IEC 62680-1-2:2018

IEC 62680-1-2 ®
Edition 3.0 2018-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Universal serial bus interfaces for data and power –
Part 1-2: Common components – USB Power Delivery specification

Interfaces de bus universel en série pour les données et l'alimentation
électrique –
Partie 1-2: Composants communs – Spécification de l'alimentation électrique
par port USB
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IEC 62680-1-2 ®
Edition 3.0 2018-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Universal serial bus interfaces for data and power –

Part 1-2: Common components – USB Power Delivery specification

Interfaces de bus universel en série pour les données et l'alimentation

électrique –
Partie 1-2: Composants communs – Spécification de l'alimentation électrique

par port USB
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.220; 33.120; 35.200 ISBN 978-2-8322-6637-3

– 2 – IEC 62680-1-2:2018
© USB-IF:2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER –

Part 1-2: Common components – USB Power Delivery specification

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national
electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all
questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities,
IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS)
and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC
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the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between
the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus
of opinion on the relevant subjects since each technical committee has representation from all interested IEC National
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in
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the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and
the corresponding national or regional publication shall be clearly indicated in the latter.
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services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable
for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights.
IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-1-2 has been prepared by technical area 14: Interfaces and methods
of measurement for personal computing equipment, of IEC technical committee 100: Audio, video and
multimedia systems and equipment.

This third edition cancels and replaces the second edition published in 2017 and constitutes a technical
revision.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The structure and
editorial rules used in this publication reflect the practice of the organization which submitted it.
This bilingual version (2019-03) corresponds to the monolingual English version, published in 2018-04.

© USB-IF:2017
The text of this International Standard is based on the following documents:

CDV Report on voting
100/2968/CDV 100/3045/RVC
Full information on the voting for the approval of this International Standard can be found in the report

on voting indicated in the above table.

The French version of this standard has not been voted upon.

The committee has decided that the contents of this document will remain unchanged until the stability
date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the specific
document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

– 4 – IEC 62680-1-2:2018
© USB-IF:2017
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by the USB

Implementers Forum (USB-IF). These specifications were submitted to the IEC under the auspices of a

special agreement between the IEC and the USB-IF.

This standard is the USB-IF publication USB Power Delivery Specification Revision 3.0 V.1.1 and ECNs

through 12 June 2017.
The USB Implementers Forum, Inc.(USB-IF) is a non-profit corporation founded by the group of

companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide a

support organization and forum for the advancement and adoption of Universal Serial Bus technology.
The Forum facilitates the development of high-quality compatible USB peripherals (devices), and
promotes the benefits of USB and the quality of products that have passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS, "WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR
FITNESS FOR ANY PARTICULAR PURPOSE. THE USB IMPLEMENTERS FORUM AND THE
AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OR
INFORMATION IN THIS SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU WITH ANY
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to participate in a
reciprocal, RAND-Z licensing arrangement for compliant products. For more information, please see:
http://www.usb.org/developers/docs/
http://www.usb.org/developers/devclass_docs#approved
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO ENTER INTO
ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE USB IMPLEMENTERS FORUM.”

© USB-IF:2017
Universal Serial Bus
Power Delivery Specification
Revision:  3.0
Version:  1.1+ ECNs through 12 June 2017
Release date: 12 January 2017
– 6 – IEC 62680-1-2:2018
© USB-IF:2017
Editors
Bob Dunstan Renesas Electronics Corp.

Richard Petrie DisplayLink
Contributors
Charles Wang ACON, Advanced-Connectek, Inc.

Conrad Choy ACON, Advanced-Connectek, Inc.

Steve Sedio ACON, Advanced-Connectek, Inc.
Vicky Chuang ACON, Advanced-Connectek, Inc.

Joseph Scanlon Advanced Micro Devices
Caspar Lin Allion Labs, Inc.
Casper Lee Allion Labs, Inc.
Howard Chang Allion Labs, Inc.

Greg Stewart Analogix Semiconductor, Inc.

Mehran Badii Analogix Semiconductor, Inc.
Bill Cornelius Apple
Colin Whitby-Strevens Apple
Corey Axelowitz Apple
Corey Lange Apple
Dave Conroy Apple
David Sekowski Apple
Girault Jones Apple
James Orr Apple
Jason Chung Apple
Jennifer Tsai Apple
Karl Bowers Apple
Keith Porthouse Apple
Matt Mora Apple
Paul Baker Apple
Reese Schreiber Apple
Sameer Kelkar Apple
Sasha Tietz Apple
Scott Jackson Apple
Sree Raman Apple
William Ferry Apple
Zaki Moussaoui Apple
Bernard Shyu Bizlink Technology, Inc.
Eric Wu Bizlink Technology, Inc.
Morphy Hsieh Bizlink Technology, Inc.

Shawn Meng Bizlink Technology Inc.
Tiffany Hsiao Bizlink Technology, Inc.

Weichung Ooi Bizlink Technology, Inc.
Michal Staworko Cadence Design Systems, Inc.

© USB-IF:2017
Alessandro Ingrassia Canova Tech

Andrea Colognese Canova Tech
Davide Ghedin Canova Tech
Matteo Casalin Canova Tech
Nicola Scantamburlo Canova Tech

Yi-Feng Lin Canyon Semiconductor

YuHung Lin Canyon Semiconductor

Anup Nayak Cypress Semiconductor

Jagadeesan Raj Cypress Semiconductor

Pradeep Bajpai Cypress Semiconductor

Rushil Kadakia Cypress Semiconductor

Steven Wong Cypress Semiconductor

Subu Sankaran Cypress Semiconductor
Sumeet Gupta Cypress Semiconductor
Venkat Mandagulathar Cypress Semiconductor

Adolfo Montero Dell Inc.
Bruce Montag Dell Inc.
Gary Verdun Dell Inc.
Merle Wood Dell Inc.
Mohammed Hijazi Dell Inc.
Siddhartha Reddy Dell Inc.
Dan Ellis DisplayLink
Jason Young DisplayLink
Kevin Jacobs DisplayLink
Peter Burgers DisplayLink
PD Chair/Device Policy Lead
Richard Petrie DisplayLink
Abel Astley Ellisys
Chuck Trefts Ellisys
Emmanuel Durin Ellisys
Mario Pasquali Ellisys
Tim Wei Ellisys
Chien-Cheng Kuo Etron Technology, Inc.

Jack Yang Etron Technology, Inc.

Richard Crisp Etron Technology, Inc.

Shyanjia Chen Etron Technology, Inc.

TsungTa Lu Etron Technology, Inc.

Christian Klein Fairchild Semiconductor

Oscar Freitas Fairchild Semiconductor
Souhib Harb Fairchild Semiconductor

AJ Yang Foxconn / Hon Hai
Fred Fons Foxconn / Hon Hai
Steve Sedio Foxconn / Hon Hai
Terry Little Foxconn / Hon Hai
Bob McVay Fresco Logic Inc.
Christopher Meyers Fresco Logic Inc.

– 8 – IEC 62680-1-2:2018
© USB-IF:2017
Tom Burton Fresco Logic Inc.
Dian Kurniawan Fresco Logic Inc.

Adam Rodriguez Google Inc.
Alec Berg Google Inc.
David Schneider Google Inc.
Jim Guerin Google Inc.
Juan Fantin Google Inc.
Ken Wu Google Inc.
Mark Hayter Google Inc.
Nithya Jagannathan Google Inc.

Todd Broch Google Inc.
Vincent Palatin Google Inc.
Mike Engbretson Granite River Labs

Rajaraman V Granite River Labs

Alan Berkema Hewlett Packard
Lee Atkinson Hewlett Packard
Rahul Lakdawala Hewlett Packard

Robin Castell Hewlett Packard
Roger Benson Hewlett Packard
Ron Schooley Hewlett Packard
Suketu Partiwala Hewlett Packard

Vaibhav Malik Hewlett Packard
Walter Fry Hewlett Packard
PD Chair/Protocol WG Lead
Bob Dunstan Intel Corporation
Brad Saunders Intel Corporation

Chee Lim Nge Intel Corporation

Christine Krause Intel Corporation

Dan Froelich Intel Corporation

David Harriman Intel Corporation

David Hines Intel Corporation
David Thompson Intel Corporation

Guobin Liu Intel Corporation
Harry Skinner Intel Corporation

Henrik Leegaard Intel Corporation

Jervis Lin Intel Corporation
John Howard Intel Corporation
Karthi Vadivelu Intel Corporation

Leo Heiland Intel Corporation
Maarit Harkonen Intel Corporation

Nge Chee Lim Intel Corporation

Paul Durley Intel Corporation
System Policy Lead
Rahman Ismail Intel Corporation

Ronald Swartz Intel Corporation

Sarah Sharp Intel Corporation
Scott Brenden Intel Corporation

© USB-IF:2017
Sridharan Ranganathan Intel Corporation

Steve McGowan Intel Corporation

PD Chair/Compliance Lead
Tim McKee Intel Corporation
Toby Opferman Intel Corporation

Jia Wei Intersil Corporation
Kenta Minejima Japan Aviation Electronics Industry Ltd. (JAE)

Mark Saubert Japan Aviation Electronics Industry Ltd. (JAE)

Toshio Shimoyama Japan Aviation Electronics Industry Ltd. (JAE)

Brian Fetz Keysight Technologies Inc.

Babu Mailachalam Lattice Semiconductor Corp

Gianluca Mariani Lattice Semiconductor Corp
Joel Coplen Lattice Semiconductor Corp

Thomas Watza Lattice Semiconductor Corp

Vesa Lauri Lattice Semiconductor Corp

Daniel H Jacobs LeCroy Corporation

Jake Jacobs LeCroy Corporation

Kimberley McKay LeCroy Corporation

Mike Micheletti LeCroy Corporation

Roy Chestnut LeCroy Corporation

Tyler Joe LeCroy Corporation
Phil Jakes Lenovo
Dave Thompson LSI Corporation
Alan Kinningham Luxshare-ICT
Daniel Chen Luxshare-ICT
Josue Castillo Luxshare-ICT
Scott Shuey Luxshare-ICT
Chris Yokum MCCI Corporation
Geert Knapen MCCI Corporation
Terry Moore MCCI Corporation
Velmurugan Selvaraj MCCI Corporation

Brian Marley Microchip Technology Inc.

Dave Perchlik Microchip Technology Inc.

Don Perkins Microchip Technology Inc.

John Sisto Microchip Technology Inc.

Josh Averyt Microchip Technology Inc.

Kiet Tran Microchip Technology Inc.

Mark Bohm Microchip Technology Inc.

Matthew Kalibat Microchip Technology Inc.

Mick Davis Microchip Technology Inc.

Rich Wahler Microchip Technology Inc.
Ronald Kunin Microchip Technology Inc.

Shannon Cash Microchip Technology Inc.
Anthony Chen Microsoft Corporation
Dave Perchlik Microsoft Corporation

David Voth Microsoft Corporation

– 10 – IEC 62680-1-2:2018
© USB-IF:2017
Geoff Shew Microsoft Corporation

Jayson Kastens Microsoft Corporation

Kai Inha Microsoft Corporation

Marwan Kadado Microsoft Corporation

Michelle Bergeron Microsoft Corporation

Rahul Ramadas Microsoft Corporation

Randy Aull Microsoft Corporation

Shiu Ng Microsoft Corporation
Timo Toivola Microsoft Corporation

Toby Nixon Microsoft Corporation

Vivek Gupta Microsoft Corporation

Yang You Microsoft Corporation

Dan Wagner Motorola Mobility Inc.

Ben Crowe MQP Electronics Ltd.

Pat Crowe MQP Electronics Ltd.

Sten Carlsen MQP Electronics Ltd.

Frank Borngräber Nokia Corporation

Kai Inha Nokia Corporation
Pekka Leinonen Nokia Corporation
PD Vice-Chair/Device Policy Lead
Richard Petrie Nokia Corporation
Physical Layer WG Lead
Sten Carlsen Nokia Corporation

Abhijeet Kulkarni NXP Semiconductors

Ahmad Yazdi NXP Semiconductors

Bart Vertenten NXP Semiconductors

Dong Nguyen NXP Semiconductors

Guru Prasad NXP Semiconductors

Ken Jaramillo NXP Semiconductors

Krishnan TN NXP Semiconductors
Michael Joehren NXP Semiconductors

Robert de Nie NXP Semiconductors

Rod Whitby NXP Semiconductors
Vijendra Kuroodi NXP Semiconductors

Robert Heaton Obsidian Technology

Bryan McCoy ON Semiconductor
Christian Klein ON Semiconductor

Cor Voorwinden ON Semiconductor
Power Supply WG Lead
Edward Berrios ON Semiconductor

Oscar Freitas ON Semiconductor

Tom Duffy ON Semiconductor
Craig Wiley Parade Technologies Inc.

Aditya Kulkarni Power Integrations

Rahul Joshi Power Integrations

Ricardo Pregiteer Power Integrations

Chris Sporck Qualcomm, Inc.
Craig Aiken Qualcomm, Inc.
© USB-IF:2017
George Paparrizos Qualcomm, Inc

Giovanni Garcea Qualcomm, Inc
James Goel Qualcomm, Inc
Jos hua Warner Qualcomm, Inc
Narendra Mehta Qualcomm, Inc.
Terry Remple Qualcomm, Inc.
Will Kun Qualcomm, Inc.
Yoram Rimoni Qualcomm, Inc.
Atsushi Mitamura Renesas Electronics Corp.

Bob Dunstan Renesas Electronics Corp.

Dan Aoki Renesas Electronics Corp.

Kiichi Muto Renesas Electronics Corp.

Masami Katagiri Renesas Electronics Corp.

Nobuo Furuya Renesas Electronics Corp.

Patrick Yu Renesas Electronics Corp.

Peter Teng Renesas Electronics Corp.

Philip Leung Renesas Electronics Corp.

Steve Roux Renesas Electronics Corp.

Tetsu Sato Renesas Electronics Corp.

Toshifumi Yamaoka Renesas Electronics Corp.
Chunan Kuo Richtek Technology Corporation
Heinz Wei Richtek Technology Corporation

Tatsuya Irisawa Ricoh Company Ltd.

Akihiro Ono Rohm Co. Ltd.
Chris Lin Rohm Co. Ltd.
Hidenori Nishimoto Rohm Co. Ltd.

Kris Bahar Rohm Co. Ltd.
Manabu Miyata Rohm Co. Ltd.
Ruben Balbuena Rohm Co. Ltd.
Takashi Sato Rohm Co. Ltd.
Vijendra Kuroodi Rohm Co. Ltd.

Yusuke Kondo Rohm Co. Ltd.
Matti Kulmala Salcomp Plc
Toni Lehimo Salcomp Plc
Tong Kim Samsung Electronics Co. Ltd.
Cab Con WG Lead
Alvin Cox Seagate Technology LLC

John Hein Seagate Technology LLC

Marc Noblitt Seagate Technology LLC

Ronald Rueckert Seagate Technology LLC

Tony Priborsky Seagate Technology LLC

Chin Chang Semtech Corporation

Kafai Leung Silicon Laboratories, Inc.

Abhishek Sardeshpande SiliConch Systems Private Limited

Jaswanth Ammineni SiliConch Systems Private Limited

Kaustubh Kumar SiliConch Systems Private Limited

– 12 – IEC 62680-1-2:2018
© USB-IF:2017
Pavitra Balasubramanian SiliConch Systems Private Limited

Rakesh Polasa SiliConch Systems Private Limited

Vishnu Pusuluri SiliConch Systems Private Limited

John Sisto SMSC
Ken Gay SMSC
Mark Bohm SMSC
Richard Wahler SMSC
Shannon Cash SMSC
Tim Knowlton SMSC
William Chiechi SMSC
Bob Dunstan Specwerkz
Fabien Friess ST-Ericsson
Giuseppe Platania ST-Ericsson
Jean-Francois Gatto ST-Ericsson

Milan Stamenkovic ST-Ericsson
Nicolas Florenchie ST-Ericsson

Patrizia Milazzo ST-Ericsson
Christophe Lorin ST-Microelectronics

John Bloomfield ST-Microelectronics

Massimo Panzica ST-Microelectronics

Meriem Mersel ST-Microelectronics

Nathalie Ballot ST-Microelectronics

Pascal Legrand ST-Microelectronics

Patrizia Milazzo ST-Microelectronics

Richard O’Connor ST-Microelectronics
Zongyao Wen Synopsys, Inc.
Joan Marrinan Tektronix
Kimberley McKay Teledyne-LeCroy

Matthew Dunn Teledyne-LeCroy
Tony Minchell Teledyne-LeCroy
Anand Dabak Texas Instruments
Bill Waters Texas Instruments
Bing Lu Texas Instruments
Physical Layer WG Lead
Deric Waters Texas Instruments

Grant Ley Texas Instruments
Ingolf Frank Texas Instruments

Ivo Huber Texas Instruments
Javed Ahmad Texas Instruments
Jean Picard Texas Instruments
Martin Patoka Texas Instruments

Mike Campbell Texas Instruments

Scott Jackson Texas Instruments

Srinath Hosur Texas Instruments

Steven Tom Texas Instruments
Chris Yokum Total Phase
© USB-IF:2017
Brad Cox Ventev Mobile
Colin Vose Ventev Mobile
Dydron Lin VIA Technologies, Inc.

Fong-Jim Wang VIA Technologies, Inc.

Jay Tseng VIA Technologies, Inc.

Rex Chang VIA Technologies, Inc.

Terrance Shih VIA Technologies, Inc.

Jeng Cheng Liu Weltrend Semiconductor

Wayne Lo Weltrend Semiconductor

Charles Neumann Western Digital Technologies, Inc.

Curtis Stevens Western Digital Technologies, Inc.
John Maroney Western Digital Technologies, Inc.

– 14 – IEC 62680-1-2:2018
© USB-IF:2017
Revision History
Revision Version Comments Issue Date

1.0 1.0 Initial release Revision 1.0 5 July, 2012

1.0 1.1 Including errata through 31-October-2012 31 October 2012

1.0 1.2 Including errata through 26-June-2013 26 June, 2013

1.0 1.3 Including errata through 11-March-2014 11 March 2014

2.0 1.0 Initial release Revision 2.0 11 August 2014
2. 0 1.1 Including errata through 7-May 2015 7 May 2015
2. 0 1.2 Including errata through 25-March-2016 25 March 2016
2.0 1.3 11 January 2017
Including errata through 11-January-2017
3.0 1.0 Initial release Revision 3.0 11 December 2015
3.0 1.0a Including errata through 25-March-2016 25 March 2016
3.0 1.1 Including errata through 12-January-2016 12 January 2017
3.0 1.1+ECNs Markup including ECNs through 12-June-2017: 12 June 2017
• Add VPD Product Type
• Specification Revision Interoperability
• VCONN_Swap Clarification
• Chapter 7 Source and Sink Behavior
• Battery Numbering
• Chunking Clarification
• FR_Swap State Operation
• GoodCRC Specification Revision
• Slew Rate Exception for Source

© USB-IF:2017
INTELLECTUAL PROPERTY DISCLAIMER

THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER,
I NCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR
ANY PARTICULAR PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY,

INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE

OR IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS

SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.

Please send comments via electronic mail to techsup@usb.org
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org

All product names are trademarks, registered trademarks, or service marks of their respective owners.
Renesas, STMicroelectronics, and Texas Instruments
All rights reserved.
– 16 – IEC 62680-1-2:2018
© USB-IF:2017
CONTENTS
FOREWORD . 2

INTRODUCTION . 4

Editors . 6

Contributors . 6

Revision History . 14

INTELLECTUAL PROPERTY DISCLAIMER . 15
CONTENTS . 16
List of Tables . 22
List of Figures . 28
1 Introduction . 36
1.1 Overview . 36
1.2 Purpose . 37
1.3 Scope . 37
1.4 Conventions . 37
1.4.1 Precedence . 37
1.4.2 Keywords . 38
1.4.3 Numbering . 39
1.5 Related Documents . 39
1.6 Terms and Abbreviations . 40
1.7 Parameter Values . 47
1.8 Changes From Revision 2.0 . 48
1.9 Compatibility with Revision 2.0 . 48
2 Overview . 48
2.1 Introduction . 48
2.2 Section Overview . 50
2.3 Revision 2.0 Changes and Compatibility . 51
2.3.1 Changes From Revision 2.0 . 51
2.3.2 Compatibility with Revision 2.0 . 51
2.4 USB Power Delivery Capable Devices . 52
2.5 SOP* Communication . 53

2.5.1 Introduction . 53
2.5.2 SOP* Collision Avoidance . 53
2.5.3 SOP Communication . 53
2.5.4 SOP’/SOP’’ Communication with Cable Plugs . 53
2.6 Operational Overview . 55
2.6.1 Source Operation . 55
2.6.2 Sink Operation . 58
2.6.3 Cable Plugs . 60
2.7 Architectural Overview . 61
2.7.1 Policy . 63

© USB-IF:2017
2.7.2 Message Formation and Transmission . 64

2.7.3 Collision Avoidance . 64

2.7.4 Power supply . 65

2.7.5 DFP/UFP . 65

2.7.6 VCONN Source . 65

2.7.7 Cable and Connectors . 66

2.7.8 Interactions between Non-PD, BC and PD devices . 66

2.7.9 Power Rules . 66

3 USB Type-A and USB Type-B Cable Assemblies and Connectors . 66

4 Electrical Requirements . 66
4.1 Interoperability with other USB Specifications . 66
4.2 Dead Battery Detection / Unpowered Port Detection . 66
4.3 Cable IR Ground Drop (IR Drop) . 67
4.4 Cable Type Detection . 67
5 Physical Layer . 68
5.1 Physical Layer Overview . 68
5.2 Physical Layer Functions . 68
5.3 Symbol Encoding . 69
5.4 Ordered Sets . 70
5.5 Transmitted Bit Ordering . 71
5.6 Packet Format . 72
5.6.1 Packet Framing . 72
5.6.2 CRC . 74
5.6.3 Packet Detection Errors . 76
5.6.4 Hard Reset. 76
5.6.5 Cable Reset . 77
5.7 Collision Avoidance . 78
5.8 Biphase Mark Coding (BMC) Signaling Scheme . 78
5.8.1 Encoding and signaling . 79
5.8.2 Transmit and Receive Masks . 84
5.8.3 Transmitter Load Model . 91
5.8.4 BMC Common specifications . 92
5.8.5 BMC Transmitter Specifications . 92
5.8.6 BMC Receiver Specifications . 95

5.9 Built in Self-Test (BIST) . 98
5.9.1 BIST Carrier Mode . 98
5.9.2 BIST Test Data . 98
6 Protocol Layer . 99
6.1 Overview . 99
6.2 Messages . 99
6.2.1 Message Construction . 99
6.3 Control Message . 111
6.3.1 GoodCRC Message . 112
6.3.2 GotoMin Message . 112

– 18 – IEC 62680-1-2:2018
© USB-IF:2017
6.3.3 Accept Message. 113

6.3.4 Reject Message . 113

6.3.5 Ping Message . 114

6.3.6 PS_RDY Message. 114

6.3.7 Get_Source_Cap Message . 114

6.3.8 Get_Sink_Cap Message . 114

6.3.9 DR_Swap Message . 114

6.3.10 PR_Swap Message . 115

6.3.11 VCONN_Swap Message . 115

6.3.12 Wait Message . 116
6.3.13 Soft Reset Message . 117
6.3.14 Not_Supported Message . 118
6.3.15 Get_Source_Cap_Extended Message . 118
6.3.16 Get_Status Message . 118
6.3.17 FR_Swap Message . 118
6.3.18 Get_PPS_Status . 119
6.3.19 Get_Country_Codes . 119
6.4 Data Message . 119
6.4.1 Capabilities Message . 120
6.4.2 Request Message . 130
6.4.3 BIST Message . 135
6.4.4 Vendor Defined Message . 136
6.4.5 Battery_Status Message . 162
6.4.6 Alert Message . 163
6.4.7 Get_Country_Info Message . 165
6.5 Extended Message . 165
6.5.1 Source_Capabilities_Extended Message . 166
6.5.2 Status Message . 170
6.5.3 Get_Battery_Cap Message . 173
6.5.4 Get_Battery_Status Message . 173
6.5.5 Battery_Capabilities Message . 173
6.5.6 Get_Manufacturer_Info Message . 174
6.5.7 Manufacturer_Info Message . 175
6.5.8 Security Messages . 176

6.5.9 Firmware Update Messages . 177
6.5.10 PPS_Status Message. 178
6.5.11 Country_Codes Message . 179
6.5.12 Country_Info Message . 179
6.6 Timers .
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