Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
- scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title;
- ball pitch of 0,3 mm has been added;
- datum is changed from the body datum to the ball datum;
- combination lists of D, E, MD, and ME have been revised.

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-12: Règles générales pour la préparation des dessins d'encombrement des boîtiers des dispositifs à semiconducteurs à montage en surface - Lignes directrices de conception pour les boîtiers matriciels à plots et à pas fins (FLGA)

La CEI 60191-6-12:2011 fournit les dessins d'encombrement, les dimensions, et les variations recommandées, normalisés pour tous les boîtiers matriciels à plots et à pas fins (FLGA: Fine-Pitch Ball Grid Array Package) comportant des pas de bornes inférieurs ou égaux à 0,8 mm. La présente édition inclut les modifications significatives suivantes par rapport à l'édition antérieure:
- le domaine d'application est étendu afin que la présente norme couvre aussi les FLGA de type carré. Le titre de la norme a été modifié en conséquence. "Type rectangulaire" a été supprimé du titre;
- le pas de bille de 0,3 mm a été ajouté;
- la référence passe de "référence du corps" à "référence de la bille";
- les listes de combinaison de D, E, MD, et ME ont été révisées.

General Information

Status
Published
Publication Date
07-Jun-2011
Current Stage
PPUB - Publication issued
Start Date
31-Aug-2011
Completion Date
08-Jun-2011
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IEC 60191-6-12:2011 - Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
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IEC 60191-6-12 ®
Edition 2.0 2011-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical standardization of semiconductor devices –
Part 6-12: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guidelines for fine-pitch land
grid array (FLGA)
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-12: Règles générales pour la préparation des dessins d'encombrement
des boîtiers des dispositifs à semiconducteurs à montage en surface – Lignes
directrices de conception pour les boîtiers matriciels à plots et à pas fins (FLGA)

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IEC 60191-6-12 ®
Edition 2.0 2011-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical standardization of semiconductor devices –
Part 6-12: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guidelines for fine-pitch land
grid array (FLGA)
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-12: Règles générales pour la préparation des dessins d'encombrement
des boîtiers des dispositifs à semiconducteurs à montage en surface – Lignes
directrices de conception pour les boîtiers matriciels à plots et à pas fins (FLGA)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 31.080.01 ISBN 978-2-88912-527-2

– 2 – 60191-6-12 © IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Nominal package dimension . 6
6 Outline drawings and principle dimensions . 7
7 Dimensions . 10

Figure 1 – Flange-type FLGA . 6
Figure 2 – Rectangle-type FLGA . 6
Figure 3 – Flange-type FLGA . 7
Figure 4 – Rectangle-type FLGA . 8
e
Figure 5 – Mechanical gauge drawing . 9
f
Figure 6 – Pattern of terminal position area . 9

Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability . 10
Table 2 – Group 2: Dimensions and tolerances . 14
Table 3 – Combination list of D, E, M , and M – e = 0,80mm pitch . 15
D E
Table 4 – Combination list of D, E, M , and M – e = 0,65 mm pitch . 16
D E
Table 5 – Combination list of D, E, M , and M – e = 0,50 mm pitch . 17
D E
Table 6 – Combination list of D, E, M , and M – e = 0,40 mm pitch . 18
D E
Table 7 – Combination list of D, E, M , and M – e = 0,30 mm pitch . 19
D E
60191-6-12 © IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-12: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guidelines for fine-pitch land grid array (FLGA)

FOREWORD
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International Standard IEC 60191-6-12 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This second edition of IEC 60191-6-12 cancels and replaces the first edition, published in
2002 and constitutes a technical revision. This edition includes the following significant
changes with respect to the previous edition:
a) scope is expanded so that this standard include the square type FLGA. The title of this
standard has been changed accordingly: “Rectangular type” has been deleted from the
title.
b) ball pitch of 0,3 mm has been added;
c) datum is changed from the body datum to the ball datum;
d) combination lists of D, E, M , and M have been revised.
D E
– 4 – 60191-6-12 © IEC:2011
The text of this standard is based on the following documents:
CDV Report on voting
47D/784/CDV 47D/795/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 60191 series, under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
60191-6-12 © IEC:2011 – 5 –
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-12: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guidelines for fine-pitch land grid array (FLGA)

1 Scope
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended
variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or
less.
2 Normative references
The following referenced docume
...

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