Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines

IEC 61837-1:2012 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures and is based on IEC 61240.
This publication is to be read in conjunction with IEC 61240:1994.

Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 1: Encombrements des enveloppes en plastique moulées

La CEI 61837-1:2012 traite des encombrements normalisés et connexions des sorties des dispositifs à montage en surface pour la commande et le choix de la fréquence, applicables aux enveloppes en plastique moulées, et elle est basée sur la CEI 61240.
Cette publication doit être lue conjointement avec la CEI 61240:1994.

General Information

Status
Published
Publication Date
19-Apr-2012
Current Stage
PPUB - Publication issued
Start Date
30-Apr-2012
Completion Date
20-Apr-2012
Ref Project

Relations

Overview

IEC 61837-1:2012 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the standard outlines and terminal lead connections for surface mounted piezoelectric devices (SMDs) for frequency control and selection. This part focuses exclusively on devices housed in plastic moulded enclosures and provides dimensional outlines, terminal configurations, and designation systems to ensure uniformity and interoperability in electronic component design.

This standard builds upon and complements IEC 61240:1994, which addresses general rules for preparing outline drawings of surface-mounted piezoelectric devices. The 2012 edition brings essential updates, notably the removal of one enclosure type and the consolidation of enclosure configuration symbols, responding to evolving industry practices.

Key Topics

  • Scope and Purpose
    IEC 61837-1:2012 targets manufacturers, designers, and users of SMD piezoelectric frequency control components. It defines plastic moulded enclosure dimensions, terminal lead configurations, and type designations to standardize physical and electrical interfaces in electronic systems.

  • Configuration Symbols
    The standard uses the DCC (dual chip carrier) symbol to describe the enclosure configuration, representing devices that house two chip components within a single plastic package.

  • Designation System
    The device type designation is composed of four parts:

    • A: Configuration symbol (e.g., DCC)
    • B: Structure of terminal leads ('J' for leaded type)
    • C: Number of terminal leads
    • D: Two-digit serial number (identifies specific enclosure outline)
  • Plastic Moulded Enclosure Dimensions
    The standard provides exact dimensional data and tolerance limits for multiple device outlines (e.g., DCC-J4/01 to DCC-J4/08) with four folded leads. This ensures compatibility with automated assembly and soldering processes in electronics manufacturing.

  • Terminal Lead Connections
    Recommendations specify lead functions for different device types-crystal units, oscillators, and filters-including control voltage, ground, output, and DC supply. The detailed terminal assignment ensures consistent electrical interfacing and function across devices.

Applications

IEC 61837-1:2012 is crucial for:

  • Electronic Component Manufacturers
    Ensuring that SMD piezoelectric devices conform to internationally accepted outlines and lead connections enhances market acceptance and compatibility with automated assembly lines.

  • PCB Designers and Electronics Engineers
    Using standardized device outlines simplifies footprint design, improves reliability, and allows cross-manufacturer substitution without redesign.

  • Quality Assurance and Testing
    Standardized terminal connections and outlines facilitate inspection, testing, and certification processes.

  • Frequency Control in Communications and Computing
    SMD piezoelectric devices standardized by IEC 61837-1 are widely used in oscillators, filters, and frequency selectors in telecommunications, computing hardware, and consumer electronics.

Related Standards

  • IEC 61240:1994
    Covers the general rules for preparation of outline drawings for SMD piezoelectric devices-mandatory to be used in conjunction with IEC 61837-1.

  • Other Parts of IEC 61837 Series
    The series extends to additional parts covering other enclosure types and materials for surface mounted piezoelectric devices, facilitating comprehensive device standardization.

  • ISO/IEC Directives, Part 2
    This provides guidance on drafting international standards and ensures harmonized document structure and terminology.

Practical Benefits and Keywords

Implementing IEC 61837-1:2012 enables manufacturers and users to benefit from:

  • Interchangeability and uniformity of SMD piezoelectric devices
  • Reduced design errors due to clear enclosure and lead connection specifications
  • Optimized production processes with consistent device outlines
  • Enhanced reliability of frequency control components in electronic circuits

Keywords: IEC 61837-1, surface mounted piezoelectric device, frequency control, plastic moulded enclosure, SMD outlines, terminal lead connections, crystal oscillator package, frequency selection device, dual chip carrier, electronic component standard, international standard IEC, piezoelectric device dimensions.

Standard
IEC 61837-1:2012 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines
English and French language
44 pages
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Frequently Asked Questions

IEC 61837-1:2012 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines". This standard covers: IEC 61837-1:2012 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures and is based on IEC 61240. This publication is to be read in conjunction with IEC 61240:1994.

IEC 61837-1:2012 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures and is based on IEC 61240. This publication is to be read in conjunction with IEC 61240:1994.

IEC 61837-1:2012 is classified under the following ICS (International Classification for Standards) categories: 31.140 - Piezoelectric devices. The ICS classification helps identify the subject area and facilitates finding related standards.

IEC 61837-1:2012 has the following relationships with other standards: It is inter standard links to IEC 61837-1:1999. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

You can purchase IEC 61837-1:2012 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of IEC standards.

Standards Content (Sample)


IEC 61837-1 ®
Edition 2.0 2012-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –
Standard outlines and terminal lead connections –
Part 1: Plastic moulded enclosure outlines

Dispositifs piézoélectriques à montage en surface pour la commande et le choix
de la fréquence – Encombrements normalisés et connexions des sorties –
Partie 1: Encombrements des enveloppes en plastique moulées

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IEC 61837-1 ®
Edition 2.0 2012-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounted piezoelectric devices for frequency control and selection –

Standard outlines and terminal lead connections –

Part 1: Plastic moulded enclosure outlines

Dispositifs piézoélectriques à montage en surface pour la commande et le choix

de la fréquence – Encombrements normalisés et connexions des sorties –

Partie 1: Encombrements des enveloppes en plastique moulées

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.140 ISBN 978-2-8322-0078-0

– 2 – 61837-1 © IEC:2012
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Configuration of enclosures . 5
4 Designation of types . 5
5 Plastic moulded enclosure dimensions . 6
6 Lead connections . 6
7 Plastic moulded enclosures . 6

Table 1 – Designation of plastic moulded enclosures . 6

61837-1 © IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTED PIEZOELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 1: Plastic moulded enclosure outlines

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
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consensus of opinion on the relevant subjects since each technical committee has representation from all
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
lnternational Standard IEC 61837-1 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency
control, selection and detection.
This second edition cancels and replaces the first edition published in 1999. It is a technical
revision.
This edition includes the following significant technical changes with respect to the previous
edition:
• one enclosure type (SIP-L5/01) has been deleted;
• Configuration symbol of enclosures is currently consolidated into one as DCC (dual chip
carrier).
– 4 – 61837-1 © IEC:2012
The text of this standard is based on the following documents:
CDV Report on voting
49/930/CDV 49/969/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This lnternational Standard shall be read in conjunction with IEC 61240:1994. IEC 61240:1994
deals with standard outlines and terminal lead connections as they apply to SMDs for frequency
control and selection in plastic moulded enclosures.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 61837 series, published under the general title Surface mounted
piezoelectric devices for frequency control and selection – Standard outlines and terminal lead
connections, can be found on the IEC web site.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
61837-1 © IEC:2012 – 5 –
SURFACE MOUNTED PIEZOELECTRIC DEVICES
FOR FREQUENCY CONTROL AND SELECTION –
STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS –

Part 1: Plastic moulded enclosure outlines

1 Scope
This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply
to SMDs for frequency control and selection in plastic moulded enclosures and is based on
IEC 61240.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
IEC 61240: 1994, Piezoelectric devices – Preparation of outline drawings of surface-mounted
devices (SMD), for frequency control and selection – General rules
3 Configuration of enclosures
These enclosures are made of plastic moulded materials with the terminal leads based on the
descriptive designation system for semiconductors, devices package.
The configuration symbols are shown as follows:
– DCC (dual chip carrier)
4 Designation of types
The designation of types is shown in four parts as follows:

A B C D D’
A: Configuration symbol of enclosures:
– DCC (dual chip carrier);
B: Structure of terminal leads:
– J: leaded type;
C: Number of terminal leads
D: Two digit serial number
___________
A new edition is under consideration.

– 6 – 61837-1 © IEC:2012
5 Plastic moulded enclosure dimensions
The dimensions in this standard apply to all the completed SMD-devices for frequency control
and selection. Only those dimensions are given which meet the requirements of IEC 61240.
6 Lead connections
Recommendations for the lead connections of all completed SMD-devices for frequency control
and selection are given in the following individual sheets. Lead connections shall always be
given in the detail specification.
7 Plastic moulded enclosures
The following table sets out the designation of the plastic moulded enclosures as outlined in the
ensuing specification sheets.
Table 1 – Designation of plastic moulded enclosures
No. Type Sheet No. Description
1 DCC-J4/01 Sheet 1 Plastic, moulded, four folded leads SMD outline
2 DCC-J4/02 Sheet 2 Plastic, moulded, four folded leads SMD outline
3 DCC-J4/03 Sheet 3 Plastic, moulded, four folded leads SMD outline
4 DCC-J4/04 Sheet 4 Plastic, moulded, four folded leads SMD outline
5 DCC-J4/05 Sheet 5 Plastic, moulded, four folded leads SMD outline
6 DCC-J4/06 Sheet 6 Plastic, moulded, four folded leads SMD outline
7 DCC-J4/07 Sheet 7 Plastic, moulded, four folded leads SMD outline
8 DCC-J4/08 Sheet 8 Plastic, moulded, four folded leads SMD outline

61837-1 © IEC:2012 – 7 –
Dimensions (mm)
Actual size
Ref. Notes
Min. Nom. Max.
A 14,00
B 8,90
4,70
G
G 4,20
K
0,40 0,60
K 0,20 0,30
9,40 9,80
F
L 1,70 2,10
B
e 5,08
A
e 7,62
b 0,80
l 2,30
0,10
y
A 0,30
b 0,40 0,60
p
L 1,00 1,60
p
1 2
Terminal land areas
b
S
y S
e e
Terminal configuration
K
K
L
p
IEC  519/12
Plastic, moulded, four folded leads SMD outline, type Scale
DCC-J4/01 2:1
Sheet 1
G
L G
B
B
F
A
e
b
p
l
– 8 – 61837-1 © IEC:2012
Terminal lead connections
If the presence of any leads is optional, or if an enclosure is supplied with less than the maximum
number of leads, this shall be indicated in the detail specification.
Type of SMD Lead No. Crystal unit Crystal oscillator Crystal filter
1 Control voltage
DCC-J4/01
2 Ground
3 Output
4 DC supply
61837-1 © IEC:2012 – 9 –
Dimensions (mm)
Actual size
Ref. Notes
Min. Nom. Max.
10,50
A
B 5,30
2,70
G
G 2,50
K
0,40 0,60
K 0,15 0,25
5,80
F
L 0,80 1,20
B
e 5,08
e 4,60
A
b 0,80
l 1,40
4 3
y 0,10
A 0,20
b 0,40 0,60
p
1 2
L 0,60 1,20
p
Terminal land areas
b
S
y
S
e
e
Terminal configuration
K
K
L
p
IEC  520/12
Plastic, moulded, four folded leads SMD outline, type Scale
DCC-J4/02 2:1
Sheet 2
G
L
G
B 1 B
F
A
e
b
p
l
– 10 – 61837-1 © IEC:2012
Terminal lead connections
If the presence of any leads is optional, or if an enclosure is supplied with less than the maximum
number of leads, this shall be indicated in the detail specification.
Type of SMD Lead No. Crystal unit Crystal oscillator Crystal filter
1 Control voltage
DCC-J4/02
2 Ground
3 Output
4 DC supply
61837-1 © IEC:2012 – 11 –
Dimensions (mm)
Ref. Notes
Actual size
Min. Nom. Max.
9,10
A
11,20
B
G 3,00
G 2,80
K 0,80 1,10
K 0,20 0,35
12,00
F
L 0,90 1,20
B
5,08
e
A
e 10,70
4 3
b
1,30
l 1,40
0,10
y
A 0,30
b
0,80 1,10
p
L 0,80 1,10
p
1 2
Terminal land areas
b
S
y S
e
K
Terminal configuration
K
L
p
e
IEC  521/12
Plastic, moulded, four folded leads SMD outline, type Scale
DCC-J4/03 2:1
Sheet 3
G
L
B
G
1 B
F
A
e
b
p
l
– 12 – 61837-1 © IEC:2012
Terminal lead connections
If the presence of any leads is optional, or if an enclosure is supplied with less than the maximum
number of leads, this shall be indicated in the detail specification.
Type of SMD Lead No. Crystal unit Crystal oscillator Crystal filter
DCC-J4/03
1 Terminal 1 Control voltage
2 NC Ground
3 NC Output
4 Terminal 2 DC supply
61837-1 © IEC:2012 – 13 –
Dimensions (mm)
Ref. Notes
Actual size
Min. Nom. Max.
9,10
A
8,20
B
G 3,00
G 2,80
K 0,80 1,10
K 0,20 0,35
10,00
F
L
0,90 1,20
B
5,08
e
A
e 8,70
b 1,30
4 3
l
1,40
y 0,10
A 0,30
b 0,80 1,10
p
1 2
L
0,80 1,10
p
Terminal land areas
b
S
y S
e
K
Terminal configuration
K
L
e p
IEC  522/12
Plastic, moulded, four folded leads SMD outline, type Scale
DCC-J4/04 2:1
Sheet 4
L G
B
G
B
F
A
e
b
p
l
– 14 – 61837-1 © IEC:2012
Terminal lead connections
If the presence of any leads is optional, or if an enclosure is supplied with less than the maximum
number of leads, this shall be indicated in the detail specification.
Type of SMD Lead No. Crystal unit Crystal oscillator Crystal filter
DCC-J4/04
1 Terminal 1 Control voltage
2 NC Ground
3 NC Output
4 Terminal 2 DC supply
61837-1 © IEC:2012 – 15 –
Dimensions (mm)
Ref. Notes
Actual size
Min. Nom. Max.
9,10
A
8,20
B
G 3,00
G 2,80
K 0,80 1,10
K 0,20 0,35
9,00
F
L
0,90 1,20
B
5,08
e
A
e 7,70
b 1,30
4 3
l
1,40
y 0,10
A 0,30
b 0,80 1,10
p
1 2
L
0,80 1,10
p
Terminal land areas
b
S
y S
e
K
Terminal configuration
K
L
e p
IEC  523/12
Plastic, moulded, four folded leads SMD outline, type Scale
DCC-J4/05 2:1
Sheet 5
L G
B
G
B
F
A
e
b
p
l
– 16 – 61837-1 © IEC:2012
Terminal lead connections
If the presence of any leads is optional, or if an enclosure is supplied with less than the maximum
number of leads, this shall be indicated in the detail specification.
Type of SMD Lead No. Crystal unit Crystal oscillator Crystal filter
DCC-J4/05
1 Terminal 1 Control voltage
2 NC Ground
3 NC Output
4 Terminal 2 DC supply
61837-1 © IEC:2012 – 17 –
Dimensions (mm)
Ref. Notes
Actual size
Min. Nom. Max.
13,40
A
4,60
B
G 5,00
G 4,60
K 1,40 1,80
K 0,10 0,20
K 2,80
3,20
F 4,60 5,10
L 1,00 1,40
B
9,40
e
e 3,60
A
b
2,00
b
3,40
4 3
l 1,60
y
0,20
A 0,30
1 2
b
1,50 1,90
p1
b
2,90 3,30
p2
L 1,00 1,40
p
Terminal land areas
S
b b
2 3
y
S
e
e
Terminal configuration
K K
1 3
K
L
p
IEC  524/12
Plastic, moulded, four folded leads SMD outline, type Scale
DCC-J4/06 2:1
Sheet 6
G
L
G
B
B
F
A
e
b
p
l
– 18 – 61837-1 © IEC:2012
Terminal lead connections
If the presence of any leads is optional, or if an enclosure is supplied with less than the maximum
number of leads, this shall be indicated in the detail specification.
Type of SMD Lead No. Crystal unit Crystal oscillator Crystal filter
DCC-J4/06
1 Terminal 1
2 NC
3 NC
4 Terminal 2
61837-1 © IEC:2012 – 19 –
Dimensions (mm)
Actual size Ref. Notes
Min. Nom. Max.
11,70
A
4,20
B
G 3,70
G 3,60
K 0,80
0,60
K 0,20
0,10
F 4,40 4,80
L 1,40
1,00
B
9,60
e
e 3,40
b
1,00
A
b
1,00
l 1,60
4 3
0,10
y
A
0,20
b 0,80
0,60
1 2 p
L 1,40
0,80
p
Terminal land areas
b b
2 3
S
y S
e
e
Terminal configuration
K
K
L
p
IEC  525/12
Plastic, moulded, four folded leads SMD outline, type Scale
DCC-J4/07 2:1
Sheet 7
G
L
G
B
B
F
A
e
b
p
l
------
...

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제목: IEC 61837-1:2012 - 표면 마운트 피에조전 구성 요소를 위한 표준 아웃라인 및 단자 리드 연결 - 부품 1: 플라스틱 주조함 아웃라인 IEC 61837-1:2012는 플라스틱 주조함에서 주파수 제어와 선택에 대한 표면 마운트 피에조전 구성 요소 (SMD)를 다루며, 표준 아웃라인 및 단자 리드 연결에 관련되어 있다. 해당 표준은 IEC 61240에 기반을 두고 있으며, IEC 61240:1994와 함께 읽어야 한다.

記事のタイトル: IEC 61837-1:2012 - 頻度制御と選択のための表面実装型圧電デバイスに関する標準アウトラインと端子リード接続 - 第1部: プラスチック成形筐体のアウトライン IEC 61837-1:2012は、プラスチック成形筐体内で使用される頻度制御と選択のための表面実装型圧電デバイス(SMD)の標準アウトラインと端子リード接続に関する規格です。この規格は、IEC 61240に基づいており、IEC 61240:1994と共に読む必要があります。

IEC 61837-1:2012 is a standard that focuses on the outlines and terminal lead connections of surface mounted piezoelectric devices (SMDs) used for frequency control and selection in plastic moulded enclosures. This standard is based on IEC 61240 and should be read along with it.