating symbols .10
Table 3 – Flux percentage.11
Table 4 – Standard solder powders .13
61190-1-3 © IEC:2007(E) – 3 –
Table 5 – Solder inspections .20
a, b
Table B.1 – Composition, and temperature characteristics of lead-free solder alloys .26
a, b
Table B.2 – Composition and temperature characteristics of common tin-lead alloys .28
Table B.3 – Composition and temperature characteristics for specialty (non-tin/lead)
a,b
alloys .30
Table B.4 – Cross reference from solidus and liquidus temperatures to alloy names by
a
temperature .31
Table B.5 – Cross-reference from ISO 9453 alloy numbers and designations to
IEC 61190-1-3 alloy names .34
– 4 – 61190-1-3 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-3: Requirements for electronic grade solder alloys and
fluxed and non-fluxed solid solders for electronic soldering applications
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed that compliance
with this document may involve the use of a patent concerning in particular alloy compositions. IEC takes no
position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences under reasonable and
non-discriminatory terms and conditions with applicants throughout the world. In this respect, the statement of the
holder of this patent right is registered with IEC. Information may be obtained from:
For Sn96Ag2,5Bi1Cu,5:
US PAT No. 4879096
Cookson Electronics Assembly Materials
600 Route 440 Jersey City,New Jersey 07304
For Sn96,5Ag3Cu,5, Sn95,8Ag3,5Cu,7 and Sn95,5Ag3,8Cu,7:
US PAT No. 5527628
Iowa State University Research Foundation, Inc.
310 Lab of Mechanics
Ames, Iowa 50011-2131, U.S.A.
61190-1-3 © IEC:2007(E) – 5 –
For Sn88In8Ag3,5Bi,5:
JP PAT No. 3040929
For Sn96,5Ag3Cu,5, Sn95,8Ag3,5Cu,7 and Sn95,5Ag3,8Cu,7:
JP PAT No. 3027441
Matsushita Electric Industrial Co., Ltd.
Matsushita IMP Building 20F 1-3-7, Shiromi, Chouh-ku, Osaka, 540-6319, Japan
For Sn92In4Ag3,5Bi,5
JP PAT No. 2805595
Mitsui Mining & Smelting Co., Ltd.
Gate City Ohsaki-West Tower 19th Fl. 1-11-1 Osaki, Shinagawa-ku, Tokyo, 141-8584, Japan
For Sn96,5Ag3Cu,5, Sn95,8Ag3,5Cu,7, Sn95,5Ag3,8Cu,7 and Sn95,5Ag4,0Cu,5
JP PAT No. 3027441
Senju Metal Industry Co., Ltd.
Senju Hashido-cho 23, Adachi-ku, Tokyo, 120-8555, Japan
NOTE Patent rights vary between country of manufacture, sale, use and final destination; suppliers or users
remain responsible for establishing the exact legal position relevant to their own situation.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights
other than those identified above. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 2002, and constitutes a
technical revision. The main changes with regard to the first edition concern a definition of
lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.
The text of this standard is based on the following documents:
FDIS Report on voting
91/647/FDIS 91/679/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance
...
IEC 61190-1-3
Edition 2.0 2007-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solders for electronic soldering applications
Matériaux de fixation pour les assemblages électroniques –
Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et
brasures solides fluxées et non fluxées pour les applications de brasage
électronique
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.
Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.
IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: inmail@iec.ch
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
ƒ Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
ƒ Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
Email: csc@iec.ch
Tel.: +41 22 919 02 11
Fax: +41 22 919 03 00
A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.
A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.
ƒ Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm
Le Catalogue en-ligne de la CEI vous permet d’effectuer des recherches en utilisant différents critères (numéro de référence,
texte, comité d’études,…). Il donne aussi des informations sur les projets et les publications retirées ou remplacées.
ƒ Just Published CEI: www.iec.ch/online_news/justpub
Restez informé sur les nouvelles publications de la CEI. Just Published détaille deux fois par mois les nouvelles
publications parues. Disponible en-ligne et aussi par email.
ƒ Electropedia: www.electropedia.org
Le premier dictionnaire en ligne au monde de termes électroniques et électriques. Il contient plus de 20 000 termes et
définitions en anglais et en français, ainsi que les termes équivalents dans les langues additionnelles. Egalement appelé
Vocabulaire Electrotechnique International en ligne.
ƒ Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm
Si vous désirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du
Service clients ou contactez-nous:
Email: csc@iec.ch
Tél.: +41 22 919 02 11
Fax: +41 22 919 03 00
IEC 61190-1-3
Edition 2.0 2007-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solders for electronic soldering applications
Matériaux de fixation pour les assemblages électroniques –
Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et
brasures solides fluxées et non fluxées pour les applications de brasage
électronique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
W
CODE PRIX
ICS 31.190 ISBN 2-8318-9838-2
– 2 – 61190-1-3 © IEC:2007
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references.6
3 Terms and definitions .7
4 Classification .8
4.1 Alloy composition.8
4.2 Solder form .9
4.3 Flux type .9
4.4 Flux percentage and metal content .10
4.5 Other characteristics.11
5 Requirements .11
5.1 Materials .11
5.2 Alloys .11
5.3 Solder forms.12
5.4 Flux type and form.13
5.5 Flux residue dryness.14
5.6 Spitting.14
5.7 Solder pool .14
5.8 Labelling for product identification.14
5.9 Workmanship .14
6 Quality assurance provisions.15
6.1 Responsibility for inspection and compliance.15
6.2 Classification of inspections.15
6.3 Materials inspection.20
6.4 Qualification inspections .20
6.5 Quality conformance.20
6.6 Preparation of solder alloy for test.21
7 Preparation for delivery – Preservation, packing and packaging.21
Annex A (informative) Selection of various alloys and fluxes for use in electronic
soldering – General information concerning IEC 61190-1-3.22
Annex B (normative) Lead-free solder alloys.26
Figure 1 – Report form for solder alloy tests .16
Figure 2 – Report form for solder powder tests .17
Figure 3 – Report form for non-fluxed solder tests .18
Figure 4 – Report form for fluxed wire/ribbon solder tests .19
Table 1 – Solder materials.9
Table 2 – Flux types and designating symbols .10
Table 3 – Flux percentage.11
Table 4 – Standard solder powders .13
Table 5 – Solder inspections .20
a,b
Table B.1 – Composition and temperature characteristics of lead-free solder alloys .26
a,b
Table B.2 – Composition and temperature characteristics of common tin-lead alloys .28
61190-1-3 © IEC:2007 – 3 –
Table B.3 – Composition and temperature characteristics for specialty (non-tin/lead)
a,b
alloys .30
Table B.4 – Cross reference from solidus and liquidus temperatures to alloy names by
a
temperature .31
Table B.5 – Cross-reference from ISO 9453 alloy numbers and designations to
IEC 61190-1-3 alloy names .34
– 4 – 61190-1-3 © IEC:2007
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-3: Requirements for electronic grade solder alloys and
fluxed and non-fluxed solid solders for electronic soldering applications
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use
...
IEC 61190-1-3 ®
Edition 2.1 2010-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solders for electronic soldering applications
Matériaux de fixation pour les assemblages électroniques –
Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et
brasures solides fluxées et non fluxées pour les applications de brasage
électronique
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.
Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.
IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: inmail@iec.ch
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
§ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
§ IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
§ Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
§ Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
Email: csc@iec.ch
Tel.: +41 22 919 02 11
Fax: +41 22 919 03 00
A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.
A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.
§ Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm
Le Catalogue en-ligne de la CEI vous permet d’effectuer des recherches en utilisant différents critères (numéro de référence,
texte, comité d’études,…). Il donne aussi des informations sur les projets et les publications retirées ou remplacées.
§ Just Published CEI: www.iec.ch/online_news/justpub
Restez informé sur les nouvelles publications de la CEI. Just Published détaille deux fois par mois les nouvelles
publications parues. Disponible en-ligne et aussi par email.
§ Electropedia: www.electropedia.org
Le premier dictionnaire en ligne au monde de termes électroniques et électriques. Il contient plus de 20 000 termes et
définitions en anglais et en français, ainsi que les termes équivalents dans les langues additionnelles. Egalement appelé
Vocabulaire Electrotechnique International en ligne.
§ Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm
Si vous désirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du
Service clients ou contactez-nous:
Email: csc@iec.ch
Tél.: +41 22 919 02 11
Fax: +41 22 919 03 00
IEC 61190-1-3 ®
Edition 2.1 2010-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solders for electronic soldering applications
Matériaux de fixation pour les assemblages électroniques –
Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et
brasures solides fluxées et non fluxées pour les applications de brasage
électronique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CN
CODE PRIX
ICS 31.190 ISBN 978-2-88912-192-2
– 2 – 61190-1-3 ã IEC:2007+A1:2010
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normativ e references . 7
3 Terms and definitions . 8
4 Classif ication . 9
4.1 Alloy composition . 9
4.2 Solder form . 10
4.3 Flux type. 10
4.4 Flux percentage and metal content . 11
4.5 Other characteristics . 12
5 Requirements . 12
5.1 Materials . 12
5.2 Alloys . 12
5.3 Solder forms . 13
5.4 Flux type and form . 14
5.5 Flux residue dryness . 15
5.6 Spitting . 15
5.7 Solder pool . 15
5.8 Labelling for product identification . 15
5.9 W orkmanship . 16
6 Quality assurance provisions . 16
6.1 Responsibility for inspection and compliance . 16
6.2 Classification of inspections . 16
6.3 Materials inspection . 21
6.4 Qualification inspections . 21
6.5 Quality conformance . 21
6.6 Preparation of solder alloy for test . 22
7 Preparation for delivery – Preservation, packing and packaging . 22
Annex A (informative) Selection of various alloys and fluxes for use in electronic
soldering – General information concerning IEC 61190-1-3 . 23
Annex B (normative) Lead-free solder alloys . 27
Annex C (informative) Marking method of solder designation for mounted board,
used in electronic equipment . 40
Figure 1 – Report form for solder alloy tests . 17
Figure 2 – Report form for solder powder tests . 18
Figure 3 – Report form for non-fluxed solder tests . 19
Figure 4 – Report form for fluxed wire/ribbon solder tests . 20
Figure C.1 – Example of the marking for assembled board . 41
61190-1-3 ã IEC:2007+A1:2010 – 3 –
Table 1 – Solder materials . 10
Table 2 – Flux types and designating symbols . 11
Table 3 – Flux percentage . 12
Table 4 – Standard solder powders . 14
Table 5 – Solder inspections . 21
a,b
Table B.1 – Composition and temperature characteristics of lead-free solder alloys . 27
a,b
Table B.2 – Composition and temperature characteristics of common tin-lead alloys . 31
Table B.3 – Composition and temperature characteristics for specialty (non-tin/lead)
a,b
alloys . 33
Table B.4 – Cross reference from solidus and liquidus temperatures to alloy names
a
by temperature . 34
Table B.5 – Cross-reference from ISO 9453 alloy numbers and designations to
IEC 61190-1-3 alloy names . 38
– 4 – 61190-1-3 ã IEC:2007+A1:2010
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –
Part 1-3: Requirements for electronic grade solder alloys and
fluxed and non-fluxed solid solders for electronic soldering applications
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