IEC 62779-2:2016

IEC 62779-2 ®
Edition 1.0 2016-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Semiconductor interface for human body
communication –
Part 2: Characterization of interfacing performances

Dispositifs à semiconducteurs – Interface à semiconducteurs pour les
communications via le corps humain –
Partie 2: Caractérisation des performances d'interfaçage

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 20 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 15 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

IEC publications search - www.iec.ch/searchpub IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 65 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

CISPR.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: csc@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Catalogue IEC - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
Application autonome pour consulter tous les renseignements
Le premier dictionnaire en ligne de termes électroniques et
bibliographiques sur les Normes internationales,
électriques. Il contient 20 000 termes et définitions en anglais
Spécifications techniques, Rapports techniques et autres
et en français, ainsi que les termes équivalents dans 15
documents de l'IEC. Disponible pour PC, Mac OS, tablettes
langues additionnelles. Egalement appelé Vocabulaire
Android et iPad.
Electrotechnique International (IEV) en ligne.

Recherche de publications IEC - www.iec.ch/searchpub
Glossaire IEC - std.iec.ch/glossary
La recherche avancée permet de trouver des publications IEC 65 000 entrées terminologiques électrotechniques, en anglais
en utilisant différents critères (numéro de référence, texte, et en français, extraites des articles Termes et Définitions des
comité d’études,…). Elle donne aussi des informations sur les publications IEC parues depuis 2002. Plus certaines entrées
projets et les publications remplacées ou retirées. antérieures extraites des publications des CE 37, 77, 86 et

CISPR de l'IEC.
IEC Just Published - webstore.iec.ch/justpublished

Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications IEC. Just
Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur cette
Disponible en ligne et aussi une fois par mois par email. publication ou si vous avez des questions contactez-nous:
csc@iec.ch.
IEC 62779-2 ®
Edition 1.0 2016-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Semiconductor interface for human body

communication –
Part 2: Characterization of interfacing performances

Dispositifs à semiconducteurs – Interface à semiconducteurs pour les

communications via le corps humain –

Partie 2: Caractérisation des performances d'interfaçage

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-3175-3

– 2 – IEC 62779-2:2016 © IEC 2016
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references. 6
3 Terms, definitions and letter symbols . 6
3.1 General terms . 6
3.2 Signal characteristics . 9
3.3 Letter symbols . 11
4 Measurement of electrical performances of electrode . 11
4.1 Measurement setup . 11
4.2 Measurement apparatus and signal specifications . 12
4.2.1 Transmitter and receiver module . 12
4.2.2 Synchronization module . 13
4.2.3 Measurement equipment . 13
4.2.4 Signal specifications . 13
4.3 Measurement procedure . 14
4.3.1 General . 14
4.3.2 Attachment of transmitter and receiver modules . 14
4.3.3 Transmission of pulse and synchronization signals . 14
4.3.4 Synchronization of measurement equipment . 14
4.3.5 Signal processing in receiver module . 14
4.3.6 Measurement of pulse and processed signal . 14
4.3.7 Compensation for signal processing . 14
4.3.8 Computation of impulse response and complex transfer function . 14
4.4 Post processing for electrode performances . 14
4.4.1 General . 14
4.4.2 In-band average signal-loss . 14
4.4.3 In-band average phase-shift . 15
4.4.4 RMS delay . 15
4.4.5 Coherent bandwidth . 15
Bibliography . 17

Figure 1 – Pulse signal . 8
Figure 2 – Synchronization signal . 9
Figure 3 – Measurement setup . 12

Table 1 – Letter symbols . 11

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES – SEMICONDUCTOR INTERFACE
FOR HUMAN BODY COMMUNICATION –

Part 2: Characterization of interfacing performances

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62779-2 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/2268/FDIS 47/2278/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 62779-2:2016 © IEC 2016
A list of all parts in the IEC 62779 series, published under the general title Semiconductor
devices – Semiconductor interface for human body communication, can be found on the IEC
website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
INTRODUCTION
The IEC 62779 series is composed of three parts as follow:
• IEC 62779-1 defines general requirements of a semiconductor interface for human body
communication. It includes general and functional specifications of the interface.
• IEC 62779-2 defines a measurement method on electrical performances of an electrode
that constructs a semiconductor interface for human body communication.
• IEC 62779-3 defines functional type of a semiconductor interface for human body
communication, and operational conditions of the interface.

– 6 – IEC 62779-2:2016 © IEC 2016
SEMICONDUCTOR DEVICES – SEMICONDUCTOR INTERFACE
FOR HUMAN BODY COMMUNICATION –

Part 2: Characterization of interfacing performances

1 Scope
This part of IEC 62779 defines a measurement method on electrical performances of an
electrode that composes a semiconductor interface for human body communication (HBC). In
the measurement method, a signal transmitter is electrically isolated from a signal receiver, so
an isolation condition between the transmitter and receiver is maintained to accurately
measure the electrode’s performances. This part includes general and functional
specifications of the measurement method.
HBC uses the body of a user as a transmission medium using near-field coupling inside the
body: a signal transmitter and receiver are coupled with each other through a near field that is
formed inside the human body and air. The intensity of the near field is strong especially
inside the body due to high dielectric constant of the body, so a data signal is transmitted
through the human body by modulating the near field. A signal transmitter and receiver for
HBC include an internal ground respectively, and, in most HBC applications, the grounds are
separated from each other as maintaining the coupling condition through the air. Quality of a
data transmission strongly depends on a coupling degree between the grounds; hence, it is
important to maintain the coupling degree between grounds of a signal transmitter and
receiver for an accurate measurement of the electrode’s performances. This part defines a
measurement method to measure electrical performances of an electrode while the coupling
degree between grounds of a signal transmitter and receiver is maintained.
NOTE 1 HBC semiconductor interface consists of an electrode and analog front end.
NOTE 2 General analog and digital modulation techniques can be used to modulate a near field used in HBC, and
a modulation technique to be used is determined according to required performances for a data transmission and a
HBC application.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
None.
3 Terms, definitions and letter symbols
For the purposes of this document, the following terms and definitions apply.
3.1 General terms
3.1.1
electrode
physical structure to transmit an electrical signal between an analog front end and the human
body while attached to or located near the human body
Note 1 to entry: An electrode transfers an electrical signal to be transmitted to a non-metallic transmission
channel, the human body. It also transfers an electrical signal received from the human body to the analog front
end.
Note 2 to entry: electrode can have an adhesive material on its surface like a disposable ECG electrode to be
attached itself to the human body; or a metal surface for a simple implementation. In the case of a metal surface,
an electrode makes contact with the human body by attaching it to the human body using an attachment aid like a
rubber band; or simply touching it with the hand.
[SOURCE: IEC 62779-1: 3.1.1, modified – Note 2 to entry has been added.]
3.1.2
transmitter module
circuit module that generates a pulse signal to be transmitted to the human body through an
electrode for measurement of the electrode’s performances; and a synchronization signal of
an optical type to be transmitted through an optical cable for synchronization of the pulse
signal transmitted through the human body
Note 1 to entry: A transmitter module includes a signal amplifier to amplify the transmitting pulse signal; and a
signal filter to remove a signal component causing an interference to other measurement modules and
measurement equipment.
3.1.3
receiver module
circuit module that processes a pulse signal received from the human body through an
electrode to increase signal quality for measurement of the electrode’s performances
Note 1 to entry: A receiver module includes a signal amplifier to amplify the received pulse signal; and a signal
filter to remove a noise or interference signal from the received pulse signal.
3.1.4
synchronization module
circuit module that transforms a synchronization signal transmitted through an optical cable
into an electrical signal; and generates a trigger signal using the transformed synchronization
signal to trigger measurement equipment
Note 1 to entry: A synchronization module includes an optical transceiver to transform an optical signal into an
electrical signal or vice versa.
3.1.5
pulse signal
electrical signal that is generated in the transmitter module and then transmitted to the human
body through an electrode to measure the electrode’s performances while having a specific
pulse-width to include a signal component at frequency bands over which the performances
are to be measured
Note 1 to entry: Figure 1 shows a pulse signal and its related terms.

– 8 – IEC 62779-2:2016 © IEC 2016
PP
P
PA
P
Time
RT
P
FT
P
PA
P
0,9PA
P
STF
P
0,1PA
P
PW
P
Time
IEC
Key
PA Pulse amplitude PP Pulse period
p p
US Undershoot PW Pulse width
p p
RT FT
Rising time Falling time
p p
STF Settling time of falling
p
Figure 1 – Pulse signal
Note 2 to entry: A pulse signal has a short pulse-width to include a signal component at a wide-frequency band.
3.1.6
synchronization signal
electrical signal that is synchronized to the pulse signal and then transformed into an optical
signal to be transmitted to a synchronization module through an optical cable for the purpose
of synchronization between the transmitter and receiver modules
Note 1 to entry: Figure 2 shows a synchronization signal and its related terms.
Amplitude
Amplitude
US
P
PA
S
US
S
Time
RT FT
S S
1,1 PA
S
PA
S
0,9PA
S
STR STF
S S
0,1PA
S
–0,1PA PW
S S
Time
IEC
Key
PA Pulse amplitude OS overshoot
s s
US Undershoot PW Pulse width
s s
RT FT
Rising time Falling time
s s
STR Settling time of rising STF Settling time of falling
s s
Figure 2 – Synchronization signal
3.2 Signal characteristics
3.2.1
pulse amplitude
PA
p
peak amplitude of pulse signal in volts
3.2.2
pulse period
PP
p
time period of periodic pulses in seconds
3.2.3
undershoot
US
p
minimum amplitude in volts during transient period of a falling signal
Amplitude
Amplitude
OS
S
– 10 – IEC 62779-2:2016 © IEC 2016
3.2.4
pulse width
PW
p
time interval in seconds between points at which a pulse signal has 10 % value of pulse
amplitude
3.2.5
rising time
RT
p
time interval in seconds required for a pulse signal to rise from 10 % value of pulse amplitude
to 90 % value
3.2.6
falling time
FT
p
time interval in seconds required for a pulse signal to fall from 90 % value of pulse amplitude
to 10 % value
3.2.7
settling time of falling
STF
p
maximum time interval in seconds required for a pulse signal to fall from 90 % value of pulse
amplitude to 10 % or −10 % value during transient period of a falling signal
3.2.8
pulse amplitude
PA
s
peak amplitude of a synchronization signal in volts after transient period of a rising signal
3.2.9
overshoot
OS
s
differential amplitude in volts from pulse amplitude to peak amplitude during transient period
of a rising signal
3.2.10
undershoot
US
s
minimum amplitude in volts during transient period of a falling signal
3.2.11
pulse width
PW
s
time interval in seconds between points at which a synchronization signal has 10 % value of
pulse amplitude
3.2.12
rising time
RT
s
time interval in seconds required for a synchronization signal to rise from 10 % value of pulse
amplitude to 90 % value
3.2.13
falling time
FT
s
time interval in seconds required for a synchronization signal to fall from 90 % value of pulse
amplitude to 10 % value
3.2.14
settling time of rising
STR
s
maximum time interval in seconds required for a synchronization signal to rise from 10 %
value of pulse amplitude to 110 % or 90 % value during transient period of a rising signal
3.2.15
settling time of falling
STF
s
maximum time interval in seconds required for a synchronization signal to fall from 90 % value
of pulse amplitude to 10 % or −10 % value during transient period of a falling signal
3.3 Letter symbols
For the purposes of this document, the letter symbols given in Table 1 apply.
Table 1 – Letter symbols
Name and designation Letter symbol
PA
Pulse amplitude
p
Pulse period PP
p
Undershoot US
p
Pulse width PW
p
Rising time RT
p
Falling time FT
p
Settling time of falling STF
p
PA
Pulse amplitude
s
Overshoot OS
s
Undershoot US
s
Pulse width PW
s
Rising time RT
s
Falling time FT
s
Settling time of rising STR
s
Settling time of falling STF
s
4 Measurement of electrical performances of electrode
4.1 Measurement setup
A measurement setup as shown in Figure 3 is applied to measure interface performances
while maintaining a coupling degree between grounds inside a signal transmitter and receiver.

– 12 – IEC 62779-2:2016 © IEC 2016
Pulse signal Receiving signal
SP
t t
TM RM
Measurement
equipment
ET ET
Sync. signal Trigger signal
t t
SM
OC
IEC
Key
TM Transmitter module RM Receiver module
SM Synchronization module OC Optical cable
SP Signal probe ET Electrode
Figure 3 – Measurement setup
4.2 Measurement apparatus and signal specifications
4.2.1 Transmitter and receiver module
4.2.1.1 General
For an accurate measurement of the electrode’s performances, physical and electrical
specifications of the modules are determined as follows.
4.2.1.2 Size of internal ground plane
An internal ground plane inside a transmitter and receiver module shall have the same size as
that of a device to which a HBC semiconductor interface is applied.
4.2.1.3 Amplitude of pulse signal
A pulse signal transmitted through an electrode to the human body shall have enough small
amplitude to minimize any potential harmful health effects that may occur during transmitting
the pulse signal.
If applicable, general regulations to limit human exposure to electromagnetic fields (EMF)
shall be satisfied.
4.2.1.4 Interface
Each module shall include an interface for a measurement equipment to measure a pulse
signal in the transmitter module and a processed signal in the receiver module.
4.2.1.5 Modulation technique
In the transmitter, any modulation technique can be used to transform a synchronization
signal to an optical signal transmitted through an optical cable.

4.2.2 Synchronization module
4.2.2.1 General
A synchronization module shall be sufficiently distant from the human body to avoid signal
interference with a pulse signal transmitted through the human body.
4.2.2.2 Demodulation technique
A demodulation technique corresponding to the modulation technique used for a
synchronization signal shall be used to transform an optical signal received through an optical
cable to a synchronization signal.
4.2.3 Measurement equipment
Measurement equipment including a signal probe shall be prepared to measure a pulse signal
in the transmitter module and a processed signal in the receiver module respectively.
The measurement equipment shall be synchronized with the pulse signal in transmitter using
a trigger signal generated from the synchronization module.
4.2.4 Signal specifications
4.2.4.1 General
The following specifications of the signals that are used for measurement shall be given.
4.2.4.2 Pulse signal
The following specifications of the pulse signal shall be given:
a) pulse amplitude;
b) pulse period;
c) undershoot;
d) pulse width;
e) rising time;
f) falling time;
g) settling time of falling.
4.2.4.3 Synchronization signal
The following specifications of the synchronization signal shall be given:
a) pulse amplitude;
b) overshoot;
c) undershoot;
d) pulse width;
e) rising time;
f) falling time;
g) settling time of rising;
h) settling time of falling.
– 14 – IEC 62779-2:2016 © IEC 2016
4.3 Measurement procedure
4.3.1 General
The interface performance is measured according to the following procedure.
4.3.2 Attachment of transmitter and receiver modules
A transmitter and a receiver module, each having an electrode under measurement, are
attached to the human body.
4.3.3 Transmission of pulse and synchronization signals
A pulse signal that is generated in a transmitter module is transmitted to the human body
through the electrode. Furthermore, a synchronization signal that is synchronized to the pulse
signal is transmitted to an optical cable for synchronization after being transformed into an
optical signal.
4.3.4 Synchronization of measurement equipment
A synchronization module transforms an optical signal transmitted through an optical cable
into a synchronization signal; it then generates a trigger signal to synchronize a measurement
equipment to a pulse signal in a transmitter module.
4.3.5 Signal processing in receiver module
A receiving signal is processed in a receiver module. The signal processing includes signal
amplification and filtering.
4.3.6 Measurement of pulse and processed signal
A pulse signal in a transmitter module is measured using a signal probe in the measurement
equipment; then a processed signal in a receiver module is measured using the same signal
probe while synchronization with a pulse signal in a transmitter module is maintained.
4.3.7 Compensation for signal processing
An amplitude gain by signal processing in a receiver module is compensated to obtain a
receiving signal received at an electrode of the receiver module.
4.3.8 Computation of impulse response and complex transfer function
After pulse and receiving signals are respectively transformed into the frequency domain, the
transformed receiving signal is subtracted from the transformed pulse signal to obtain a
complex transfer function. An impulse response is obtained by transforming the obtained
complex transfer function into the time domain.
4.4 Post processing for electrode performances
4.4.1 General
After obtaining an impulse response, h[n], and complex transfer function, H[m], from the
comparison of the pulse and receiving signals, electrical performances shall be calculated as
follows.
4.4.2 In-band average signal-loss
The in-band average signal-loss can be calculated from the complex transfer function as
follows:
M
[ ]
SL = H m (1)
∑
average
M −M +1
m=M
1 2
Here, SL is the in-band average signal loss, and H[m] is the complex transfer function
average
with a frequency index m. M and M represent the frequency band where the signal loss is
1 2
averaged.
4.4.3 In-band average phase-shift
The in-band average phase-shift can be calculated from the complex transfer function as
follows:
M
PS = ∠H[m] (2)
∑
average
M −M +1
m=M
1 2
Here, PS is the in-band average phase-shift.
average
4.4.4 RMS delay
The RMS delay can be calculated from a power de
...