IEC 62435-5:2017

IEC 62435-5 ®
Edition 1.0 2017-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electronic components – Long-term storage of electronic semiconductor
devices –
Part 5: Die and wafer devices
Composants électroniques – Stockage de longue durée des dispositifs
électroniques à semiconducteurs –
Partie 5: Dispositifs de puces et plaquettes

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IEC 62435-5 ®
Edition 1.0 2017-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electronic components – Long-term storage of electronic semiconductor

devices –
Part 5: Die and wafer devices
Composants électroniques – Stockage de longue durée des dispositifs

électroniques à semiconducteurs –

Partie 5: Dispositifs de puces et plaquettes

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020 ISBN 978-2-8322-3837-0

– 2 – IEC 62435-5:2017 © IEC 2017
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviations . 9
4 Storage requirements . 9
4.1 General . 9
4.2 Assembly data . 9
4.3 Prerequisite for storage. 9
4.4 Damage to die products during long-term storage . 9
4.5 Mechanical storage conditions . 10
4.6 Long-term storage environment . 10
4.7 Recommended inert atmosphere purity . 11
4.8 Chemical contamination . 11
4.9 Vacuum packing . 11
4.9.1 General . 11
4.9.2 Vacuum dry pack . 11
4.10 Positive pressure systems for packing . 11
4.11 Use of packing material having sacrificial properties . 11
4.12 Use of bio-degradable material . 12
4.13 Plasma cleaning . 12
4.14 Electrical effects . 12
4.15 Protection from radiation . 12
4.16 Periodic qualification of stored die products . 12
5 Long-term storage failure mechanisms . 13
6 LTS concerns, method, verification and limitations . 13
6.1 General . 13
6.2 Wafers . 13
6.3 Bare dice . 14
7 Deterioration mechanisms specific to bare die and wafers . 15
7.1 Wire bondability . 15
7.2 Staining . 15
7.3 Topside delamination . 16
8 Specific handling concerns . 16
8.1 Die on wafer film frames . 16
8.2 Devices and dice embossed or punched tape storage . 16
8.3 Handling damage . 16
Annex A (informative) Audit checklist . 17
Bibliography . 20

Table 1 – LTS exposure concerns for wafers . 14
Table 2 – LTS exposure concerns for bare dice . 15
Table A.1 – Planning checklist . 17

– 4 – IEC 62435-5:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –

Part 5: Die and wafer devices
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62435-5 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/2328/FDIS 47/2351/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 62435 series, published under the general title Electronic
components – Long-term storage of electronic semiconductor devices, can be found on the
IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 62435-5:2017 © IEC 2017
INTRODUCTION
This document applies to the long-duration storage of electronic components.
This is a document for long-term storage (LTS) of electronic devices drawing on the best long-
term storage practices currently known. For the purposes of this document, LTS is defined as
any device storage whose duration may be more than 12 months for product scheduled for
long duration storage. While intended to address the storage of unpackaged semiconductors
and packaged electronic devices, nothing in this document precludes the storage of other
items under the storage levels defined herein.
Although it has always existed to some extent, obsolescence of electronic components and
particularly of integrated circuits, has become increasingly intense over the last few years.
Indeed, with the existing technological boom, the commercial life of a component has become
very short compared with the life of industrial equipment such as that encountered in the
aeronautical field, the railway industry or the energy sector.
The many solutions enabling obsolescence to be resolved are now identified. However,
selecting one of these solutions should be preceded by a case-by-case technical and
economic feasibility study, depending on whether storage is envisaged for field service or
production, for example:
• remedial storage as soon as components are no longer marketed;
• preventive storage anticipating declaration of obsolescence.
Taking into account the expected life of some installations, sometimes covering several
decades, the qualification times, and the unavailability costs, which can also be very high, the
solution to be adopted to resolve obsolescence should often be rapidly implemented. This is
why the solution retained in most cases consists in systematically storing components which
are in the process of becoming obsolescent.
The technical risks of this solution are, a priori, fairly low. However, it requires perfect mastery
of the implemented process and especially of the storage environment, although this mastery
becomes critical when it comes to long-term storage.
All handling, protection, storage and test operations are recommended to be performed
according to the state of the art.
The application of the approach proposed in this standard in no way guarantees that the
stored components are in perfect operating condition at the end of this storage. It only
comprises a means of minimizing potential and probable degradation factors.
Some electronic device users have the need to store electronic devices for long periods of
time. Lifetime buys are commonly made to support production runs of assemblies that well
exceed the production timeframe of its individual parts. This puts the user in a situation
requiring careful and adequate storage of such parts to maintain the as-received solderability
and minimize any degradation effects to the part over time. Major degradation concerns are
moisture, electrostatic fields, ultra-violet light, large variations in temperature, air-borne
contaminants, and outgassing.
Warranties and sparing also present a challenge for the user or repair agency as some
systems have been designated to be used for long periods of time, in some cases for up to
40 years or more. Some of the devices needed for repair of these systems will not be
available from the original supplier for the lifetime of the system or the spare assembly may
be built with the original production run but then require long-term storage. This document
was developed to provide a standard for storing electronic devices for long periods of time.

For storage of devices that are moisture sensitive but that do not need to be stored for long
periods of time, refer to IEC TR 62258-3.
Long-term storage assumes that the device is going to be placed in uninterrupted storage for
a number of years. It is essential that it is useable after storage. Particular attention should be
paid to storage media surrounding the devices together with the local environment.
These guidelines do not imply any warranty of product or guarantee of operation beyond the
storage time given by the original device manufacturer.
The IEC 62435 series is intended to ensure that adequate reliability is achieved for devices in
user applications after long-term storage. Users are encouraged to request data from
suppliers to these specifications to demonstrate a successful storage life as requested by the
user. These standards are not intended to address built-in failure mechanisms that would take
place regardless of storage conditions.
These standards are intended to give practical guide to methods of long-term storage of
electronic components where this is intentional or planned storage of product for a number of
years. Storage regimes for work-in-progress production are managed according to company
internal process requirements and are not detailed in this series of standards.
The IEC 62345 series includes a number of parts. Parts 1 to 4 apply to any long-term storage
and contain general requirements and guidance, whereas Parts 5 to 9 are specific to the
type of product being stored. It is intended that the product specific part should be read
alongside the general requirements of Parts 1 to 4.
Electronic components requiring different storage conditions are covered separately starting
with Part 5.
The structure of the IEC 62435 series as currently conceived is as follows:
Part 1 – General
Part 2 – Deterioration mechanisms
Part 3 – Data
Part 4 – Storage
Part 5 – Die and wafer devices
Part 6 – Packaged or finished devices
Part 7 – MEMS
Part 8 – Passive electronic devices
Part 9 – Special cases
______________
Under preparation.
– 8 – IEC 62435-5:2017 © IEC 2017
ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –

Part 5: Die and wafer devices
1 Scope
This part of IEC 62435, is applicable to long-term storage of die and wafer devices and
establishes specific storage regimen and conditions for singulated bare die and partial or
complete wafers of die including die with added structures such as redistribution layers and
solder balls or bumps or other metallisation. This part also provides guidelines for special
requirements and primary packaging that contain the die or wafers for handling purposes.
Typically, this part is used in conjunction with IEC 62435-1 for long-term storage of devices
whose duration can be more than 12 months for products scheduled for long duration storage.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 62435-2, Electronic components – long-term storage of electronic semiconductor devices
– Part 2: Deterioration mechanisms
3 Terms, definitions and abbreviated terms
For the purposes of this document, the following terms, definitions and abbreviated terms
apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 Terms and definitions
3.1.1
storage environment
specially controlled storage area, with particular control of temperature, humidity, atmosphere
and any other conditions depending on the product requirements
3.1.2
long-term storage
LTS
planned storage of components to extend the life-cycle for a duration with the intention of
supporting future use
3.1.3
desiccant
hygroscopic substance used to remove moisture from an atmosphere

3.2 Abbreviations
MEMS microelectromechanical systems
rH relative humidity
ESD electro-static discharge
EMR electromagnetic radiation
RF radio frequency
MBB moisture barrier bag
HIC humidity indicator card
V voltage threshold
T
QSS surface state charge
I current off
OFF
V voltage off
OFF
VCI volatile corrosion inhibitors
ILD inter-layer dielectric
4 Storage requirements
4.1 General
This clause details requirements for storage of dies and wafers including specific
environmental options. The required environment and control for any product shall be
determined according to the exposure concern detailed in Tables 1 and 2.
For example, if oxygen is determined to be a possible concern for degradation of product over
the expected length of storage, then a storage environment should be selected that best
reduces the risk of long-term exposure to oxygen during storage.
This section details the different storage options commonly available.
4.2 Assembly data
Care should be taken that data or information required for subsequent processing of the
product, such as wafer maps, is useable after storage.
4.3 Prerequisite for storage
Only a product with a known status, including quality and functionality, shall be stored. If in
wafer form, the wafer should be inked or a wafer map should be stored in a way that can be
used at the end of LTS. Be aware that wafer maps on electronic media may not be retrievable
at the end of the storage period and backup methods should be periodically reviewed. It
should be noted that ink may also be a potential source of contamination and may require
evaluation for LTS.
Where initial 100 % test of the wafer cannot be performed, an alternative method shall be
used to determine the overall quality and functionality of the product to be stored. This may
include sample testing or qualification of an assembled sample of product representative of
the wafers being stored.
4.4 Damage to die products during long-term storage
Defects caused by mechanical damage may affect different regions of the die or wafer and
should be considered when designing long-term storage schemes.

– 10 – IEC 62435-5:2017 © IEC 2017
4.5 Mechanical storage conditions
In order to ensure adequate mechanical protection for die and wafers, care shall be taken in
the initial placement of products in storage containers and removal from these containers
after storage. Damage can easily occur during loading and unloading.
During storage, sufficient protection shall be given to the product to guard against movement
or vibration. Die or wafer orientation can be important, especially for MEMS or sensor
products, to minimize damage due to shock or vibration. Containers and shelving may require
anti-vibration or anti-resonance mounting. Packing material should be designed to offer some
degree of protection against shock or vibration.
Die and wafers shall not be inspected unless required under a specific sample programme in
order to minimize the amount of handling to which the die or wafers are subjected.
Material in contact with the wafer or die surface shall ensure that there is minimal abrasion
and adhesion of foreign matter to surfaces.
4.6 Long-term storage environment
These conditions are more stringent than those for short-term storage since the storage
environment is critical to successful long-term storage. Packing methods suggested here may
not be suitable for shipping, especially by air transportation.
This storage atmosphere is designed to exclude oxygen and limit humidity which are known
deterioration sources for unencapsulated semiconductor devices. Actual failure mechanisms
shall be determined according to the device being stored with reference to IEC 62435-2.
Cabinets or containers for long-term storage of die or wafers shall use the following conditions:
a) purge gas: 99 % nitrogen or inert gas (see 4.7);
b) temperature: 17 °C to 25 °C;
c) cabinet humidity: rH minimum of 7 %, maximum of 25 %;
d) pressure: slightly above ambient atmospheric pressure.
The gas pressure should be sufficiently high to prevent the ingress of external contaminants.
To control the relative humidity, it is normal for die and wafer storage environments to use
high-purity nitrogen, for example, derived from a liquid source.
Relative humidity should not fall below 7 % in order to prevent build-up of electrostatic fields
and should not exceed 25 % in order to prevent condensation and moisture ingress. This is
important after a storage cabinet has been opened; it is normal to fit a timed purge regulator
to rapidly bring the relative humidity back down after a cabinet has been opened.
Packing materials incorporating static shielding, such as metal foils, may also be used. Static
dissipative coatings shall not be used since these coatings may degrade during storage and
contaminate the die or wafers.
Temperature or humidity during the storage period shall be recorded and logged.
Out-of-limit temperature and humidity conditions shall be dealt with by appropriate corrective
action. It is unlikely that a few minor out-of-limit excursions will permanently degrade stored
products. However, these out-of-limit conditions shall be taken into account when the product
is taken out of storage for use.

4.7 Recommended inert atmosphere purity
When inert gas supply for the storage environment is selected, it shall satisfy the following:
• Better than 99,5 % purity containing
– less than 0,5 % oxygen,
– less than 0,01 % other gases,
-6
– less than 10 halides, and
-6
– less than 10 sulphurated gases.
4.8 Chemical contamination
Die and wafers shall be protected from ionic contamination of the active area or contamination
by other chemicals, bearing in mind the mobility of contaminants through semiconductor
materials and the possibility of induced intermetallic growths.
Special attention shall be given to the protection of contact areas, active areas and back side
contacts. Wafers such as those that use III-V materials are particularly sensitive and may
need special consideration.
Any degradable packing material used for die or wafer shipping shall be removed before
placing the bare die or wafers in a suitable container for long-term storage. In particular, any
packing items that could give rise to chemical or particulate contamination by long-term
degradation shall be removed, for example all paper, cardboard, foam or pink film. This shall
include any material that has been coated with a film to reduce static (ESD coated) since the
film will outgas during storage.
4.9 Vacuum packing
4.9.1 General
Vacuum packing is commonly used for shipping bare die and wafers. However, this method
may not be suitable for long-term storage due to the fact that a vacuum encourages ingress of
contaminants through packing materials and will degrade over time. Addition of desiccants
within the primary packing may cause minor particles to be present that could damage the
product.
In general, foam should not be used inside the vacuum pack since foam may release
absorbed contaminants when compressed. Nitrogen-filled, closed-cell foam does not have this
problem and may be used.
4.9.2 Vacuum dry pack
An industry recognised form of vacuum packing is a vacuum dry pack where a moisture
barrier bag is used to contain the primary packing unit of die and wafers, complete with
desiccant and HIC card. Light evacuation of the bag is preferred over full evacuation.
Refer to IEC 60749-20-1 for more information.
4.10 Positive pressure systems for packing
Packing methods that use positive pressure are inherently better than vacuum-sealed bags.
However, this requires good inlet filtering and is commonly implemented by initial vacuum
followed by back-fill with nitrogen to help keep major contaminants out.
4.11 Use of packing material having sacrificial properties
Packing materials are sometimes used that have sacrificial properties, for example the
packing material may contain reactive copper which is designed to corrode in preference to

– 12 – IEC 62435-5:2017 © IEC 2017
the die device. Other sacrificial materials, such as volatile corrosion inhibitors (VCI), may also
be used but often have issues related to high toxicity and environmental controls.
4.12 Use of bio-degradable material
Some packing material is deliberately bio-degradable, such as the foam commonly used in
wafer jars or tubs. Packing materials that are known to deteriorate over time shall not be used
since emission of chemicals during deterioration can contaminate the product.
Examples here include:
• sulphur from rubber bands;
• chlorine from cardboard and paper;
• fluorine from antistatic foam.
Some foams are designed specifically for long-term use and are not biodegradable, e.g.
closed-cell foams with nitrogen filling. If using a carbon-filled variant of this type of foam, take
care to ensure that the carbon is fixed in the material and cannot shed particles when
compressed or disturbed.
4.13 Plasma cleaning
Plasma cleaning may be used to remove any possible contamination of the surface of wafers
before they are stored, or may be used after storage to clean bond pads prior to assembly.
Surface cleanliness and adhesion may be monitored using a water droplet test. Plasma
process and gas shall be qualified for use on the wafers to be cleaned.
4.14 Electrical effects
Conductive or electro-static dissipative materials shall be used for packing materials and
storage cabinet construction as determined from susceptibility and mitigation analysis.
Possible damage due to ESD can be caused by using inappropriate packing materials, too low
RH or proximity to electro-static field sources. This can lead to p-n junction damage, oxide
breakdown/puncturing, sensitive parameter shifting, changed voltage threshold (V ) from
T
trapped surface state charge (QSS) charge or changed current-off/voltage-off I /V
off off
parameters.
4.15 Protection from radiation
Die exposure to illumination or radiation of any kind should be limited. Care should be taken
to ensure protection from nuclear radiation (high background), EMR (RF and microwave
sources), ultraviolet, X-ray radiation and ambient illumination. Some die types, such as
analogue devices, may be particularly sensitive.
Die storage areas are normally protected from sunlight and care should be taken to minimise
common sources of radiation from items such as mobile phones, wireless communication and
microwave ovens in the vicinity of the storage area.
4.16 Periodic qualification of stored die products
For long-term storage of individual dies, it is possible to qualify the condition of the stored
product by sample qualification. However, this may only be appropriate where large quantities
of individual die are stored since sample testing necessarily involves using up some of the
stored product. Where periodic qualification is required, additional die should be stored to
allow for this.
In this case, representative samples of the product should be removed from storage at
predetermined time intervals. The sample die shall be checked for any signs of damage or

deterioration and assembled into suitable packages for subsequent electrical tests and
reliability checks. The bondability of the die shall be assessed during assembly.
Care should be taken to avoid unnecessary disturbance of stored products. A balance should
be sought between the desire for periodic qualification and the need to maintain an
undisturbed storage environment.
Where it is undesirable to examine the condition of the stored product, qualification of the
packing may provide the required level of assurance.
To avoid opening and re-handling the stored material (which may be more damaging than
storage itself), periodic qualification tests should be performed on a dedicated batch that is
not intended to be used/sold at the end of the storage.
5 Long-term storage failure mechanisms
Failure mechanisms that may occur during long-term storage include:
• outgassing of packing materials causing ionic contamination;
• humidity infiltration of packing material causing metal corrosion;
• interactions between incompatible packing and/or IC materials causing hazardous
reactions;
• temperature cycling causing metal fatigue, solder creep or glassification crazing;
• improper handling causing cracking, scratches or contamination to die surfaces;
• non-specific electrical or radiation events in the atmosphere causing gate oxide and
metallization failures;
• piezo-electric effect – changing electrical parameters through in-built stress;
• photovoltaic effect – changing electrical parameters through imposed charge;
• electrical overstress caused by ESD or other sources of radiation.
6 LTS concerns, method, verification and limitations
6.1 General
This clause details the exposure concerns for wafers and dies and lists recommended
packaging methods, verification, suitable environment and storage time limitations according
to the particular exposure concern.
The exposure concern shall be determined in consultation with the original device
manufacturer and/or physical analysis of the product according to the expected duration of
LTS. It is recommended that IEC 62435-2 should be used to help determine which
mechanisms apply to the parts being stored and hence the particular exposure concern that
applies.
Refer to Clause 4 for details of the various packaging methods available.
6.2 Wafers
Table 1 lists the environmental factors that wafers are likely to be exposed to and the actions
to be taken to mitigate them.
– 14 – IEC 62435-5:2017 © IEC 2017
Table 1 – LTS exposure concerns for wafers
Exposure LTS LTS Environment / Storage Time Preconditions Contents
Concern Packaging Verification Specifications Limitation Verification
Method (see Key) Testing
Moisture MBB, HIC HIC (when B and C Based on HIC NA Inspection ;
when acceptable); results where Bondability
acceptable MBB seal applicable; (Wire) ;
integrity verification
Solderability
testing results
(C4 Solder)
Moisture Dry cabinet Atmosphere A verification NA
flow meter testing results
Oxygen N or inert gas Gas flow A verification NA
backfill meter; ppm O testing results
detection; O
sensors;
Oxygen MBB without O sensors; B and C verification NA
air MBB seal testing results
integrity
Outgassing N , inert gas, Gas flow meter A verification NA
or air dry testing results
cabinet
Outgassing MBB MBB seal B NA NA
integrity
The use of desiccant may be required for polymer based ILD or passivation layers; this should be evaluated for
the product and defined by the product requirements.
Key
A: Dry cabinet storage, typically oil-free air.
B: MBB storage,
C: Nitrogen (N ) backfill or positive-pressure MBB storage.
See IEC 62435-4: Storage (proposed)
Such as IEC 60749-3 for backside inspection or other applicable inspections.
Such as IEC 60749-22 for wirebond shear or related applicable testing.
Such as IEC 60749-20-1 or other applicable testing.

6.3 Bare dice
Table 2 lists the environmental factors that bare dice are likely to be exposed to and the
actions to be taken to mitigate them.

Table 2 – LTS exposure concerns for bare dice
Exposure LTS LTS Environment / Storage time Preconditions Contents
concern packaging verification specifications limitation verification
method (see Key) testing
Moisture MBB; HIC HIC (when B and C Based on HIC NA Inspection ;
when acceptable); results where bondability
acceptable; MBB seal applicable; (wire) ;
NOTE 2 integrity verification
Solderability
testing results
(C4 solder) ;
Moisture Dry cabinet Atmosphere A verification NA underfill /
adhesive
flow meter testing results
integrity
Oxygen N or inert gas Gas flow A verification NA
dry cabinet meter; ppm O testing results Inspection ;
detection; O
bondability
sensors; (wire) ;
Oxygen MBB without O sensors; B and C verification NA Solderability
air MBB seal testing results (C4 Solder)
integrity
Outgassing N , Inert gas, Gas flow meter A verification NA Inspection ;
or air dry testing results bondability
cabinet (wire) ;
Solderability
Outgassing MBB MBB seal B and C verification NA
(C4 solder) ;
integrity testing results
underfill /
adhesive
integrity
The use of desiccant may be required for polymer based ILD or passivation layers; this should be evaluated for
the product and defined by the product requirements.
Key
A: Dry cabinet storage, typically oil-free air.
B: MBB storage,
C: Nitrogen (N ) backfill or positive-pressure MBB storage.
See IEC 62435-4: Storage (proposed)
Such as IEC 60749-3 for backside inspection or other applicable inspections.
Such as IEC 60749-22 for wirebond shear or related applicable testing.
Such as IEC 60749-20-1 or other applicable testing.
Verification of underfill encapsulant or die attach adhesive integrity includes examination for delamination,
voiding, poor fillets, etc.
7 Deterioration mechanisms specific to bare die and wafers
7.1 Wire bondability
Wire bondability can be impacted by oxides and/or contamination. Proper storage procedures
are required to prevent moisture contamination from occurring.
7.2 Staining
Moisture-induced stains can be created during LTS on surfaces where the dry conditions have
been compromised. Contaminants including fluorine and chlorine have been shown to
enhance the creation of such stains. Stains can lead to aesthetic concerns as well as affect
visual marking legibility.
– 16 – IEC 62435-5:2017 © IEC 2017
7.3 Topside delamination
Moisture or chemical contamination of the surface of die may cause penetration of organic-
based passivation leading to swelling or delamination of the passivation layers. This effect
can normally be checked for by visual inspection.
8 Specific handling concerns
8.1 Die on wafer film frames
Die on wafer film frames can be subject to problems of removal from adhesives, which tend to
change adhesive strength over time. In cases of long storage, a residue of the adhesive can
remain on the rear of the die. This could be a reliability concern for dies in which the rear is
used for a thermal and/or electrical connection. An adhesive residue on the rear of the die can
prevent the formation of a complete solder joint or contaminate some thermal interface
materials, which in turn could degrade part or all of the thermal function and/or electrical
connection.
8.2 Devices and dice embossed or punched tape storage
Devices and die stored in embossed or punched tape may be subject to problems in removing
the cover tape due to changes in adhesive strength over time. Industry tape adhesion testing
(ASTM D 3330 or similar) can be used to evaluate changes in adhesive strength. Any LTS
methodology should take into account length of storage and temperature ranges to avoid
inducing issues.
8.3 Handling damage
Defects caused by handling, transportation, vibration, mechanical impact, or other mechanical
influences may affect susceptible regions of the wafer, die, or device and should be
considered when designing long-term storage soluti
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