IEC TS 62668-1:2014

IEC TS 62668-1 ®
Edition 2.0 2014-07
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Counterfeit prevention –
Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic
components
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IEC TS 62668-1 ®
Edition 2.0 2014-07
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Counterfeit prevention –

Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic

components
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XB
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-1679-8

– 2 – IEC TS 62668-1:2014 © IEC 2014
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviations . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 12
4 Technical requirements . 14
4.1 General . 14
4.2 Minimum avionics OEM requirements . 15
4.3 Intellectual property . 17
4.3.1 General . 17
4.3.2 Definition of intellectual property. 18
4.4 Counterfeit consideration . 18
4.4.1 General . 18
4.4.2 Legal definition of counterfeit . 18
4.4.3 Fraudulent components . 19
4.4.4 How to establish traceability . 19
4.4.5 Reasons for the loss of component traceability . 19
4.5 Why is counterfeit a problem? . 20
4.5.1 General . 20
4.5.2 General worldwide activities combating counterfeit issues . 20
4.5.3 Cultural differences . 21
4.5.4 Counterfeiting activities and avionics equipment . 21
4.5.5 Electronic components direct action groups . 23
4.6 Recycled components . 24
4.6.1 General . 24
4.6.2 Why does the avionics industry not use recycled components?. 24
4.6.3 When do recycled components become suspect and potentially
fraudulent? . 24
4.7 Original component manufacturer (OCM) anti-counterfeit guidelines . 25
4.7.1 General . 25
4.7.2 Chinese Reliable Electronic Component Supplier (RECS) audit scheme . 25
4.7.3 Original component manufacturer (OCM) ISO 9001 and AS/EN/JISQ
9100 Third Party Certification . 25
4.7.4 Original component manufacturer (OCM) trademarks . 25
4.7.5 Original component manufacturer (OCM) IP control . 25
4.7.6 Original component manufacturer (OCM) physical part marking and
packaging marking . 26
4.7.7 The Semiconductor Industries Association Anti Counterfeit Task Force
(ACTF) . 26
4.7.8 USA Trusted Foundry Program . 27
4.7.9 USA Trusted IC Supplier Accreditation Program . 27
4.7.10 Physical unclonable function (PUF) . 27
4.7.11 Original Component Manufacturer (OCM) best practice . 27
4.8 Distributor minimum accreditations . 28
4.9 Distributor AS/EN/JISQ 9120 Third Party Certification . 28
4.10 Franchised distributor network . 28

4.10.1 General . 28
4.10.2 Control stock through tracking schemes . 29
4.10.3 Control scrap . 29
4.10.4 RECS . 29
4.11 Non- franchised distributor anti-counterfeit guidelines . 29
4.11.1 General . 29
4.11.2 CCAP-101 certified program for independent distributor . 30
4.11.3 SAE AS6081 . 30
4.11.4 OEM managed non-franchised distributors . 30
4.11.5 Brokers . 30
4.12 Avionics OEM anti-counterfeit guidelines when procuring components . 30
4.12.1 General . 30
4.12.2 Buy from approved sources . 31
4.12.3 Traceable components . 31
4.12.4 Certificates of conformance . 31
4.12.5 Plan and buy sufficient quantities . 32
4.12.6 Use of non- franchised distributors . 32
4.12.7 Brokers . 32
4.12.8 Contact the original manufacturer . 32
4.12.9 Obsolete components and franchised aftermarket sources . 32
4.12.10 IEC/TS 62239-1 approved alternatives. 33
4.12.11 Product redesign . 33
4.12.12 Non traceable components . 33
4.12.13 OEM anti-counterfeit plans including SAE AS5553 and SAE AS6174 . 33
4.13 OEM anti-counterfeit guidelines for their products . 36
4.13.1 IP control . 36
4.13.2 Tamper-proofing the OEM design . 36
4.13.3 Tamper-proof labels. 36
4.13.4 Use of ASICS and FPGAs with IP protection features . 36
4.13.5 Control the final OEM product marking . 37
4.13.6 Control OEM scrap . 37
4.13.7 OEM trademarks and logos. 37
4.13.8 Control delivery of OEM products and spares and their useful life . 37
4.13.9 Repairs to OEM products . 37
4.14 Counterfeit, fraud and component recycling reporting . 38
4.14.1 General . 38
4.14.2 USA FAA suspected unapproved parts (SUP) program . 38
4.14.3 EASA . 38
4.14.4 UK counterfeit reporting . 38
4.14.5 EU counterfeit reporting . 38
4.14.6 UKEA anti-counterfeiting forum . 38
Annex A (informative) Useful contacts . 40
A.1 World Intellectual Property Organization (WIPO) . 40
A.1.1 General . 40
A.1.2 What is WIPO? . 40
A.1.3 WIPO Intellectual Property Services . 40
A.1.4 WIPO global network on Intellectual Property (IP) Academies. 42
A.2 Anti-Counterfeiting Trade Agreement (ACTA) . 44
A.2.1 ACTA . 44

– 4 – IEC TS 62668-1:2014 © IEC 2014
A.2.2 Global Anti-Counterfeiting Network (GACG) . 44
A.3 World Semiconductor Council (WSC) . 44
A.4 SEMI . 45
A.5 Electronics Authorized Directory . 46
A.6 UK . 46
A.6.1 The UK intellectual property office . 46
A.6.2 Alliance for IP . 47
A.6.3 UK Trading Standards Institute . 47
A.6.4 UK HM Revenue and Customs . 47
A.6.5 ESCO Anti-counterfeiting Forum (formerly UKEA Anti-Counterfeiting
Forum). 48
A.6.6 Electronic Component Supplier Network (ESCN) . 48
A.6.7 UK Ministry of Defence . 48
A.7 Europe . 48
A.7.1 Europa Summaries of EU Legislation . 48
A.7.2 Europol, the European Law Enforcement Agency. 49
A.7.3 European Patent Office . 49
A.7.4 Europe at OHIM . 49
A.7.5 European Aviation Safety Agency (EASA) . 50
A.7.6 IECQ audit schemes . 50
A.7.7 BEAMA . 50
A.8 USA . 50
A.8.1 United States Patent and Trademark Office . 50
A.8.2 The International Trade Administration, U.S. Department of Commerce . 51
A.8.3 USA Embassy in China information . 51
A.8.4 International Intellectual Property Alliance . 52
A.8.5 The FAA . 53
A.8.6 FAA Engine Approval . 53
A.8.7 FAA Aviation Safety Hotline office . 53
A.8.8 Trusted Access Program Office (TAPO) . 53
A.8.9 Defense Microelectronics Activity (DMEA) . 53
A.8.10 Independent Distributors of Electronic Association (IDEA) . 54
A.8.11 ECIA formerly National Electronic Distributors Association (NEDA) . 54
A.8.12 Components Technology Institute Inc (CTI) . 55
A.8.13 Defense Logistics Agency (DLA) . 55
A.8.14 DFAR progress . 55
A.8.15 IAQG . 56
A.9 China . 56
A.9.1 State Intellectual Property office of the P.R.C. . 56
A.9.2 Chinese Patent and Trademark Office . 56
A.9.3 Chinese Electronic Purchasing Association (CEPA) and the RECS
scheme . 56
A.9.4 China Quality Management Association for Electronics Industry (CQAE) . 57
A.9.5 Chinalawinfo.Co Ltd., for Law info China . 57
A.9.6 China Anti-counterfeit Technology Association (CATA) . 58
A.10 Japan – Japanese Patent Office . 58
A.11 Physical unclonable function . 58
A.12 The Hardware Intrinsic Security (HIS) initiative . 59
A.13 Examples of tag provider . 59

A.14 Examples of Tamperproof design companies . 60
A.15 Examples of FPGA Die serialisation . 60
A.16 Examples of NOVRAM manufacturers . 60
A.17 SAE G-19 . 60
A.18 iNEMI. 62
Annex B (informative) Examples of aftermarket sources . 63
B.1 Examples of franchised aftermarket sources . 63
B.2 Examples of sources of franchised die which can be packaged . 63
B.3 Examples of third party custom packaging houses which provide aftermarket
solutions . 63
B.4 Examples of emulated aftermarket providers . 63
Annex C (informative) Typical example of a RECS certificate . 64
Annex D (informative) Flowchart of IEC/TS 62668-1 requirements . 65
Bibliography . 66

Figure 1 – Suspect components perimeter . 19

Table 1 – Anti-counterfeit awareness training guidelines . 16
Table 2 – IEC/TS 62668-1 requirements waived if OEM has an approved SAE
AS5553A plan . 34

– 6 – IEC TS 62668-1:2014 © IEC 2014
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –
Part 1: Avoiding the use of counterfeit, fraudulent
and recycled electronic components

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62668-1, which is a technical specification, has been prepared by IEC technical
committee 107: Process management for avionics.

This second edition cancels and replaces the first edition, published in 2012. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) Update of “fraudulent component” definition, addition of “recycled component” and
“suspect component” definitions, and updates of the concerned clauses accordingly.
b) Addition of counterfeit awareness training as a requirement.
c) Revision to update all references and web links in the annexes.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/226/DTS 107/235/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62668 series, published under the general title Process
management for avionics – Counterfeit prevention, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 8 – IEC TS 62668-1:2014 © IEC 2014
PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –
Part 1: Avoiding the use of counterfeit, fraudulent
and recycled electronic components

1 Scope
This part of IEC 62668, which is a Technical Specification, defines requirements for avoiding
the use of counterfeit, recycled and fraudulent components used in the aerospace, defence
and high performance (ADHP) industries. It also defines requirements for ADHP industries to
maintain their intellectual property (IP) for all of their products and services. The risks
associated with purchasing components outside of franchised distributor networks are
considered in IEC/TS 62668-2. Although developed for the avionics industry, this specification
may be applied by other high performance and high reliability industries at their discretion.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC/TS 62239-1, Process management for avionics – Management plan – Part 1: Preparation
and maintenance of an electronic components management plan
IEC/PAS 62435, Electronic components – Long-duration storage of electronic components –
Guidance for implementation
IEC/TS 62668-2, Process management for avionics – Counterfeit prevention – Part 2:
Managing electronic components from non-franchised sources
ISO 9001, Quality management systems – Requirements
AS/EN/JISQ 9100, Quality Management Systems – Requirements for Aviation, Space and
Defense Organizations
AS/EN/JISQ 9110:2003, Quality Maintenance Systems – Aerospace – Requirements for
Maintenance Organizations
AS/EN/JISQ 9120, Quality Management Systems – Requirements for Aviation, Space and
Defense Distributors
GEIA-STD-0016, Standard for Preparing a DMSMS Management Plan
IDEA-STD-1010B, Acceptability of electronic components distributed in the open market
SAE AS5553A Counterfeit Electronic Parts; Avoidance, Detection, Mitigation and Disposition
SAE AS6081 Fraudulent/Counterfeit Electronic Parts: Avoidance, Detection, Mitigation and
Disposition – Distributors Verification Criteria

SAE AS6174, Counterfeit Material: Detection, Mitigation and Disposition
3 Terms, definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1.1
aftermarket source
reseller which may or may not be under contract with the original component manufacturer
(OCM), or is sometimes a component “re-manufacturer”, under contract with the OCM
Note 1 to entry: The reseller accumulates inventories of encapsulated or non-encapsulated (wafer) components
whose end of life date has been published by the OCM. These components are then resold at a profit to fill a need
within the market for components that have become obsolete.
3.1.2
broker
individual or corporate organization that serves as an intermediary between buyer and seller
Note 1 to entry: In the electronic component sector a broker specifically seeks to supply obsolete or hard to find
components in order to turn a profit. To do so it may accumulate an inventory of components considered to be of
strategic value or may rely on inventories accumulated by others. The broker operates within a worldwide
component exchange network.
3.1.3
COTS
commercial off-the-shelf products
one or more pieces, mechanical or electrical, developed for multiple commercial consumers,
whose design and/or configuration is controlled by the supplier’s specification or industry
standard
Note 1 to entry: They can include electronic components, subassemblies, or top level assemblies. COTS
subassemblies include circuit card assemblies, power supplies, hard drives, and memory modules. Top-level COTS
assemblies include a fully integrated rack of equipment such as raid arrays, file servers to individual switches,
routers, personal computers, or similar equipment.
3.1.4
counterfeit, verb
action of simulating, reproducing or modifying a material good or its packaging without
authorization
Note 1 to entry: It is the practice of producing products which are imitations or are fake goods or services. This
activity infringes the intellectual property rights of the original manufacturer and is an illegal act. Counterfeiting
generally relates to wilful trademark infringement.
3.1.5
counterfeited component
material good imitating or copying an authentic material good which may be covered by the
protection of one or more registered or confidential intellectual property rights
Note 1 to entry: A counterfeited component is one whose identity or pedigree has been altered or misrepresented
by its supplier.
Identity = original manufacturer, part number, date code, lot number, testing, inspection, documentation or warranty
etc.
Pedigree = origin, ownership history, storage, handling, physical condition, previous use etc.
___________
Although published this is being revised for material component only.

– 10 – IEC TS 62668-1:2014 © IEC 2014
3.1.6
customer device specification
device specification written by a user and agreed by the supplier
3.1.7
customer
user
original equipment manufacturer (OEM) which purchases electronic components, including
integrated circuits and/or semiconductor devices compliant with this technical specification,
and uses them to design, produce, and maintain systems
3.1.8
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
3.1.9
franchised distributor or agent
individual or corporate organisation that is legally independent from the franchiser (in this
case the electronic component manufacturer or OCM) and agrees under contract to distribute
products using the franchiser’s name and sales network
Note 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the
franchiser. Shipments against orders placed can be despatched either direct from the OCM or the franchised
distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more
electronic component manufacturers to distribute and sell the said components. Distribution agreements may be
stipulated according to the following criteria: geographical area, type of clientele (avionics for example), maximum
manufacturing lot size. Components sourced through this route are protected by the OCM’s warranty and supplied
with full traceability.
3.1.10
fraudulent component
electronic component produced or distributed either in violation of regional or local law or
regulation, or with the intent to deceive the customer
Note 1 to entry: This includes but is not limited to the following which are examples of components which are
fraudulently sold as new ones to a customer:
(1) a stolen component;
(2) a component scrapped by the original component manufacturer (OCM) or by any user;
(3) a recycled component, that becomes a fraudulent recycled component when it is a disassembled
component resold as a new component (see Figure 1), where typically there is evidence of prior use and
rework (e.g. solder, re-plating or lead re-attachment activity) on the component package terminations;
(4) a counterfeit component, a copy, an imitation, a full or partial substitute of brands;
(5) fraudulent designs, models , patents, software or copyright sold as being new and authentic, For example:
a component whose production and distribution are not controlled by the original manufacturer;
(6) unlicensed copies of a design;
(7) a disguised component (remarking of the original manufacturer’s name, reference date/code or other
identifiers etc.),which may be a counterfeit component; see Figure 1;
(8) a component without an internal silicon die or with a substituted silicon die which is not the original
manufacturer’s silicon die.
3.1.11
microcircuit
component
device
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use and is a small circuit having a high equivalent circuit element

density which is considered as a single part composed of interconnected elements on or
within a single substrate to perform an electronic circuit function
Note 1 to entry: This excludes printed wiring boards/printed circuit boards, circuit card assemblies and modules
composed exclusively of discrete electronic components.
3.1.12
non-franchised distributor
companies which do not fall under a franchised distributor or OCM
Note 1 to entry: These distributors may purchase components from component manufacturers, franchised
distributors, or through other supply channels (open markets). These distributors cannot always provide the
guarantees and support provided by the franchised distributor network; components sourced through this source
are usually protected by the source’s warranty only. However, some of them are able to purchase traceable
components and/or to provide traceability paperwork and/or are able to return stock for investigation to the OCM.
3.1.13
OCM
original component manufacturer
company specifying and manufacturing the electronic component
3.1.14
OEM
original equipment manufacturer
manufacturer which defines the electronic subassembly that includes the electronic
components or defines the components used in an assembly and/or test specification
3.1.15
piracy
willful copyright infringement
3.1.16
reseller
general supplier which offers a selection of electronic components to order from a catalog
3.1.17
recycled component
electrical component removed from its original product or assembly and available for reuse
Note 1 to entry: The component has authentic logos, trademarks and markings. However, it typically has no
output to measure the useful life remaining for its reuse. A recycled component can fail earlier than a new one
when re-assembled into another product or assembly. A recycled component may also be physically or ESD
damaged during the removal process.
3.1.18
semiconductor
electronic component in which the characteristic distinguishing electronic conduction takes
place within a semiconductor
Note 1 to entry: This includes semiconductor diodes which are semiconductor devices having two terminals and
exhibiting a nonlinear voltage-current characteristic and transistors which are active semiconductor devices
capable of providing power amplification and having three or more terminals.
3.1.19
subcontractor
manufacturer of electronic subassemblies or supplier manufacturing items in compliance with
customer design data pack and drawings, and under the authority of the OEM
Note 1 to entry: This supplier can potentially procure all or part of the electronic components required to produce a
subassembly and is often referred to as the contract electronic manufacturer (CEM) or electronics manufacturing
services (EMS).
– 12 – IEC TS 62668-1:2014 © IEC 2014
3.1.20
supplier
company which provides to another an electronic component which is identified by the logo or
name marked on the device
Note 1 to entry: A supplier can be an OCM, a franchised distributor or agent, a non-franchised distributor, broker,
reseller, OEM, CEM, and EMS, etc.
3.1.21
suspect component
electronic component which has lost supply chain traceability back to the original
manufacturer and which may have been misrepresented by the supplier or manufacturer and
may meet the definition of fraudulent or counterfeit component
Note 1 to entry: Suspect components may include but are not limited to:
(1) counterfeit components;
(2) recycled components coming from uncontrolled recycling operations carried outside of the OEM, franchised
network and OEM business where typically it has been fraudulently sold to the OEM as being in a new
unused condition.
3.1.22
traceability
ability to have for an electronic component its full trace back to the original component
manufacturer
Note 1 to entry: This traceability means that every supplier in the supply chain is prepared to legally declare in
writing that they know and can identify their source of supply, which goes back to the original manufacturer and
can confirm that the electronic components are brand new and were handled with appropriate ESD and MSL
handling precautions. This authenticates that the electronic components being supplied are unused, brand new
components with no ESD, MSL or other damage. This ensures that the electronic components are protected by any
manufacturer’s warranties, have all of their useful life remaining and function according to the manufacturer’s
published datasheet, exhibiting the expected component life in the application for the OEM’s reliability predictions
and product warranty.
3.1.23
untraceable
property of electronic components which have lost their traceability (see 3.1.22)
3.2 Abbreviations
AAIPT Alliance Against IP Theft
ACTA Anti-Counterfeit Trade Agreement
ACTF Semiconductor Industries Association Anti Counterfeit Task Force
ADHP aerospace, defence and high performance
ASIC Application Specific Integrated Circuit
ATP acceptance test procedure
BEAMA British Electrotechnical Allied Manufacturers’ Association
CATA China Anti-counterfeit Technology Association
CB Certifying Bodies (Third Party)
COTS commercial off-the-shelf
CEM contract electronic manufacturer
CEPA Chinese Electronic Purchasing Association
CQAE China Quality Management Association for Electronics Industry
CMOS complementary metal oxide semiconductor
DFAR Defense Federal Acquisition Regulation
DOD Department of Defence (US)

DMEA Defense MicroElectronics Activity
DMSMS Diminishing Manufacturing Sources and Material Shortages
DNA Deoxyribonucleic acid
DSCC Defence Supply Centre Columbus
DLA Defense Logistics Agency (former DSCC)
EASA European Aviation Safety Agency
ECIA Electronic Components Industry Association
ECMP electronic component management plan
ECSN electronic component supplier network
EMS electronic manufacturing services
ERAI Electronic Reseller Association International
(see web-page http://www.erai.com)
ESD electrostatic discharge
EOS electrical overstress
EU European Union
FAA Federal Aviation Administration
FAR Federal Avionic Regulations
FFF form, fit and function
FIT failures in time
FPGA field-programmable gate array
FSC Federal Supply Class
G-19 SAE Counterfeit Electronic Parts Committee
GAMS Government/Authorities meeting on Semiconductors
GIFAS French Aerospace Association
HAST highly accelerated stress test
HIS Hardware Intrinsic Security
HTOL high temperature operating life
ID independent distributors
IDEA Independent Distributors of Electronics Association
IAQG International Aerospace Quality Group – SAE
iNEMI International Electronics Manufacturing Initiative
IP intellectual property
IPR intellectual property rights
ISP internet service provider
ITAR International Traffic in Arms Regulations
IUID Item Unique Identification
JIT just in time
JPO Japanese Patent Office
LTB last time buy
LDC lot date code
MBTF mean time between failures
MOD Ministry of Defence, UK
MTTF mean time to failure
– 14 – IEC TS 62668-1:2014 © IEC 2014
MSL moisture sensitivity level
NDAA National Defense Acquisition Act
NEDA National Electronics Distributors Association
NOVRAM non-volatile random access memory
OCM original component manufacturer
OEM original equipment manufacturer
OHIM Office for Harmonisation in the
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