IEC 62435-9:2021

IEC 62435-9 ®
Edition 1.0 2021-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electronic components – Long-term storage of electronic semiconductor
devices –
Part 9: Special cases
Composants électroniques – Stockage de longue durée des dispositifs
électroniques à semiconducteurs –
Partie 9: Cas particuliers
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IEC 62435-9 ®
Edition 1.0 2021-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electronic components – Long-term storage of electronic semiconductor

devices –
Part 9: Special cases
Composants électroniques – Stockage de longue durée des dispositifs

électroniques à semiconducteurs –

Partie 9: Cas particuliers
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020 ISBN 978-2-8322-1016-3

– 2 – IEC 62435-9:2021 © IEC 2021
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Component storage cases . 9
5 Storage of memory devices . 9
5.1 General . 9
5.2 Semiconductor memory device types . 9
6 Storage of other devices and partial assembly . 11
6.1 General . 11
6.2 Wafer-level chip-scale packages . 11
6.3 Heterogeneous devices. 12
6.4 Modules . 12
7 Storage in alternative environments . 12
7.1 General . 12
7.2 Alternative environments . 12
7.3 Storage environment effect on use reliability . 13
Annex A (informative)  Customer-supplier interaction . 14
Bibliography . 15

Table 1 – Example failure mechanisms and stimuli for memory devices . 10
Table A.1 – Supplier – customer interaction template. 14

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –

Part 9: Special cases
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62435-9 has been prepared by IEC technical committee 47: Semiconductor devices. It is
an International Standard.
The text of this International Standard is based on the following documents:
DRAFT Report on voting
47/2700/FDIS 47/2716/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 62435-9:2021 © IEC 2021
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62435 series, published under the general title Electronic
components – Long-term storage of electronic semiconductor devices, can be found on the IEC
website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
INTRODUCTION
This document applies to the long-term storage of electronic components in special cases of
configuration. The custom-client relationship for storage of all cases is also included.
This document deals with the long-term storage (LTS) of electronic devices drawing on the best
long-term storage practices currently known. For the purposes of this document, LTS is defined
as any device storage whose duration can be more than 12 months for product scheduled for
long duration storage. While intended to address the storage of unpackaged semiconductors
and packaged electronic devices, nothing in this document precludes the storage of other items
under the storage levels defined herein.
Although it has always existed to some extent, obsolescence of electronic components and
particularly of integrated circuits, has become increasingly intense over the last few years.
Indeed, with the existing technological boom, the commercial life of a component has become
very short compared with the life of industrial equipment such as that encountered in the
aeronautical field, the railway industry or the energy sector.
The many solutions enabling obsolescence to be resolved are now identified. However,
selecting one of these solutions should be preceded by a case-by-case technical and economic
feasibility study, depending on whether storage is envisaged for field service or production, for
example:
• remedial storage as soon as components are no longer marketed;
• preventive storage anticipating declaration of obsolescence.
Taking into account the expected life of some installations, sometimes covering several
decades, the qualification times, and the unavailability costs, which can also be very high, the
solution to be adopted to resolve obsolescence should often be rapidly implemented. This is
why the solution retained in most cases consists in systematically storing components which
are in the process of becoming obsolescent.
The technical risks of this solution are, a priori, fairly low. However, it requires perfect mastery
of the implemented process and especially of the storage environment, although this mastery
becomes critical when it comes to long-term storage. All handling, protection, storage and test
operations are recommended to be performed according to the state of the art.
The application of the approach proposed in this document in no way guarantees that the stored
components are in perfect operating condition at the end of this storage. It only comprises a
means of minimizing potential and probable degradation factors.
Some electronic device users have the need to store electronic devices for long periods of time.
Lifetime buys are commonly made to support production runs of assemblies that well exceed
the production timeframe of its individual parts. This puts the user in a situation requiring careful
and adequate storage of such parts to maintain the as-received solderability and minimize any
degradation effects to the part over time. Major degradation concerns are moisture, electrostatic
fields, ultra-violet light, large variations in temperature, air-borne contaminants, and outgassing.
Warranties and sparing also present a challenge for the user or repair agency as some systems
have been designated to be used for long periods of time, in some cases for up to 40 years or
more. Some of the devices needed for repair of these systems will not be available from the
original supplier for the lifetime of the system or the spare assembly may be built with the
original production run but then require long-term storage. This document was developed to
provide a standard for storing electronic devices for long periods of time.
The storage of devices that are moisture sensitive but that do not need to be stored for long
periods of time is dealt with in IEC TR 62258-3.

– 6 – IEC 62435-9:2021 © IEC 2021
Long-term storage assumes that the device is going to be placed in uninterrupted storage for a
number of years. It is essential that it be useable after storage. It is important that storage
media, the local environment and the associated part data be considered together.
Local environments for long term storage can be unique to the application or to the type of
subassembly being stored for further assembly. Different device types that are integrated into
a single package or module can have different storage requirements that should be considered
during long term storage. A product can contain a single die or multiple dice (example: a CMOS
processor, a GaN radio, sensors and a new type of memory). Each device technology can
impose storage requirements. For example: the memory can be removed from x-ray or high
magnetic field sources and the sensors can be stored in a dark environment or low-pressure
environment.
Such practice requires good communication interactions and agreements for storage that
should account for the possibility and complexity of intermediate assembly of heterogeneous
devices. Successful customer supplier interaction involves clear expectations for device
provenance, traceability and identification.
These guidelines do not imply any warranty of product or guarantee of operation beyond the
storage time given by the manufacturer.
The IEC 62435 series is intended to ensure that adequate reliability is achieved for devices in
user applications after long-term storage. Users are encouraged to request data from suppliers
to applicable specifications to demonstrate a successful storage life as requested by the user.
These standards are not intended to address built-in failure mechanisms that would take place
regardless of storage conditions.
These standards are intended to give practical guide to methods of long-duration storage of
electronic components where this is intentional or planned storage of product for a number of
years. Storage regimes for work-in-progress production are managed according to company
internal process requirements and are not detailed in IEC 62435 (all parts).
The overall standard is split into a number of parts. Parts 1 to 4 apply to any long-term storage
and contain general requirements and guidance, whereas Parts 5 to 9 are specific to the type
of product being stored.
The structure of the IEC 62435 series consists of the following:
– Part 1: General
– Part 2: Deterioration mechanisms
– Part 3: Data
– Part 4: Storage
– Part 5: Die and wafer devices
– Part 6: Packaged or finished devices
– Part 7: MEMS
– Part 8: Passive electronic devices
– Part 9: Special cases
ELECTRONIC COMPONENTS – LONG-TERM STORAGE
OF ELECTRONIC SEMICONDUCTOR DEVICES –

Part 9: Special cases
1 Scope
This part of IEC 62435 specifies storage practices encompassing silicon and semiconductor
device building blocks of all types that are integrated together to into products in the form of
either packages or boards that can be stored as fully assembled units or partial assemblies.
Special attention is given to memories as components and assemblies although methods also
apply to heterogeneous components. Guidelines and requirements for customer-supplier
interaction are provided to manage the complexity.
NOTE In IEC 62435 (all parts), the term "components" is used interchangeably with dice, wafers, passives and
packaged devices.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-192, International electrotechnical vocabulary – Part 192: Dependability
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
failure modes effects analysis
FMEA
quantitative method of analysis that involves the study of possible failure modes and faults in
sub items, and their effects at various indenture levels
[SOURCE: IEC 60050-192:2015, 192-11-05, modified – The deprecated terms have been
removed, "qualitative" has been changed to "quantitative" because formal methods call for
quantitative ranking of defined risks and the note has been removed.]
3.2
magnetoresistive random access memory
MRAM
non-volatile memory technology that uses electron spin domains to store information

– 8 – IEC 62435-9:2021 © IEC 2021
3.3
resistive random access memory
ReRAM
non-volatile memory technology that uses changes in the resistance of a solid-state dielectric
material to store information
Note 1 to entry: Resistive random access memory is often referred to as a "memristor".
3.4
ferroelectric random access memory
FeRAM
non-volatile memory technology that uses changes in the ferroelectric resistance of a solid-
state dielectric material to store information
Note 1 to entry: Ferroelectric random access memory is often referred to as a "memristor".
3.5
erasable programmable read-only
EPROMS
type of memory that stores and retains information when the device power supply is switched
off characterized as a non-volatile characteristic
3.6
flash memory storage
type of EEPROM memory that can be cleared only on blocks of memory or on a memory array
3.7
micro-electromechanical system
MEMS
system composed of one or more integrated microsized components, such as sensors,
actuators, transducers, resonators, oscillators, mechanical components, or electric circuits
Note 1 to entry: In the definition, "microsized" is used to mean a size of less than a few millimetres.
Note 2 to entry: Technologies relating to MEMS are extremely diverse and include fundamental technologies (such
as design, material, processing, functional element, system control, energy supply, bonding and assembly, electric
circuit, and evaluation), basic sciences (such as micro-science and engineering) as well as thermodynamics on a
micro-scale and microtribology.
Note 3 to entry: "MEMS" is the acronym of "micro-electromechanical systems", but was used in the past for "micro-
electromechanical device". The singular and plural forms of the term "MEMS" are identical.
[SOURCE: IEC 62047-1:2016, 2.1.1, modified – The preferred term "micro-electromechanical
device" has been replaced by "micro-electromechanical system" to reflect current usage. Note 1
to entry has been revised for clarity, and the second sentence has been transferred to Note 2
to entry.]
3.8
2,5 dimensional packaging
2.5D
silicon devices that are stacked upon each other or using package as part of the stacking
scheme
3.9
3 dimensional packaging
3D
silicon devices stacked upon one another and connected via through silicon vias

4 Component storage cases
Semiconductor storage encompasses a number of different types of devices in many forms that
challenge customer-supplier interactions. Silicon and semiconductor device building blocks of
all types are integrated together to into products in the form of either packages, modules or
boards that can be stored as fully assembled units or partial assemblies. The devices in a 2.5D
or 3D product can include, Si logic, semiconductor memory, power devices, radios and MEMs.
Storage at intermediate steps is a method to control costs and manage configurations or end
product features. Each device or subassembly can be procured from a different foundry or
assembly site. The storage risk assessment and mitigations shall consider all elements as
finished or in partial assembly.
Local environments for long term storage can be unique to the application or to the type of
subassembly being stored for further assembly. Different device types that are integrated into
a single package or module can have different storage requirements that should be considered
during long term storage. A product can contain a single die or multiple dice (example: a CMOS
processor, a GaN radio, sensors and a new type of memory). Each device technology can
impose storage requirements. For example, the memory can need to be removed from x-ray or
high magnetic field sources and the sensors can need storage in a dark environment or low-
pressure environment. The storage risk assessment should consider the unique storage
requirements of each device and the storage environment.
The customer supplier interactions and agreements for storage should account for the
possibility and complexity of intermediate assembly of heterogeneous devices. Successful
customer-supplier interaction involves clear expectations for device provenance, traceability
and identification.
5 Storage of memory devices
5.1 General
Storage of solid-state memory devices can impose additional considerations to long term
storage because of the different sensitivities in the storage environment and the different device
types. Another complicating factor to non-volatile memory storage is that components can be
stored in long duration with data written for later use after final assembly. The time between
read and write can be years. The risks associated with each memory shall be determined using
a standardized risk assessment process, e.g. FMEA per IEC 60050-192. Examples of known
interactions for different memory types are provided in Table 1 for reference. Similarly, Annex A
indicates examples of ownership that should be considered during documentation and business
agreements.
5.2 Semiconductor memory device types
A number of different types of memory exist with different sensitivities to the ambient
environment. Memories can use different types of substrates or different physical phenomena
to store charge or state. Historically memories have been known to have degraded ability to
store charge when stored in higher temperature environments. The same memories are also
sensitive to x-ray radiation to various degrees. Some memories utilize different mechanisms to
store data such as magnetic spin or alterations in resistance and changes in the materials
phases. Magnetic memories can be sensitive to high field environments while phase change
memories can have a sensitivity to other environmental factors experienced in storage.

– 10 – IEC 62435-9:2021 © IEC 2021
For long term storage of semiconductor memories, it is required to perform a failure modes
effects analysis to identify potential vulnerabilities during the storage duration. The risk
assessment FMEA should consider the storage environment including the proximity to x-ray
sources, shielding, magnetic fields and higher temperatures. The ambient storage environments
can be different than the standard storage environments given in IEC 60721-3-1 classification
1K21 which are used throughout the IEC 62435 series. Examples of temperature environments
are shown in Table 1 below. The storage scheme should be based upon the risk Assessment
FMEA with special care to ensure mitigations to mechanism stimuli for failure during or after
long term storage.
Table 1 – Example failure mechanisms and stimuli for memory devices
Failure Failure mechanism detail Failure mode Mechanism stimuli
mechanism
Popcorn effect High rate vapour expansion Open circuit, blistering, Temperature increase
within a package during package cracks leading to moisture vapour
surface mounting
Handling Cracking Open, short, visible crack Application of force
damage
Visible scratch/smudge Open, short, surface mark Mechanical abrasion
Device data Electro-magnetic current field Open, short, data corruption Electro-magnetic field
loss/damage induced short/open/error
High ionizing radiation Open, short, data corruption High-energy radiation, x-ray
induced open, short or error
Soft error resulting from Open, short or data Neutron particle hit
device damage – random corruption
Alpha particle emission hit
event
Charge loss in programmed
cell
Staining Change in surface Visible defect, non- Exposure resulting in aging,
residue appearance and specification conforming appearance and oxidation or hardening of
resulting from unplanned potential of misprocessing residue
exposure to oxidizing
contents
Polymer Polymer embrittlement Visible cracking, open or Temperature exposure,
residual mechanical stress
material aging shorting
and bright light
Storage media Tape on reel, tube Misalignment during Temperature exposure,
issues embrittlement/aging processing mechanical stressing and
bright light
Tray and tube aging Dropped parts from broken Temperature, handling and
embrittlement tray media or parts out of bright light
formed pocket
Box aging embrittlement Dropped parts Temperature and bright light
Opens or shorts from ESD
Foreign material
ESD coating degradations Opens or shorts from ESD Triboelectric charging or
charge potential difference
Label aging Illegible mark Bright light, temperature
Missing label Temperature and bright light
Brittle flaking – partial label Temperature and bright light

Failure Failure mechanism detail Failure mode Mechanism stimuli
mechanism
Indirect Moisture barrier bag leak Humidity indicator card Handling abrasion, bending
Material issues trigger, visual non- and shock events
conformance
Humidity indicator card Incorrect colour or no Temperature, humidity
inactivated moisture exposure indicated Exposure before use
Label aging Illegible mark Bright light, temperature
Missing label Temperature and bright light
Brittle flaking – partial label Temperature and bright light
Solderability Inability to form a good Post surface mount electrical Temperature, humidity
solder joint open exposure
Corrosion Electro-chemical reaction Open, short, visual non- Temperature, galvanic cell,
leading failure conformance chemical residue
Tin Whisker filament formed by Visual whiskers, short Bright tin (Sn) surface finish
dislocations in metal films (un-alloyed) crystal
whiskers
with a gradient in surface dislocation growth (in un-
mechanical stress. mitigated parts)
Sulphur gas catalysed
reaction
Wettability Passivation surface change Flux or adhesion change Surface energy change
Charge loss Capacitance charge loss or Bit error or addressing error Capacitance loss via leakage
loss of charge due to to collectors at temperature
mechanical stress. or in a field or as a result of
mechanical stress or space
charge and holes within the
cell or at the metal contacts.
Data External EMF or radiation Data corruption from field
Bit error or addressing error
corruption applied to the device results induced state change
in state change
6 Storage of other devices and partial assembly
6.1 General
Storage of devices in a partial state of assembly is now commonly practiced to enable various
product types or configurations and flexibility in the supply chain. A partial assembly can be a
chip that is attached to a package that can accommodate many chips in either 2.5D or 3D
configurations. Wafer-level chip scale packages with limited RDL can be stored for later use in
packages or boards. Another example to consider can be a flipchip on a BGA package that can
accommodate 3D memory devices, transceivers, wireless or other power devices. Similar
examples of die embedded into a package in a state of partial build up awaiting assembly to
memory, controllers or modems.
6.2 Wafer-level chip-scale packages
Wafer level chips are often stored before or after the deposition of RDL – redistribution layers
prior to use on packages, boards or in embedding. For storage of wafer-level CSPs, it is required
to complete a design failure modes effects analysis DFMEA and an FMEA (Risk Assessment)
that includes the environmental conditions of the storage room. IEC 62435-6 outlines common
risks and failure mechanisms that can be used in the risk assessment. WL-CSPs have been
observed to exhibit some common package level failure risks such as “popcorning” during next
assembly, next layer adhesion issues and WLCSP to board/package interconnect
contamination resulting in opens failures.

– 12 – IEC 62435-9:2021 © IEC 2021
6.3 Heterogeneous devices
Heterogeneous devices as “building-blocks” are often paired up with other devices in a multichip
package or chip-stack. Devices from different process generations, process types and 2.5D/3D
partial assemblies are used together on the same package or on a board. It is required to
complete a design failure modes effects analysis DFMEA and a risk assessment, e.g. FMEA
that includes the environmental conditions of the storage room. IEC 62435-6 outlines common
risks and failure mechanisms that can be used in the risk assessment. Heterogeneous devices
can exhibit risks for device(s) to package connection(s), adhesion/delamination or “pop-corning”
related failures during assembly and subsequent reliability testing.
6.4 Modules
Modules in the form of cards and small motherboards with connectors can be stored in either a
state or partial assembly or full assembly for field replacement. Module are constructed using
a superset of components from chips, to WL-CSPs and heterogeneous devices on a small
motherboard that can or cannot be contained within an enclosure. It is required to complete a
design failure modes effects analysis DFMA and a risk assessment e.g. FMEA that includes the
environmental conditions of the storage room. IEC 62435-6 outlines common risks and failure
mechanisms that can be used in the risk assessment. Failure modes for modules in partial or
complete storage can exhibit risks for device(s) to package(s) connection, adhesion /
delamination or “pop-corning” related failures during assembly and subsequent reliability testing.
Additional risks related to module connectors, oxidation/corrosion of connectors can exist and
should be included in the Risk Assessment FMEA. If MEMs devices are included in the module
care should be taken to assess the risk for pressure variation and other failure modes as
indicated in IEC 62435-7. Modules, if sealed in an enclosure, should consider the risk for
enclosure integrity and long-term reliability of the enclosure. Furthermore, modules can be
stored as field replacement units in uncontrolled environment and thus non-standard
environments should also be considered in the storage risk assessment.
7 Storage in alternative environments
7.1 General
Storage in environments other than those described by IEC 60721-3-1, environment 1K21 can
be used for special storage cases or cases in which it is too costly to maintain a well-controlled
environment. In such cases, it is required to survey, document and maintain the intended long-
term storage environment. Annex A indicates examples of ownership that should be considered
during documentation and business agreements. It is a good practice to include the survey in
the business agreement governing the storage facility.
7.2 Alternative environments
The alternative environments storage risk assessment FMEA should refer to IEC 62435-1 and
IEC 62435-6 along with the new environmental data to assess the risk for the altered
environment. The altered environment can be a mix of environments found in the IEC 60721
series of standards. It is required to complete a design failure modes effects analysis DFMEA
and a risk assessment FMEA that includes the environmental conditions of the storage room
ensuring that the storage conditions are not limited to only temperature and pressure as dust,
vibration and handling events can be of consequence over the long-term. IEC 62435-1 and
IEC 62435-6 outline common risks and failure mechanisms that can be used in the risk
assessment. It is also required to perform a risk assessment for the impact or interaction of the
new environment on the long-term use reliability of the devices or item under storage.

7.3 Storage environment effect on use reliability
When reliability models exist, they can be used to determine the reliability lifetime impact (life
reduction) of the storage environment. The entire lifetime of the part being assessed shall
include the reliability life of the part during storage and during intended use. If reliability models
for the part are not available, a risk assessment can be performed against the existing
qualification data and simple scaling durations can be required to add to the qualification
regiment of the component or device under test being stored.

– 14 – IEC 62435-9:2021 © IEC 2021
Annex A
(informative)
Customer-supplier interaction
Storage of memory, heterogeneous devices and/or devices in partial states of assembly are
complex and require assessment of the responsibilities between customer and supplying
company. Table A.1 provides a framework to assess the customer-supplier interaction.
Table A.1 – Supplier – customer interaction template
ITEM DESCRIPTION Responsibility
Customer Supplier
A Description of the needed storage environment for the device under Required
storage
B Qualification data for the device under storage Required
C Reliability report for reliability for the device under storage By request
D Description of the intended storage environment Required
E Risk assessment for the devices under storage with the supplier Required
F Life-time derating including storage time Required By request
G Failure modes Required By request
H FMEA Failure modes effects analysis for parts under storage Required By request
I Product traceability and test information per IEC 62435-3 Required By request
J Storage duration estimates for devices under storage Required
K Contract outlining the storage environment and handling Required
L Handling risks for devices under storage in factory storage media By request
M FMEA Failure modes effects analysis for parts under storage at the By request
subsequent assembly or final integration step

Bibliography
IEC 60721 (all parts), Classification of environmental conditions
IEC 60721-3-1, Classification of environmental conditions – Part 3-1: Classification of groups
of environmental parameters and their severities – Storage
IEC 60812, Failure modes and effects analysis (FMEA and FMECA)
IEC 62435 (all parts), Electronics components – Long-term storage of electronic semiconductor
devices
IEC 62435-1, Electronic components – Long-term storage of electronic semiconductor
devices – Part 1: General
IEC 62435-3, Electronic components – Long-term storage of electronic semiconductor
devices – Part 3: Data
IEC 62435-6, Electronic components – Long-term storage of electronic semiconductor
devices – Part 6: Packaged or finished devices
IEC 62435-7, Electronic components – Long-term storage of electronic semiconductor
devices – Part 7: Micro-electromechanical devices

___________
– 16 – IEC 62435-9:2021 © IEC 2021
SOMMAIRE
AVANT-PROPOS . 17
INTRODUCTION . 19
1 Domaine d’application . 22
2 Références normatives . 22
3 Termes et définitions . 22
4 Cas de stockage de composants . 24
5 Stockage des dispositifs de mémoire . 24
5.1 Généralités . 24
5.2 Types de dispositifs de mémoire à semiconducteurs . 25
6 Stockage d’autres dispositifs et ensemble partiel . 27
6.1 Généralités . 27
6.2 Boîtiers à puce au niveau de la plaquette . 27
6.3 Dispositifs hétérogènes . 27
6.4 Modules . 27
7 Stockage dans d’autres environnements . 28
7.1 Généralités . 28
7.2 Autres environnements . 28
7.3 Effets de l’environnement de stockage sur la fiabilité d’utilisation. 28
Annexe A (informative) Interaction client/fournisseur . 29
Bibliographie . 30

Tableau 1 – Exemples de mécanismes de défaillance et de stimuli pour les dispositifs
de mémoire . 25
Tableau A.1 – Modèle d’interaction client/fournisseur . 29

COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
___________
COMPOSANTS ÉLECTRONIQUES – STOCKAGE DE LONGUE DURÉE DES
DISPOSITIFS ÉLECTRONIQUES À SEMICONDUCTEURS –

Partie 9: Cas particuliers
AVANT-PROPOS
1) La Commission Electrotechnique Internationale (IEC) est une organisation mond
...