IEC 61188-5-5:2007

IEC 61188-5-5
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-5: Attachment (land/joint) considerations – Components with gull-wing
leads on four sides
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IEC 61188-5-5
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-5: Attachment (land/joint) considerations – Components with gull-wing
leads on four sides
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 31.180 ISBN 2-8318-9342-9
– 2 – 61188-5-5 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references .7
3 General information.7
3.1 General component description .7
3.2 Marking .7
3.3 Carrier packaging format .8
3.4 Process considerations .8
4 PQFP (square) .8
4.1 Field of application .8
4.2 Component descriptions .8
4.3 Component dimensions .9
4.4 Solder joint fillet design .13
4.5 Land pattern dimensions .14
5 PQFP (rectangular) .17
5.1 Field of application .17
5.2 Component descriptions .18
5.3 Component dimensions .19
5.4 Solder joint fillet design .19
5.5 Land pattern dimensions .21
6 PLQFP (square) .23
6.1 Field of application .23
6.2 Component descriptions .23
6.3 Component dimensions .24
6.4 Solder joint fillet design .26
6.5 Land pattern dimensions .28
7 PLQFP (rectangular) .31
7.1 Field of application .31
7.2 Component descriptions .31
7.3 Component dimensions .32
7.4 Solder joint fillet design .33
7.5 Land pattern dimensions .34
8 PTQFP (square) .35
8.1 Field of application .35
8.2 Component descriptions .35
8.3 Component dimensions .36
8.4 Solder joint fillet design .39
8.5 Land pattern dimensions .40

Figure 1 – PQFP (square).9
Figure 2 – PQFP (square) component dimensions .10
Figure 3 – Solder joint fillet design.14
Figure 4 – PQFP (square) land pattern dimensions.17

61188-5-5 © IEC:2007(E) – 3 –
Figure 5 – PQFP (rectangular) .18
Figure 6 – PQFP (rectangular) component dimensions .19
Figure 7 – Solder joint fillet design.21
Figure 8 – PQFP (rectangular) land pattern dimensions .22
Figure 9 – PLQFP (square) .23
Figure 10 – PLQFP (square) component dimensions .24
Figure 11 – Solder joint fillet design.28
Figure 12 – PLQFP (square) land pattern dimensions .31
Figure 13 – PLQFP (rectangular) .32
Figure 14 – PLQFP (rectangular) component dimensions.32
Figure 15 – Solder joint fillet design.34
Figure 16 – PLQFP (rectangular) land pattern dimensions .35
Figure 17 – PTQFP (square).36
Figure 18 – PTQFP component dimensions .37
Figure 19 – Solder joint fillet design.40
Figure 20 – PTQFP land pattern dimensions.42

– 4 – 61188-5-5 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-5: Attachment (land/joint) considerations –
Components with gull-wing leads on four sides

FOREWORD
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61188-5-5 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/704/FDIS 91/736/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 61188-5-5 is to be read in conjunction with IEC 61188-5-1.

61188-5-5 © IEC:2007(E) – 5 –
A list of all parts of the IEC 61188 series, under the general title Printed boards and printed
board assemblies – Design and use, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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