Semiconductor devices - Part 5-14: Optoelectronic devices - Light emitting diodes - Test method of the surface temperature based on the thermoreflectance method

IEC 60747-5-14:2022(E) specifies the measuring method of the surface temperature of single LED die or package, based on the thermoreflectance (TR) method. TR is the effect that the reflectance of light changes with the temperature of a substance. This part measures relative change in the reflectance of light from a metal film deposited nearby on the metallurgical pn junction as the relative change in the LED junction temperature. The surface temperature can be approximated as the junction temperature when the thermal resistance effect between the metal surface and the pn junction is negligibly small.

General Information

Status
Published
Publication Date
03-Mar-2022
Current Stage
PPUB - Publication issued
Start Date
01-Apr-2022
Completion Date
04-Mar-2022
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IEC 60747-5-14:2022 - Semiconductor devices - Part 5-14: Optoelectronic devices - Light emitting diodes - Test method of the surface temperature based on the thermoreflectance method
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IEC 60747-5-14 ®
Edition 1.0 2022-03
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 5-14: Optoelectronic devices – Light emitting diodes – Test method of the
surface temperature based on the thermoreflectance method

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IEC 60747-5-14 ®
Edition 1.0 2022-03
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 5-14: Optoelectronic devices – Light emitting diodes – Test method of the

surface temperature based on the thermoreflectance method

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-1085-1

– 2 – IEC 60747-5-14:2022 © IEC 2022
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions and abbreviated terms . 5
3.1 Terms and definitions . 5
3.2 Abbreviated terms . 7
4 Measuring methods . 7
4.1 Basic requirements . 7
4.1.1 Measuring conditions . 7
4.1.2 Measuring instruments and equipment . 7
4.2 Purpose . 7
4.3 Measurement . 8
4.3.1 Measurement setup . 8
4.3.2 Measurement principle. 9
4.3.3 Measurement sequence . 12
5 Test report . 13
Annex A (informative) Measurement of the thermoreflectance coefficient of a standard
metal film . 15
Annex B (informative) Test example. 16
Annex C (informative) Junction temperatures measured by different methods . 19
Bibliography . 21

Figure 1 – Schematic diagram of the TR setup . 8
Figure 2 – Schematic illustration of measuring the thermoreflectance coefficient,
surface temperature, and junction temperature by the TR effect . 10
Figure 3 – Sequence of the measurement of the junction temperature using the TR
method . 13
Figure A.1 – Experimental result of thermoreflectance coefficient of a standard Au film . 15
Figure B.1 – Photograph of a sample prepared for the junction temperature
measurements . 17
Figure B.2 – Junction temperature measured by the TR method of the sample shown in
Figure B.1 . 17
Figure C.1 – Junction temperature increase with forward current, measured by the
methods of forward voltage, thermocouple, and thermoreflectance of the sample shown
in Figure B.1 . 20

Table 1 – Summary of test report . 14
Table B.1 – Summary of test report in example . 18

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 5-14: Optoelectronic devices – Light emitting diodes –
Test method of the surface temperature based on
the thermoreflectance method
FOREWORD
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IEC 60747-5-14 has been prepared by subcommittee 47E: Discrete semiconductor devices, of
IEC technical committee 47: Semiconductor devices. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47E/773/FDIS 47E/784/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 60747-5-14:2022 © IEC 2022
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A list of all parts in the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
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SEMICONDUCTOR DEVICES –
Part 5-14: Optoelectronic devices – Light emitting diodes –
Test method of the surface temperature based on
the thermoreflectance method
1 Scope
This part of IEC 60747-5 specifies the measuring method of the surface temperature of single
LED die or package, based on the thermoreflectance (TR) method. TR is the effect that the
reflectance of light changes with the temperature of a substance. This part measures relative
change in the reflectance of light from a metal film deposited nearby on the metallurgical pn
junction as the relative change in the LED junction temperature. The surface temperature can
be approximated as the junction temperature when the thermal resistance effect between the
metal surface and the pn junction is negligibly small.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60747-5-6:2021, Semiconductor devices – Part 5-6: Optoelectronic devices – Light emitting
diodes
3 Terms, definitions and abbreviated terms
For the purposes of this document, the terms and definitions given in IEC 60747-5-6 and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1 Terms and definitions
3.1.1
sample
measurement object consisting of an LED die and a metal (or any reflective) film formed on the
surface of the LED die or package
3.1.2
ambient temperature
T
a
temperature at or near the metal film specified for the purpose of the TR method


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