IEC 60747-16-3:2002
(Main)Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
IEC 60747-16-3:2002 provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency converters.
Dispositifs à semiconducteurs - Partie 16-3: Circuits intégrés hyperfréquences - Convertisseurs de fréquence
La CEI 60747-16-3:2002 spécifie de nouvelles méthodes de mesure, la terminologie et des symboles littéraux, ainsi que des valeurs limites et des caractéristiques essentielles pour les convertisseurs d'hyperfréquences à circuit intégré.
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INTERNATIONAL IEC
STANDARD
60747-16-3
First edition
2002-05
Semiconductor devices –
Part 16-3:
Microwave integrated circuits –
Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3:
Circuits intégrés hyperfréquences –
Convertisseurs de fréquence
Reference number
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
Consolidated editions
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edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
base publication incorporating amendment 1 and the base publication incorporating
amendments 1 and 2.
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INTERNATIONAL IEC
STANDARD
60747-16-3
First edition
2002-05
Semiconductor devices –
Part 16-3:
Microwave integrated circuits –
Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3:
Circuits intégrés hyperfréquences –
Convertisseurs de fréquence
IEC 2002 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue
– 2 – 60747-16-3 IEC:2002(E)
CONTENTS
FOREWORD.3
1 Scope.4
2 Normative references .4
3 Terms and definitions .4
4 Abbreviated terms .6
5 Essential ratings and characteristics.6
5.1 General .6
5.2 Application description .7
5.3 Specification of the function .8
5.4 Limiting values (absolute maximum rating system) .9
5.5 Operating conditions (within the specified operating temperature range) .11
5.6 Electrical characteristics.11
5.7 Mechanical and environmental ratings, characteristics and data.12
5.8 Additional information.12
6 Measuring methods .13
6.1 General .13
6.2 Conversion gain (G ) .14
c
6.3 Conversion gain flatness (ΔG ).16
c
6.4 LO/IF isolation (P /P ) .18
LO LO(IF)
6.5 LO/RF isolation (P /P ) .19
LO LO(RF)
6.6 RF/IF isolation.20
6.7 Image rejection (P /P ) .24
o o(im)
6.8 Sideband suppression (P /P ).26
o o(U)
6.9 Output power (P ).28
o
6.10 Output power at 1-dB conversion compression (P ) .29
o(1dB)
6.11 Noise figure (F) .30
6.12 Intermodulation distortion (P /P ).32
n 1
6.13 Output power at the intercept point (for intermodulation products) (P ) .35
n(IP)
6.14 LO port return loss (L ) .36
ret(LO)
6.15 RF port return loss (L ) .37
ret(RF)
6.16 IF port return loss (L ).39
ret(IF)
Figure 1 – Electrical terminal symbols.9
Figure 2 – Circuit diagram for the measurement of conversion gain .14
Figure 3 – Circuit diagram for the measurement of the LO/IF isolation .18
Figure 4 – Circuit diagram for the measurement of the LO/RF isolation.19
Figure 5 – Circuit diagram for the measurement of the RF/IF isolation for type A .21
Figure 6 – Circuit diagram for the measurement of the RF/IF isolation for type B .23
Figure 7 – Circuit diagram for measurement of noise figure .30
Figure 8 – Circuit for the measurement of intermodulation distortion .33
Figure 9 – Circuit for the measurement of the LO port return loss .36
Figure 10 – Circuit for the measurement of the RF/IF port return loss .38
Table 1 – Function of terminal.8
Table 2 – Electrical limiting values .10
Table 3 – Electrical characteristics.12
60747-16-3 IEC:2002(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-3: Microwave integrated circuits –
Frequency converters
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
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Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
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international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
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equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-3 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/212/FDIS 47E/219/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
The committee has decided that the contents of this publication will remain unchanged until
2008. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 4 – 60747-16-3 IEC:2002(E)
SEMICONDUCTOR DEVICES –
Part 16-3: Microwave integrated circuits –
Frequency converters
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave frequency
converters.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements
IEC 60747-1:1983, Semiconductor devices – Discrete devices and integrated circuits – Part 1:
General
IEC 60748-2:1997, Semiconductor devices – Integrated circuits – Part 2: Digital integrated
circuits
IEC 60748-3, Semiconductor devices – Integrated circuits – Part 3: Analogue integrated circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated circuits
3 Terms and definitions
For the purpose of this part of IEC 60747, the following terms and definitions apply:
3.1
conversion gain, G
c
ratio of the desired converted output power to the input power
NOTE Usually, the conversion gain is expressed in decibels.
3.2
conversion gain flatness, ΔΔΔΔG
c
difference between the maximum and the minimum conversion gain for a specified input
power in a specified frequency range
3.3
LO/RF isolation, P /P
LO LO(RF)
ratio of the incident local power to the local leakage power at the RF port with the IF port
terminated in a specified impedance
60747-16-3 IEC:2002(E) – 5 –
3.4
LO/IF isolation, P /P
LO LO(IF)
ratio of the incident local power to the local leakage power at the IF port with the RF port
terminated in a specified impedance
3.5
RF/IF isolation, P /P
RF RF(IF)
ratio of the incident RF power to the RF feedthrough power at the IF port for a specified
local power
NOTE Usually, the RF/IF isolation is applied to the down-converter.
3.6
IF/RF isolation, P /P
IF IF(RF)
ratio of the incident IF power to the IF feedthrough power at the RF port for a specified
local power
NOTE Usually, the IF/RF isolation is applied to the up-converter.
3.7
image rejection, P /P
o o(im)
ratio of the output power when the RF signal is applied, to the output power when the image
signal is applied
NOTE Usually, the image rejection is applied to the down-converter.
3.8
sideband suppression, P /P
o o(U)
ratio of the output power of the desired sideband to the output power of the undesired
sideband
NOTE Usually, the sideband suppression is applied to the up-converter.
3.9
LO port return loss, L
ret(LO)
ratio of the specified incident power at the LO port to the reflected power at the LO port, with
the RF port and the IF port terminated in each specified impedance
3.10
RF port return loss, L
ret(RF)
ratio of the incident power at the RF port to the reflected power at the RF port for a specified
local power, with the IF port terminated in a specified impedance
3.11
IF port return loss, L
ret(IF)
ratio of the incident power at the IF port to the reflected power at the IF port for a specified
local power, with the RF port terminated in a specified impedance
3.12
output power, P
o
see IEC
...
IEC 60747-16-3 ®
Edition 1.2 2017-08
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters
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IEC 60747-16-3 ®
Edition 1.2 2017-08
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-4749-5
IEC 60747-16-3 ®
Edition 1.2 2017-08
CONSOLIDATED VERSION
REDLINE VERSION
colour
inside
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters
– 2 – IEC 60747-16-3:2002+AMD1:2009
+AMD2:2017 CSV © IEC 2017
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Abbreviated terms . 8
5 Essential ratings and characteristics . 9
5.1 General . 9
5.2 Application description . 9
5.3 Specification of the function . 10
5.4 Limiting values (absolute maximum rating system) . 12
5.5 Operating conditions (within the specified operating temperature range) . 14
5.6 Electrical characteristics . 14
5.7 Mechanical and environmental ratings, characteristics and data . 15
5.8 Additional information . 15
6 Measuring methods . 16
6.1 General . 16
6.2 Conversion gain (G ) . 17
c
6.3 Conversion gain flatness (∆G ) . 19
c
6.4 LO/IF isolation (P /P ) . 21
LO LO(IF)
6.5 LO/RF isolation (P /P ) . 22
LO LO(RF)
6.6 RF/IF, IF/RF isolation . 24
6.7 Image rejection (P /P ) . 28
o o(im)
6.8 Sideband suppression (P ) . 29
/P
o o(U)
6.9 Output power (P ) . 31
o
6.10 Output power at 1-dB conversion compression (P ) . 32
o(1dB)
6.11 Noise figure (F) . 33
6.12 Intermodulation distortion (P /P ) . 35
n 1
6.13 Output power at the intercept point (for intermodulation products) (P ) . 38
n(IP)
6.14 LO port return loss (L ) . 39
ret(LO)
6.15 RF port return loss (L ) . 40
ret(RF)
6.16 IF port return loss (L ) . 42
ret(IF)
Bibliography . 44
Figure 1 – Electrical terminal symbols . 11
Figure 2 – Circuit diagram for the measurement of conversion gain . 17
Figure 3 – Circuit diagram for the measurement of the LO/IF isolation . 21
Figure 4 – Circuit diagram for the measurement of the LO/RF isolation . 23
Figure 5 – Circuit diagram for the measurement of the RF/IF isolation for type A . 24
Figure 6 – Circuit diagram for the measurement of the RF/IF IF/RF isolation for type B . 26
Figure 7 – Circuit diagram for measurement of noise figure . 33
Figure 8 – Circuit for the measurement of intermodulation distortion . 36
Figure 9 – Circuit for the measurement of the LO port return loss . 39
Figure 10 – Circuit for the measurement of the RF/IF port return loss . 41
+AMD2:2017 CSV © IEC 2017
Table 1 – Function of terminals . 11
Table 2 – Electrical limiting values . 13
Table 3 – Electrical characteristics . 15
– 4 – IEC 60747-16-3:2002+AMD1:2009
+AMD2:2017 CSV © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-3: Microwave integrated circuits –
Frequency converters
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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This consolidated version of the official IEC Standard and its amendments has been prepared
for user convenience.
IEC 60747-16-3 edition 1.2 contains the first edition (2002-05) [documents 47E/212/FDIS and
47E/219/RVD], its amendment 1 (2009-03) [documents 47E/357/CDV and 47E/372/RVC] and its
amendment 2 (2017-08) [documents 47E/545/CDV and 47E/562/RVC].
In this Redline version, a vertical line in the margin shows where the technical
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deletions are in strikethrough red text. A separate Final version with all changes
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+AMD2:2017 CSV © IEC 2017
International Standard IEC 60747-16-3 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date,
the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
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– 6 – IEC 60747-16-3:2002+AMD1:2009
+AMD2:2017 CSV © IEC 2017
SEMICONDUCTOR DEVICES –
Part 16-3: Microwave integrated circuits –
Frequency converters
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter sym
...
IEC 60747-16-3 ®
Edition 1.0 2002-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3: Circuits intégrés hyperfréquences – Convertisseurs de fréquence
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IEC 60747-16-3 ®
Edition 1.0 2002-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3: Circuits intégrés hyperfréquences – Convertisseurs de fréquence
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
W
CODE PRIX
ICS 31.080.99 ISBN 978-2-88910-279-2
– 2 – 60747-16-3 © IEC:2002
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references .6
3 Terms and definitions .6
4 Abbreviated terms .8
5 Essential ratings and characteristics.8
5.1 General .8
5.2 Application description .9
5.3 Specification of the function .10
5.4 Limiting values (absolute maximum rating system) .11
5.5 Operating conditions (within the specified operating temperature range) .13
5.6 Electrical characteristics.13
5.7 Mechanical and environmental ratings, characteristics and data.14
5.8 Additional information.14
6 Measuring methods .15
6.1 General .15
6.2 Conversion gain (G ) .16
c
6.3 Conversion gain flatness (ΔG ).18
c
6.4 LO/IF isolation (P /P ) .20
LO LO(IF)
6.5 LO/RF isolation (P /P ).21
LO LO(RF)
6.6 RF/IF isolation.22
6.7 Image rejection (P /P ).26
o o(im)
6.8 Sideband suppression (P /P ) .28
o o(U)
6.9 Output power (P ) .30
o
6.10 Output power at 1-dB conversion compression (P ) .31
o(1dB)
6.11 Noise figure (F) .32
6.12 Intermodulation distortion (P /P ) .34
n 1
6.13 Output power at the intercept point (for intermodulation products) (P ) .37
n(IP)
6.14 LO port return loss (L ) .38
ret(LO)
6.15 RF port return loss (L ) .39
ret(RF)
6.16 IF port return loss (L ).41
ret(IF)
Figure 1 – Electrical terminal symbols.11
Figure 2 – Circuit diagram for the measurement of conversion gain .16
Figure 3 – Circuit diagram for the measurement of the LO/IF isolation .20
Figure 4 – Circuit diagram for the measurement of the LO/RF isolation.21
Figure 5 – Circuit diagram for the measurement of the RF/IF isolation for type A .23
Figure 6 – Circuit diagram for the measurement of the RF/IF isolation for type B .25
Figure 7 – Circuit diagram for measurement of noise figure .32
Figure 8 – Circuit for the measurement of intermodulation distortion .35
Figure 9 – Circuit for the measurement of the LO port return loss .38
Figure 10 – Circuit for the measurement of the RF/IF port return loss .40
Table 1 – Function of terminals.10
60747-16-3 © IEC:2002 – 3 –
Table 2 – Electrical limiting values .12
Table 3 – Electrical characteristics.14
– 4 – 60747-16-3 © IEC:2002
INTERNATIONAL ELECTROTECHNICAL COMMISSION
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SEMICONDUCTOR DEVICES –
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FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-16-3 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This bilingual version, published in 2010-03, corresponds to the English version.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/212/FDIS 47E/219/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
60747-16-3 © IEC:2002 – 5 –
...
IEC 60747-16-3 ®
Edition 1.2 2017-08
CONSOLIDATED
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Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3: Circuits intégrés hyperfréquences – Convertisseurs de fréquence
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IEC 60747-16-3 ®
Edition 1.2 2017-08
CONSOLIDATED
VERSION
VERSION
CONSOLIDÉE
colour
inside
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3: Circuits intégrés hyperfréquences – Convertisseurs de fréquence
INTERNATIONAL
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COMMISSION
COMMISSION
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INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-7320-3
IEC 60747-16-3 ®
Edition 1.2 2017-08
REDLINE VERSION
VERSION REDLINE
colour
inside
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3: Circuits intégrés hyperfréquences – Convertisseurs de fréquence
– 2 – IEC 60747-16-3:2002+AMD1:2009
+AMD2:2017 CSV © IEC 2017
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Abbreviated terms . 8
5 Essential ratings and characteristics . 9
5.1 General . 9
5.2 Application description . 9
5.3 Specification of the function . 10
5.4 Limiting values (absolute maximum rating system) . 12
5.5 Operating conditions (within the specified operating temperature range) . 14
5.6 Electrical characteristics . 14
5.7 Mechanical and environmental ratings, characteristics and data . 15
5.8 Additional information . 15
6 Measuring methods . 16
6.1 General . 16
6.2 Conversion gain (G ) . 17
c
6.3 Conversion gain flatness (∆G ) . 19
c
6.4 LO/IF isolation (P /P ) . 21
LO LO(IF)
6.5 LO/RF isolation (P /P ) . 22
LO LO(RF)
6.6 RF/IF, IF/RF isolation . 24
6.7 Image rejection (P /P ) . 28
o o(im)
6.8 Sideband suppression (P /P ) . 29
o o(U)
6.9 Output power (P ) . 31
o
6.10 Output power at 1-dB conversion compression (P ) . 32
o(1dB)
6.11 Noise figure (F) . 33
6.12 Intermodulation distortion (P /P ) . 35
n 1
6.13 Output power at the intercept point (for intermodulation products) (P ) . 38
n(IP)
6.14 LO port return loss (L ) . 39
ret(LO)
6.15 RF port return loss (L ) . 40
ret(RF)
6.16 IF port return loss (L ) . 42
ret(IF)
Bibliography . 44
Figure 1 – Electrical terminal symbols . 11
Figure 2 – Circuit diagram for the measurement of conversion gain . 17
Figure 3 – Circuit diagram for the measurement of the LO/IF isolation . 21
Figure 4 – Circuit diagram for the measurement of the LO/RF isolation . 23
Figure 5 – Circuit diagram for the measurement of the RF/IF isolation for type A . 24
Figure 6 – Circuit diagram for the measurement of the RF/IF IF/RF isolation for type B . 26
Figure 7 – Circuit diagram for measurement of noise figure . 33
Figure 8 – Circuit for the measurement of intermodulation distortion . 36
Figure 9 – Circuit for the measurement of the LO port return loss . 39
Figure 10 – Circuit for the measurement of the RF/IF port return loss . 41
+AMD2:2017 CSV © IEC 2017
Table 1 – Function of terminals . 11
Table 2 – Electrical limiting values . 13
Table 3 – Electrical characteristics . 15
– 4 – IEC 60747-16-3:2002+AMD1:2009
+AMD2:2017 CSV © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
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Frequency converters
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of
...
IEC 60747-16-3 ®
Edition 1.1 2010-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3: Circuits intégrés hyperfréquences – Convertisseurs de fréquence
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INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-3: Microwave integrated circuits – Frequency converters
Dispositifs à semiconducteurs –
Partie 16-3: Circuits intégrés hyperfréquences – Convertisseurs de fréquence
INTERNATIONAL
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PRICE CODE
INTERNATIONALE
CN
CODE PRIX
ICS 31.080.99 ISBN 978-2-88910-282-2
– 2 – 60747-16-3 © IEC:2002+A1:2009
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references .6
3 Terms and definitions .7
4 Abbreviated terms .8
5 Essential ratings and characteristics.8
5.1 General .8
5.2 Application description .9
5.3 Specification of the function .10
5.4 Limiting values (absolute maximum rating system) .12
5.5 Operating conditions (within the specified operating temperature range) .14
5.6 Electrical characteristics.14
5.7 Mechanical and environmental ratings, characteristics and data.15
5.8 Additional information.15
6 Measuring methods .16
6.1 General .16
6.2 Conversion gain (G ) .17
c
6.3 Conversion gain flatness (ΔG ).19
c
6.4 LO/IF isolation (P /P ) .21
LO LO(IF)
6.5 LO/RF isolation (P /P ).22
LO LO(RF)
6.6 RF/IF isolation.24
6.7 Image rejection (P /P ).28
o o(im)
6.8 Sideband suppression (P /P ) .29
o o(U)
6.9 Output power (P ) .31
o
6.10 Output power at 1-dB conversion compression (P ) .32
o(1dB)
6.11 Noise figure (F) .33
6.12 Intermodulation distortion (P /P ) (P /P ) .35
1 n
n 1
6.13 Output power at the intercept point (for intermodulation products) (P ) .38
n(IP)
6.14 LO port return loss (L ) .39
ret(LO)
6.15 RF port return loss (L ) .40
ret(RF)
6.16 IF port return loss (L ).42
ret(IF)
Figure 1 – Electrical terminal symbols.11
Figure 2 – Circuit diagram for the measurement of conversion gain .17
Figure 3 – Circuit diagram for the measurement of the LO/IF isolation .21
Figure 4 – Circuit diagram for the measurement of the LO/RF isolation.23
Figure 5 – Circuit diagram for the measurement of the RF/IF isolation for type A .24
Figure 6 – Circuit diagram for the measurement of the RF/IF isolation for type B .26
Figure 7 – Circuit diagram for measurement of noise figure .33
Figure 8 – Circuit for the measurement of intermodulation distortion .36
Figure 9 – Circuit for the measurement of the LO port return loss .39
Figure 10 – Circuit for the measurement of the RF/IF port return loss .41
60747-16-3 © IEC:2002+A1:2009 – 3 –
Table 1 – Function of terminals.11
Table 2 – Electrical limiting values .13
Table 3 – Electrical characteristics.15
– 4 – 60747-16-3 © IEC:2002+A1:2009
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-3: Microwave integrated circuits –
Frequency converters
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
This consolidated version of IEC 60747-16-3 consists of the first edition (2002)
[documents 47E/212/FDIS and 47E/219/RVD] and its amendment 1 (2009) [documents
47E/357/CDV and 47E/372/RVC]. It bears the edition number 1.1.
The technical content is therefore identical to the base edition and its amendment and
has been prepared for user convenience. A vertical line in the margin shows where the
base publication has been modified by amendment 1. Additions and deletions are
displayed in red, with deletions being struck through.
...
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